公开(公告)号：JPH11126800A

公开(公告)日：1999-05-11

申请号：JP23742498

申请日：1998-08-24

Applicant: FORMFACTOR INC

Inventor： KHANDROS IGOR Y ,  MATHIEU GAETAN L ,  ELDRIDGE BENJAMIN N ,  GRUBE GARY W ,  DOZIER THOMAS H

IPC: G01R1/073 ,  B23K1/00 ,  B23K20/00 ,  B23K31/02 ,  C23C18/16 ,  C25D5/08 ,  C25D5/16 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/04 ,  G01R1/06 ,  G01R1/067 ,  G01R31/26 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/58 ,  H01L21/60 ,  H01L21/603 ,  H01L21/607 ,  H01L21/66 ,  H01L21/68 ,  H01L23/02 ,  H01L23/12 ,  H01L23/32 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L25/07 ,  H01L25/16 ,  H01L25/18 ,  H01R9/00 ,  H01R12/16 ,  H01R12/71 ,  H01R13/05 ,  H01R13/24 ,  H01R29/00 ,  H01R33/74 ,  H01R33/76 ,  H01R107/00 ,  H05H1/18 ,  H05K1/14 ,  H05K1/18 ,  H05K3/20 ,  H05K3/24 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K7/10 ,  H01R23/68

Abstract: PROBLEM TO BE SOLVED: To form a solder ball and/or an uplifted solder bump on an electronic component, especially on a chip carrier or a semiconductor package, by forming mutually connected elements, especially spring elements, and mounting the mutually connected elements on the electronic component. SOLUTION: In a performing pattern 200 of a mutually connected element 210 which is mounted on an electronic component 212 wherein a terminal 214 is provided, one end of a soft wire core of gold or the like is bonded to the terminal 214. The core is extended from the terminal and formed so as to have the spring shape and cut so as to have the free end. The bonding, molding and cutting of the wire are performed by using a wire bonding device. The adhesive agent at an end part 216a of the core covers only the relatively small part of the exposed surface of the terminal 214. A shell is arranged along the wire core 16 and has an inner layer 218 and an outer layer 220 when multilayered pattern is formed. The both layers can be formed adequately by the plating process.

公开(公告)号：JP2008203273A

公开(公告)日：2008-09-04

申请号：JP2008125329

申请日：2008-05-12

Applicant: Formfactor Inc ,  フォームファクター, インコーポレイテッド

Inventor： IGOR Y KHANDROS ,  ELDRIDGE BENJAMIN N ,  MATHIEU GAETAN L ,  DOZIER THOMAS H ,  SMITH WILLIAM D

IPC: G01R1/073 ,  B23K20/00 ,  C23C18/16 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/067 ,  G01R3/00 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/603 ,  H01L21/66 ,  H01L21/68 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L25/065 ,  H01L25/16 ,  H01R33/76 ,  H05K1/14 ,  H05K3/20 ,  H05K3/32 ,  H05K3/40

CPC classification number: B23K20/004 ,  B23K2201/40 ,  C25D5/08 ,  C25D5/22 ,  C25D21/02 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/06744 ,  G01R1/07342 ,  G01R3/00 ,  G01R31/2884 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/0001 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/141 ,  H05K3/20 ,  H05K3/326 ,  H05K3/4015 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide an assembly suitable for contacting a semiconductor wafer. SOLUTION: An assembly for contacting a semiconductor wafer includes a plurality of tile substrates. Each of the tile substrates includes: two opposite surfaces; a plurality of resilient contacts extending from a first surface of the two opposite surfaces; a plurality of first terminals on a second of the two opposite surfaces, each one of the plurality of first terminals being connected to a corresponding one of the plurality of contacts; and a second substrate having a plurality of second terminals on a surface thereof, the tile substrates being fixed to the second substrate with the plurality of first terminals connected to the plurality of second terminals. COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：提供适合于接触半导体晶片的组件。 解决方案：用于接触半导体晶片的组件包括多个瓦片衬底。 每个瓦片基板包括：两个相对的表面; 从所述两个相对表面的第一表面延伸的多个弹性触点; 在所述两个相对表面中的第二个表面上的多个第一端子，所述多个第一端子中的每一个连接到所述多个触点中的对应的一个; 以及第二基板，其表面上具有多个第二端子，所述瓦片基板固定到所述第二基板，所述多个第一端子连接到所述多个第二端子。 版权所有（C）2008，JPO＆INPIT

