公开(公告)号：JP2008141211A

公开(公告)日：2008-06-19

申请号：JP2007332975

申请日：2007-12-25

Applicant: Formfactor Inc ,  フォームファクター, インコーポレイテッド

Inventor： KHANDROS IGOR Y ,  PEDERSEN DAVID V

IPC: G01R31/26 ,  H01L21/66 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  G01R31/30 ,  H01H1/00 ,  H01L21/60 ,  H01L23/32 ,  H01L23/48 ,  H01L23/485 ,  H01L23/498 ,  H05K3/20 ,  H05K3/34 ,  H05K3/40

CPC classification number: H01L23/49811 ,  G01R1/06716 ,  G01R1/06744 ,  G01R1/07342 ,  G01R3/00 ,  G01R31/287 ,  G01R31/2884 ,  G01R31/2889 ,  H01H1/0036 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06136 ,  H01L2224/11 ,  H01L2224/13 ,  H01L2224/45144 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K3/20 ,  H05K3/3421 ,  H05K3/4015 ,  H01L2924/00 ,  H01L2224/13099 ,  H01L2924/00012

Abstract: PROBLEM TO BE SOLVED: To provide a technology for performing a wafer-level burn-in and test. SOLUTION: The invention includes a test substrate 108 having active electronic components 106a to 106d, and metallic spring contact elements 110 effecting interconnections with a plurality of devices DUTs 102a to 102d to be tested on a wafer 104 to be tested. The test substrate 108 receives a plurality of signals for testing the DUTs 102a to 102d over relatively few signal lines from a host controller 116 and transmits these signals over relatively many interconnections between the test substrate 108 and the DUTs 102a to 102d. COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：提供进行晶片级老化和测试的技术。 解决方案：本发明包括具有有源电子部件106a至106d的测试基板108和与要测试的晶片104上要测试的多个器件DUT 102a至102d进行互连的金属弹簧接触元件110。 测试基板108通过相对较少的来自主机控制器116的信号线接收用于测试DUT 102a至102d的多个信号，并且在测试基板108和DUT 102a至102d之间的相对较多的互连上发送这些信号。 版权所有（C）2008，JPO＆INPIT

公开(公告)号：JP2007201471A

公开(公告)日：2007-08-09

申请号：JP2007013166

申请日：2007-01-23

Applicant: Formfactor Inc ,  フォームファクター, インコーポレイテッド

Inventor： ELDRIDGE BENJAMIN N ,  KHANDROS IGOR Y ,  PEDERSEN DAVID V ,  WHITTEN RALPH G

IPC: G01R1/06 ,  H01L21/66 ,  G01R1/073 ,  G01R31/28 ,  G01R31/3183 ,  H01L21/822 ,  H01L23/544 ,  H01L27/04

CPC classification number: H01L22/34 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/14 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a design and a test method that break a linear relationship between a fault detection range or testability and costs of testing or producing a design. SOLUTION: A test assembly 2000 is designed for testing product circuitry of a product die 2011. In one embodiment, the test assembly comprises a test die 2010 and an interconnection substrate 2008 for electrically connecting the test die to a host controller 2002. The test die can be designed according to a design methodology for a test die and a product die that includes a step of concurrently designing test circuitry and product circuitry in a unified design. COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：提供破坏故障检测范围或可测试性与测试或生产设计成本之间的线性关系的设计和测试方法。 解决方案：测试组件2000被设计用于测试产品模具2011的产品电路。在一个实施例中，测试组件包括测试模具2010和用于将测试模具电连接到主机控制器2002的互连衬底2008。 测试模具可以根据用于测试模具和产品模具的设计方法进行设计，其包括在统一设计中同时设计测试电路和产品电路的步骤。 版权所有（C）2007，JPO＆INPIT

公开(公告)号：JP2007132950A

公开(公告)日：2007-05-31

申请号：JP2007000149

申请日：2007-01-04

Applicant: Formfactor Inc ,  フォームファクター, インコーポレイテッド

Inventor： KHANDROS IGOR Y ,  MATHIEU GAETAN L ,  ELDRIDGE BENJAMIN N ,  GRUBE GARY W

IPC: G01R1/073 ,  B23K1/00 ,  B23K20/00 ,  B23K31/02 ,  C23C18/16 ,  C25D5/08 ,  C25D5/16 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/04 ,  G01R1/06 ,  G01R1/067 ,  G01R31/26 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/58 ,  H01L21/60 ,  H01L21/603 ,  H01L21/607 ,  H01L21/66 ,  H01L21/68 ,  H01L23/02 ,  H01L23/12 ,  H01L23/32 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L25/07 ,  H01L25/16 ,  H01L25/18 ,  H01R9/00 ,  H01R12/71 ,  H01R13/05 ,  H01R13/24 ,  H01R29/00 ,  H01R33/74 ,  H01R33/76 ,  H01R107/00 ,  H05H1/18 ,  H05K1/14 ,  H05K1/18 ,  H05K3/20 ,  H05K3/24 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K7/10

