公开(公告)号：JP2007132950A

公开(公告)日：2007-05-31

申请号：JP2007000149

申请日：2007-01-04

Applicant: Formfactor Inc ,  フォームファクター, インコーポレイテッド

Inventor： KHANDROS IGOR Y ,  MATHIEU GAETAN L ,  ELDRIDGE BENJAMIN N ,  GRUBE GARY W

IPC: G01R1/073 ,  B23K1/00 ,  B23K20/00 ,  B23K31/02 ,  C23C18/16 ,  C25D5/08 ,  C25D5/16 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/04 ,  G01R1/06 ,  G01R1/067 ,  G01R31/26 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/58 ,  H01L21/60 ,  H01L21/603 ,  H01L21/607 ,  H01L21/66 ,  H01L21/68 ,  H01L23/02 ,  H01L23/12 ,  H01L23/32 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L25/07 ,  H01L25/16 ,  H01L25/18 ,  H01R9/00 ,  H01R12/71 ,  H01R13/05 ,  H01R13/24 ,  H01R29/00 ,  H01R33/74 ,  H01R33/76 ,  H01R107/00 ,  H05H1/18 ,  H05K1/14 ,  H05K1/18 ,  H05K3/20 ,  H05K3/24 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K7/10

CPC classification number: H05K7/1069 ,  B23K1/0016 ,  B23K20/004 ,  B23K2201/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R1/07371 ,  G01R1/07378 ,  G01R31/2884 ,  G01R31/2886 ,  G01R31/2889 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/67138 ,  H01L22/20 ,  H01L23/32 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/05599 ,  H01L2224/05647 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/29111 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45111 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/456 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H01R13/2407 ,  H01R13/2464 ,  H05K1/141 ,  H05K3/20 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/01013 ,  H01L2924/01026 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/48 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/00012 ,  H01L2924/20751 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/00015 ,  H01L2924/2075

Abstract: PROBLEM TO BE SOLVED: To provide a technique for applying a probe to a semiconductor element capable of an orientation of an edge of a probe element, without altering a position of a probe card. SOLUTION: The probe card assembly comprises an upper surface, a lower surface, and the probe card (electronic component) having a plurality of terminals on the upper surface: the upper surface, the lower surface and an intervention body (electronic component) which has the first plural contact structures with a restoring property extending from the terminals at the lower surface and the second plural contact structures with the restoring property extending from the terminals at the upper surface: the upper surface, the lower surface, an interval converter which has the plural contact pads (terminal) mounted at the lower surface and the third contact structures (probe element) with the restoring property extending from the terminals at the upper surface. COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：提供一种用于将探针施加到能够探测元件的边缘的取向的半导体元件的技术，而不改变探针卡的位置。 解决方案：探针卡组件包括上表面，下表面和在上表面上具有多个端子的探针卡（电子部件）：上表面，下表面和干涉体（电子部件 ），其具有第一多个接触结构，具有从下表面的端子延伸的恢复特性和具有从上表面的端子延伸的恢复特性的第二多个接触结构：上表面，下表面，间隔转换器 其具有安装在下表面的多个接触垫（端子）和具有从上表面的端子延伸的恢复特性的第三接触结构（探针元件）。 版权所有（C）2007，JPO＆INPIT

公开(公告)号：JP2005164601A

公开(公告)日：2005-06-23

申请号：JP2004353370

申请日：2004-12-06

Applicant: Formfactor Inc ,  フォームファクター,インコーポレイテッド

Inventor： MATHIEU GAETAN L ,  ELDRIDGE BENJAMIN N ,  GRUBE GARY W

IPC: G01R31/26 ,  G01R1/073 ,  H01L21/66

CPC classification number: G01R1/07307

Abstract: PROBLEM TO BE SOLVED: To provide a method for adjusting the planarity of a contact element for a probe card assembly.
SOLUTION: A planarizing apparatus includes a first control element extending from a substrate of the probe card assembly. The first control element extends, through at least one substrate of the probe card assembly, and can be accessed from the exposed side of the outer substrate of the probe card assembly. By operating the first control element, the substrate connected to the first control element is made warped.
COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种用于调整用于探针卡组件的接触元件的平面度的方法。 解决方案：平面化装置包括从探针卡组件的基底延伸的第一控制元件。 第一控制元件通过探针卡组件的至少一个衬底延伸，并且可以从探针卡组件的外部衬底的暴露侧进入。 通过操作第一控制元件，连接到第一控制元件的基板变形。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2010073698A

公开(公告)日：2010-04-02

申请号：JP2009283375

申请日：2009-12-14

Applicant: Formfactor Inc ,  フォームファクター, インコーポレイテッド

Inventor： ELDRIDGE BENJAMIN N ,  GRUBE GARY W ,  KHANDROS IGOR Y ,  MADSEN ALEC ,  MATHIEU GAETAN L

IPC: G01R1/073 ,  H01R13/24 ,  G01R1/06 ,  H01R4/26 ,  H01R4/58 ,  H01R12/55 ,  H01R12/71 ,  H01R43/16

CPC classification number: H01R13/2407 ,  G01R1/06711 ,  G01R1/06727 ,  H01R4/26 ,  H01R9/091 ,  H01R12/57 ,  H01R13/2442 ,  H01R2201/20 ,  Y10T29/49004 ,  Y10T29/49128 ,  Y10T29/49165