公开(公告)号：DE69535629T2

公开(公告)日：2008-07-31

申请号：DE69535629

申请日：1995-11-13

Applicant: FORMFACTOR INC

Inventor： KHANDROS IGOR Y ,  MATHIEU GAETAN L ,  ELDRIDGE BENJAMIN N ,  GRUBE GARY W ,  DOZIER THOMAS H

IPC: G01R1/073 ,  B23K1/00 ,  H01R9/00 ,  B23K20/00 ,  B23K31/02 ,  C23C18/16 ,  C25D5/08 ,  C25D5/16 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/04 ,  G01R1/06 ,  G01R1/067 ,  G01R31/26 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/58 ,  H01L21/60 ,  H01L21/603 ,  H01L21/607 ,  H01L21/66 ,  H01L21/68 ,  H01L23/02 ,  H01L23/12 ,  H01L23/32 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L25/07 ,  H01L25/16 ,  H01L25/18 ,  H01R12/16 ,  H01R12/71 ,  H01R13/05 ,  H01R13/24 ,  H01R29/00 ,  H01R33/74 ,  H01R33/76 ,  H01R107/00 ,  H05H1/18 ,  H05K1/14 ,  H05K1/18 ,  H05K3/20 ,  H05K3/24 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K7/10

Abstract: The probe card assembly (500) includes a probe card (502), and a space transformer (506) having resilient contact structures (524) mounted to and extending from terminals (522) on its surface. An interposer (504) is disposed between the space transformer and the probe card. The space transformer and interposer are stacked on the probe card and the resilient contact structures can be arranged to optimise probing of entire wafer.

公开(公告)号：AU6768500A

公开(公告)日：2001-03-13

申请号：AU6768500

申请日：2000-08-10

Applicant: FORMFACTOR INC

Inventor： DOZIER THOMAS H ,  ONDRICEK DOUGLAS S

IPC: G01R1/04 ,  G01R1/073 ,  H01L21/66

公开(公告)号：AU5964196A

公开(公告)日：1996-12-11

申请号：AU5964196

申请日：1996-05-28

Applicant: FORMFACTOR INC

Inventor： KHANDROS IGOR Y ,  DOZIER THOMAS H ,  GRUBE GARY W ,  MATHIEU GAETAN L

IPC: B23K20/00 ,  C23C18/16 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/603 ,  H01L21/66 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L25/065 ,  H01L25/16 ,  H01R43/02 ,  H05K1/14 ,  H05K3/20 ,  H05K3/32 ,  H05K3/40

Abstract: Spring elements (540) for use as electrical contacts are fabricated by shaping a relatively soft core (112, 122) and overcoating the shaped core (702) with a relatively hard material (114, 124). Additional overcoat layers may be applied to enhance the electrical characteristics of the resulting spring element (540). The spring elements (540) are fabricated from an elongate element (602) which is shaped to exhibit a plurality of spring element cores linked end-to-end, which are then overcoated. The resulting spring elements (540) may then be attached to electronic components (708) by automated machinery (620). An external shaping tool is disclosed, which is particularly useful for shaping a plurality of linked and separable spring elements (540) which are inherently springy (i.e., formed of a relatively hard material).

公开(公告)号：AU7959298A

公开(公告)日：1999-04-05

申请号：AU7959298

申请日：1998-06-11

Applicant: FORMFACTOR INC

Inventor： CHEN JIMMY KUO-WEI ,  ELDRIDGE BENJAMIN N ,  DOZIER THOMAS H ,  YEH JUNJYE J ,  HERMAN GAYLE J ,  KHANDROS IGOR Y

IPC: G01R1/067 ,  B81B7/00 ,  C25D5/50 ,  C25D7/00 ,  C25D7/12 ,  H01L21/00 ,  H01L21/48 ,  H01L21/768 ,  H01L23/32 ,  H01L23/50 ,  H01L23/48

Abstract: Deposition of metal in a preferred shape, including coatings (206) on parts (204), or stand-alone materials (300), and subsequent heat treatment (106) to provide improved mechanical properties. In particular, the method gives products with relatively high yield strength. The products often have relatively high elastic modulus, and are thermally stable, maintaining the high yield strength at temperatures considerably above 25 DEG C. This technique involves depositing a material (206) in the presence of a selected additive, and then subjecting the deposited material to a moderate heat treatment (106). This moderate heat treatment differs from other commonly employed "stress relief" heat treatments in using lower temperatures and/or shorter times, preferably just enough to reorganize the material to the new, desired form. For example, coating and heat treating a spring-shaped elongate member provides a resilient, conductive contact (212, 920, 1060) useful for electronic applications.