CPC classification number: H05K7/1069 ,  B23K1/0016 ,  B23K20/004 ,  B23K2201/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R1/07371 ,  G01R1/07378 ,  G01R31/2884 ,  G01R31/2886 ,  G01R31/2889 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/67138 ,  H01L22/20 ,  H01L23/32 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/05599 ,  H01L2224/05647 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/29111 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45111 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/456 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H01R13/2407 ,  H01R13/2464 ,  H05K1/141 ,  H05K3/20 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/01013 ,  H01L2924/01026 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/48 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/00012 ,  H01L2924/20751 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/00015 ,  H01L2924/2075

Abstract: PROBLEM TO BE SOLVED: To provide a technique for applying a probe to a semiconductor element capable of an orientation of an edge of a probe element, without altering a position of a probe card. SOLUTION: The probe card assembly comprises an upper surface, a lower surface, and the probe card (electronic component) having a plurality of terminals on the upper surface: the upper surface, the lower surface and an intervention body (electronic component) which has the first plural contact structures with a restoring property extending from the terminals at the lower surface and the second plural contact structures with the restoring property extending from the terminals at the upper surface: the upper surface, the lower surface, an interval converter which has the plural contact pads (terminal) mounted at the lower surface and the third contact structures (probe element) with the restoring property extending from the terminals at the upper surface. COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：提供一种用于将探针施加到能够探测元件的边缘的取向的半导体元件的技术，而不改变探针卡的位置。 解决方案：探针卡组件包括上表面，下表面和在上表面上具有多个端子的探针卡（电子部件）：上表面，下表面和干涉体（电子部件 ），其具有第一多个接触结构，具有从下表面的端子延伸的恢复特性和具有从上表面的端子延伸的恢复特性的第二多个接触结构：上表面，下表面，间隔转换器 其具有安装在下表面的多个接触垫（端子）和具有从上表面的端子延伸的恢复特性的第三接触结构（探针元件）。 版权所有（C）2007，JPO＆INPIT

公开(公告)号：JP2006013526A

公开(公告)日：2006-01-12

申请号：JP2005201965

申请日：2005-07-11

Applicant: Formfactor Inc ,  フォームファクター,インコーポレイテッド

Inventor： PEDERSEN DAVID V ,  ELDRIDGE BENJAMIN N ,  KHANDROS IGOR Y

IPC: H01L23/32 ,  H05K1/18 ,  B23K1/00 ,  B23K20/00 ,  C23C18/16 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R31/01 ,  G01R31/26 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/603 ,  H01L21/66 ,  H01L23/04 ,  H01L23/12 ,  H01L23/13 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L25/16 ,  H05K1/14 ,  H05K3/20 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40

CPC classification number: H01L25/16 ,  B23K1/0016 ,  B23K20/004 ,  B23K2201/40 ,  C25D5/08 ,  C25D5/22 ,  C25D21/02 ,  G01R1/0408 ,  G01R1/0433 ,  G01R1/06711 ,  G01R1/07342 ,  G01R1/07378 ,  G01R31/01 ,  G01R31/2863 ,  G01R31/2886 ,  G01R31/2889 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/04 ,  H01L23/13 ,  H01L23/32 ,  H01L23/49811 ,  H01L23/5385 ,  H01L24/06 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L2223/54473 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/45144 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/19043 ,  H05K1/141 ,  H05K3/20 ,  H05K3/325 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4015 ,  H05K2201/09472 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/48

Abstract: PROBLEM TO BE SOLVED: To provide a product and an assembly for receiving a long and thin mutual contact element such as a spring contact element extending from an electronic part such as a semiconductor device. SOLUTION: A capture pad is provided in a socket board for receiving an end part of a long and thin mutual contact element extending from an electronic part. The structures of various capture pads are disclosed. A fixing device such as a housing surely positions the electronic part on the socket board. Connection to an external device is carried out through a conductive trace adjacent to the surface of the socket board. The socket board can be supported by a support board. In a particularly preferred embodiment, the capture pad is directly formed on a primary substrate such as a printed circuit board. COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种产品和组件，用于接收诸如从诸如半导体器件的电子部件延伸的弹簧接触元件的长而薄的相互接触元件。 解决方案：捕获垫设置在插座板中，用于接收从电子部件延伸的长而薄的相互接触元件的端部。 公开了各种捕获垫的结构。 诸如外壳之类的固定装置将电子部件确定地定位在插座板上。 通过邻近插座板表面的导电迹线与外部设备连接。 插座板可以由支撑板支撑。 在特别优选的实施例中，捕获垫直接形成在诸如印刷电路板的初级衬底上。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP2003232809A

公开(公告)日：2003-08-22

申请号：JP2002367883

申请日：2002-12-19

Applicant: FORMFACTOR INC

Inventor： KHANDROS IGOR Y ,  ELDRIDGE BENJAMIN N ,  MATHIEU GAETAN L ,  GARY W GRUBE

IPC: G01R1/073 ,  G01R1/067 ,  G01R3/00 ,  G01R31/28 ,  G01R31/316 ,  H01H1/00 ,  H01L21/66 ,  H01L23/48 ,  H01L23/485 ,  H01L23/498 ,  H01R13/24 ,  H05K3/20 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To provide a microminiature spring contact suitable for probing of an active semiconductor device, and its manufacturing method. SOLUTION: A cantilever-shaped contact element 100 is long and narrow and has two ends 102, 104 and a center part 106 between the ends. The end 102 is a base part, and the contact element 100 is fitted with an electronic part (unillustrated) on the end 102. A coupling fixture 110 is provided on the base part 102. The coupling fixture 110 can be formed as a tab or a stud to facilitate brazing on a substrate at the assembly time. The end 104 is a free end, and a device to be tested is brought into contact with the end 104. An integrated projecting fixture 108, for example, in a pyramidal geometric shape, is provided on the tip 104 to assist connection by pressure to the terminal of the device to be tested. The contact element 100 has a step-shaped structure. The contact element can be easily manufactured by using a known lithography technology. COPYRIGHT: (C)2003,JPO

公开(公告)号：JP2008046139A

公开(公告)日：2008-02-28

申请号：JP2007244529

申请日：2007-09-20

Applicant: Formfactor Inc ,  フォームファクター, インコーポレイテッド

Inventor： KHANDROS IGOR Y ,  ELDRIDGE BENJAMIN N ,  MATHIEU GAETAN L ,  GARY W GRUBE

IPC: G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  G01R31/316 ,  H01H1/00 ,  H01L21/66 ,  H01L23/48 ,  H01L23/485 ,  H01L23/498 ,  H01R13/24 ,  H05K3/20 ,  H05K3/34

CPC classification number: G01R1/07342 ,  G01R1/06727 ,  G01R1/06744 ,  G01R3/00 ,  H01H1/0036 ,  H01L23/49811 ,  H01L24/06 ,  H01L24/10 ,  H01L24/45 ,  H01L24/72 ,  H01L2224/04042 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05657 ,  H01L2224/0566 ,  H01L2224/06136 ,  H01L2224/45144 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K3/20 ,  H05K3/3421 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/48657 ,  H01L2224/4866 ,  H01L2224/85399

Abstract: PROBLEM TO BE SOLVED: To provide a microelectronic contact structure and a manufacturing method for manufacturing the microelectronic contact structure. SOLUTION: The method for mounting a plurality of spring contact elements to the terminal of an electronic component includes the manufacture of a plurality of spring contact elements on a sacrifice substrate, mounting one portion of the spring contact elements to the terminal of electronic components while the spring contact element is on the sacrifice substrate, and the removal of the sacrifice substrate after one portion of the spring contact element is mounted to the terminal of the electronic components. COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：提供微电子接触结构和用于制造微电子接触结构的制造方法。 解决方案：用于将多个弹簧接触元件安装到电子部件的端子的方法包括在牺牲基板上制造多个弹簧接触元件，将一部分弹簧接触元件安装到电子端子 部件，而弹簧接触元件在牺牲基板上，并且在一部分弹簧接触元件安装到电子部件的端子之后，牺牲基板的移除。 版权所有（C）2008，JPO＆INPIT