公开(公告)号：AU4159896A

公开(公告)日：1996-06-06

申请号：AU4159896

申请日：1995-11-13

Applicant: FORMFACTOR INC

Inventor： KHANDROS IGOR Y ,  MATHIEU GAETAN L ,  ELDRIDGE BENJAMIN N ,  GRUBE GARY W ,  DOZIER THOMAS H

IPC: G01R1/073 ,  B23K1/00 ,  B23K20/00 ,  B23K31/02 ,  C23C18/16 ,  C25D5/08 ,  C25D5/16 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/04 ,  G01R1/06 ,  G01R1/067 ,  G01R31/26 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/58 ,  H01L21/60 ,  H01L21/603 ,  H01L21/607 ,  H01L21/66 ,  H01L21/68 ,  H01L23/02 ,  H01L23/12 ,  H01L23/32 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L25/07 ,  H01L25/16 ,  H01L25/18 ,  H01R9/00 ,  H01R12/16 ,  H01R12/71 ,  H01R13/05 ,  H01R13/24 ,  H01R29/00 ,  H01R33/74 ,  H01R33/76 ,  H01R107/00 ,  H05H1/18 ,  H05K1/14 ,  H05K1/18 ,  H05K3/20 ,  H05K3/24 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K7/10

Abstract: The probe card assembly (500) includes a probe card (502), and a space transformer (506) having resilient contact structures (524) mounted to and extending from terminals (522) on its surface. An interposer (504) is disposed between the space transformer and the probe card. The space transformer and interposer are stacked on the probe card and the resilient contact structures can be arranged to optimise probing of entire wafer.

公开(公告)号：AU8280398A

公开(公告)日：1999-01-19

申请号：AU8280398

申请日：1998-06-30

Applicant: FORMFACTOR INC

Inventor： DOZIER THOMAS H ,  ELDRIDGE BENJAMIN N ,  GRUBE GARY W ,  KHANDROS IGOR Y ,  MATHIEU GAETAN L ,  PEDERSEN DAVID V ,  STADT MICHAEL A

IPC: G01R1/04 ,  H01L23/04 ,  H01L23/13 ,  H01L23/32 ,  H01L23/48 ,  H01L23/538 ,  H05K3/30 ,  H05K3/32

公开(公告)号：AU6028796A

公开(公告)日：1996-12-11

申请号：AU6028796

申请日：1996-05-28

Applicant: FORMFACTOR INC

Inventor： KHANDROS IGOR Y ,  DOZIER THOMAS H ,  GRUBE GARY W ,  GAETAN L MATHIEU

IPC: B23K20/00 ,  B23K31/02 ,  C23C18/16 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/067 ,  G01R1/073 ,  G01R31/26 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/603 ,  H01L21/66 ,  H01L23/32 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L25/065 ,  H01L25/16 ,  H01R33/76 ,  H05K1/14 ,  H05K3/20 ,  H05K3/32 ,  H05K3/40

Abstract: Interconnection elements for electronic components, exhibiting desirable mechanical characteristics (such as resiliency) for making pressure contacts are formed by using a shaping tool (512) to shape an elongate core element (502) of a soft material (such as gold or soft copper wire) to have a springable shape (including cantilever beam, S-shape, U-shape), and overcoating the shaped core element with a hard material (such as nickel and its alloys), to impart a desired spring (resilient) characteristic to the resulting composite interconnection element. The shaping tool may also be an anvil (622) and a die (624), and may nick or sever successive shaped portions of the elongate element, and the elongate element may be made of an inherently hard (springy) material.

公开(公告)号：DE69535629D1

公开(公告)日：2007-12-06

申请号：DE69535629

申请日：1995-11-13

Applicant: FORMFACTOR INC

Inventor： KHANDROS IGOR Y ,  MATHIEU GAETAN L ,  ELDRIDGE BENJAMIN N ,  GRUBE GARY W ,  DOZIER THOMAS H

IPC: G01R1/073 ,  B23K1/00 ,  H01R9/00 ,  B23K20/00 ,  B23K31/02 ,  C23C18/16 ,  C25D5/08 ,  C25D5/16 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/04 ,  G01R1/06 ,  G01R1/067 ,  G01R31/26 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/58 ,  H01L21/60 ,  H01L21/603 ,  H01L21/607 ,  H01L21/66 ,  H01L21/68 ,  H01L23/02 ,  H01L23/12 ,  H01L23/32 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L25/07 ,  H01L25/16 ,  H01L25/18 ,  H01R12/16 ,  H01R12/71 ,  H01R13/05 ,  H01R13/24 ,  H01R29/00 ,  H01R33/74 ,  H01R33/76 ,  H01R107/00 ,  H05H1/18 ,  H05K1/14 ,  H05K1/18 ,  H05K3/20 ,  H05K3/24 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K7/10

Abstract: The probe card assembly (500) includes a probe card (502), and a space transformer (506) having resilient contact structures (524) mounted to and extending from terminals (522) on its surface. An interposer (504) is disposed between the space transformer and the probe card. The space transformer and interposer are stacked on the probe card and the resilient contact structures can be arranged to optimise probing of entire wafer.