公开(公告)号：JP2008014957A

公开(公告)日：2008-01-24

申请号：JP2007244528

申请日：2007-09-20

Applicant: Formfactor Inc ,  フォームファクター, インコーポレイテッド

Inventor： KHANDROS IGOR Y ,  ELDRIDGE BENJAMIN N ,  MATHIEU GAETAN L ,  GARY W GRUBE

IPC: G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  G01R31/316 ,  H01H1/00 ,  H01L21/66 ,  H01L23/48 ,  H01L23/485 ,  H01L23/498 ,  H01R13/24 ,  H05K3/20 ,  H05K3/34

CPC classification number: G01R1/07342 ,  G01R1/06727 ,  G01R1/06744 ,  G01R3/00 ,  H01H1/0036 ,  H01L23/49811 ,  H01L24/06 ,  H01L24/10 ,  H01L24/45 ,  H01L24/72 ,  H01L2224/04042 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05657 ,  H01L2224/0566 ,  H01L2224/06136 ,  H01L2224/45144 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K3/20 ,  H05K3/3421 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/48657 ,  H01L2224/4866 ,  H01L2224/85399

Abstract: PROBLEM TO BE SOLVED: To provide a microelectronic contact structure and a method of making the same. SOLUTION: A device includes an electronic component including a trench in a surface, a terminal disposed on the surface of the electronic component and spaced from the trench, and an elongate spring contact element. The elongate spring contact element has a base portion affixed to the terminal, a body portion spaced above the surface of the electronic component and extended across the trench, and a contact portion spaced above the trench. The contact portion is movable toward the trench, and the spring contact element has a first spring constant. When the contact portion is moved enough toward the trench, the body portion contacts the end located between the surface and the trench, and when the contact portion is moved further toward the trench, the spring contact element exhibits a second spring constant different from the first spring constant. COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：提供微电子接触结构及其制造方法。 解决方案：一种设备包括电子部件，其包括表面中的沟槽，设置在电子部件的表面上并与沟槽间隔开的端子和细长的弹簧接触元件。 细长弹簧接触元件具有固定到端子的基部，在电子部件的表面上间隔开并延伸穿过沟槽的主体部分以及在沟槽上方间隔开的接触部分。 接触部分可以朝向沟槽移动，并且弹簧接触元件具有第一弹簧常数。 当接触部分足够地朝向沟槽移动时，主体部分接触位于表面和沟槽之间的端部，并且当接触部分进一步向沟槽移动时，弹簧接触元件呈现与第一 弹簧常数。 版权所有（C）2008，JPO＆INPIT

公开(公告)号：JP2007059931A

公开(公告)日：2007-03-08

申请号：JP2006277615

申请日：2006-10-11

Applicant: Formfactor Inc ,  フォームファクター, インコーポレイテッド

Inventor： KHANDROS IGOR Y ,  MATHIEU GAETAN L ,  ELDRIDGE BENJAMIN N ,  GRUBE GARY W

IPC: G01R1/06 ,  H01L21/66 ,  B23K1/00 ,  B23K20/00 ,  B32B15/08 ,  C23C18/16 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R31/26 ,  G01R31/28 ,  H01L21/00 ,  H01L21/02 ,  H01L21/288 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/603 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L25/065 ,  H01L25/16 ,  H01R12/52 ,  H05K1/14 ,  H05K3/20 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K7/10

CPC classification number: H05K7/1069 ,  B23K1/0016 ,  B23K20/004 ,  B23K2201/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/0483 ,  G01R31/2863 ,  H01L21/288 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/67138 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/05082 ,  H01L2224/05644 ,  H01L2224/1134 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13582 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/45644 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/48644 ,  H01L2224/48699 ,  H01L2224/48844 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2224/48744 ,  H01L2924/20751 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/00015 ,  H01L2924/2075 ,  H01L2924/20754

Abstract: PROBLEM TO BE SOLVED: To directly fit elastic contact structure to connection pads on semiconductor dies, before the semiconductor dies are made into unit bodies (separated) from a semiconductor wafer. SOLUTION: A circuit board (710), having a plurality of terminals (712) arranged on the surface of the semiconductor die or an object similar to the board, is connected to the semiconductor dies (702 and 704). Thus, the semiconductor dies can be trained (tested and/or burnt in). Finally, the semiconductor dies are formed into the unit bodies from the semiconductor wafer, and the same elastic contact structure (708) can be used for performing mutual connection between the semiconductor dies and the other electronic element (such as wiring boards and semiconductor packages). When the metal compound mutual interconnecting element (708) is used as the elastic contact structure, burn-in is conducted in at least a temperature of 150°C and it is completed in a period which is shorter than 60 minutes. COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：在将半导体管芯制造成与半导体晶片的单位体（分离）之前，将弹性接触结构直接配合到半导体管芯上的连接焊盘。 解决方案：具有布置在半导体管芯的表面上的多个端子（712）或与板类似的物体的电路板（710）连接到半导体管芯（702和704）。 因此，可以对半导体管芯进行培训（测试和/或烧毁）。 最后，将半导体管芯从半导体晶片形成为单元体，并且可以使用相同的弹性接触结构（708）来实现半导体管芯和另一个电子元件（例如布线板和半导体封装）之间的相互连接， 。 当金属化合物互连元件（708）用作弹性接触结构时，在至少150℃的温度下进行老化，并且在短于60分钟的时间内完成。 版权所有（C）2007，JPO＆INPIT

公开(公告)号：JP2005049336A

公开(公告)日：2005-02-24

申请号：JP2004178019

申请日：2004-06-16

Applicant: Formfactor Inc ,  フォームファクター,インコーポレイテッド

Inventor： ELDRIDGE BENJAMIN N ,  KHANDROS IGOR Y ,  PEDERSEN DAVID V ,  WHITTEN RALPH G

IPC: G01R1/06 ,  G01R1/073 ,  G01R31/28 ,  G01R31/3183 ,  H01L21/66 ,  H01L21/822 ,  H01L23/544 ,  H01L27/04

CPC classification number: H01L22/34 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/14 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide design and test methodology for breaking a linear relation between a defect detecting range or test possibility and a design test or a cost related to production. SOLUTION: The present invention relates to a test assembly for testing a product circuit of a product die, and a product and a test die are prepared on a semiconductor wafer. The product circuit and a test circuit are divided into individual dies to eliminate or minimize the embedded test circuit on the product die 616. This provides a tendency of reducing a size of the product die, of reducing a production cost for the product die, and of maintaining a high-level test range for the product circuit in the product die. Then, the large number of product dies on one or more of wafer(s) can be tested using a test die 618. COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：提供破坏缺陷检测范围或测试可能性与设计测试或生产成本之间的线性关系的设计和测试方法。 解决方案：本发明涉及一种用于测试产品模具的产品电路的测试组件，并且在半导体晶片上制备产品和测试模具。 产品电路和测试电路被分成单独的模具以消除或最小化产品模具616上的嵌入式测试电路。这提供了减小产品模具的尺寸，降低产品模具的生产成本的趋势，以及 为产品模具中的产品电路保持高水平的测试范围。 然后，可以使用测试模具618测试一个或多个晶片上的大量产品模具。版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2010073698A

公开(公告)日：2010-04-02

申请号：JP2009283375

申请日：2009-12-14

Applicant: Formfactor Inc ,  フォームファクター, インコーポレイテッド

Inventor： ELDRIDGE BENJAMIN N ,  GRUBE GARY W ,  KHANDROS IGOR Y ,  MADSEN ALEC ,  MATHIEU GAETAN L

IPC: G01R1/073 ,  H01R13/24 ,  G01R1/06 ,  H01R4/26 ,  H01R4/58 ,  H01R12/55 ,  H01R12/71 ,  H01R43/16

CPC classification number: H01R13/2407 ,  G01R1/06711 ,  G01R1/06727 ,  H01R4/26 ,  H01R9/091 ,  H01R12/57 ,  H01R13/2442 ,  H01R2201/20 ,  Y10T29/49004 ,  Y10T29/49128 ,  Y10T29/49165

Abstract: PROBLEM TO BE SOLVED: To provide a device and a method of producing an improved mutual connection element and a tip structure for carrying out pressure connection between terminals of electronic parts. SOLUTION: The tip structure includes a sharp blade, and this blade is arranged so that the length of the blade will become substantially in parallel with a horizontal movement direction of the tip structural when the tip structure bends and crosses the terminals of the electronic parts. In this way, the sharp blade arranged substantially in parallel clearly cuts in through a certain non-conductive layer (singular or multiple), and brings about sure electric connection between the interconnection element and the terminals of the electronic parts. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 解决的问题：提供一种制造改进的相互连接元件的装置和方法以及用于在电子部件的端子之间进行压力连接的尖端结构。 解决方案：尖端结构包括锋利的刀片，并且该刀片布置成使得当尖端结构弯曲并穿过尖端结构的端子时，叶片的长度将变得基本上与尖端结构的水平移动方向平行 电子零件。 以这种方式，基本上平行布置的锋利的刀片明显地穿过某个非导电层（单个或多个），并且导致互连元件和电子部件的端子之间的电连接。 版权所有（C）2010，JPO＆INPIT