Abstract: PROBLEM TO BE SOLVED: To provide a device and a method of producing an improved mutual connection element and a tip structure for carrying out pressure connection between terminals of electronic parts. SOLUTION: The tip structure includes a sharp blade, and this blade is arranged so that the length of the blade will become substantially in parallel with a horizontal movement direction of the tip structural when the tip structure bends and crosses the terminals of the electronic parts. In this way, the sharp blade arranged substantially in parallel clearly cuts in through a certain non-conductive layer (singular or multiple), and brings about sure electric connection between the interconnection element and the terminals of the electronic parts. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 解决的问题：提供一种制造改进的相互连接元件的装置和方法以及用于在电子部件的端子之间进行压力连接的尖端结构。 解决方案：尖端结构包括锋利的刀片，并且该刀片布置成使得当尖端结构弯曲并穿过尖端结构的端子时，叶片的长度将变得基本上与尖端结构的水平移动方向平行 电子零件。 以这种方式，基本上平行布置的锋利的刀片明显地穿过某个非导电层（单个或多个），并且导致互连元件和电子部件的端子之间的电连接。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2007329491A

公开(公告)日：2007-12-20

申请号：JP2007189655

申请日：2007-07-20

Applicant: Formfactor Inc ,  フォームファクター, インコーポレイテッド

Inventor： KHANDROS IGOR Y ,  MATHIEU GAETAN L ,  ELDRIDGE BENJAMIN N ,  GRUBE GARY W

IPC: G01R1/073 ,  H01L21/60 ,  B23K1/00 ,  B23K20/00 ,  B23K31/02 ,  C23C18/16 ,  C25D5/08 ,  C25D5/16 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/04 ,  G01R1/06 ,  G01R1/067 ,  G01R31/26 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/58 ,  H01L21/603 ,  H01L21/607 ,  H01L21/66 ,  H01L21/68 ,  H01L23/02 ,  H01L23/12 ,  H01L23/32 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L25/07 ,  H01L25/16 ,  H01L25/18 ,  H01R9/00 ,  H01R12/71 ,  H01R13/05 ,  H01R13/24 ,  H01R29/00 ,  H01R33/74 ,  H01R33/76 ,  H01R107/00 ,  H05H1/18 ,  H05K1/14 ,  H05K1/18 ,  H05K3/20 ,  H05K3/24 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K7/10

CPC classification number: H05K7/1069 ,  B23K1/0016 ,  B23K20/004 ,  B23K2201/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R1/07371 ,  G01R1/07378 ,  G01R31/2884 ,  G01R31/2886 ,  G01R31/2889 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/67138 ,  H01L22/20 ,  H01L23/32 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/05599 ,  H01L2224/05647 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/29111 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45111 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/456 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H01R13/2407 ,  H01R13/2464 ,  H05K1/141 ,  H05K3/20 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/01013 ,  H01L2924/01026 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/48 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/00012 ,  H01L2924/20751 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/00015 ,  H01L2924/2075

Abstract: PROBLEM TO BE SOLVED: To provide a restorable contact structure suited for temporary connection with an electronic component such as a semiconductor die, subjected to aging and functional tests. SOLUTION: The contact structure having restorable and tractable properties for various electronic components is formed by bonding a free end of a wire 502 to a substrate 508, disposing the wire to form a wire stem having an elastic form, cutting the wire stem and providing a protective film by at least one layer of a certain material on the wire stem 530. In an illustrative embodiment: the free end of the wire stem is bonded to a contact region on the substrate; the wire stem is constructed to have an elastic form; the wire stem is cut by discharge to be free-standing; and applying, by deposition, the protective film to the free-standing wire stem. Various materials are disclosed as materials to be used for the wire stem (functioning as a foothold) and the protective film (functioning as an upper structure over the foothold). COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：提供适于与诸如半导体管芯的电子部件临时连接的可恢复的接触结构，进行老化和功能测试。 解决方案：通过将导线502的自由端接合到基板508上来形成具有用于各种电子部件的可恢复和易于处理的特性的接触结构，布置线以形成具有弹性形式的线杆，切割线杆 并且通过线杆530上的某种材料的至少一层提供保护膜。在说明性实施例中：线杆的自由端结合到衬底上的接触区域; 线杆构造成具有弹性形式; 线杆由排放口切割成独立的; 并通过沉积将保护膜施加到独立的线杆上。 公开了各种材料作为用于线杆（用作支脚）的材料和保护膜（用作支脚上的上部结构）。 版权所有（C）2008，JPO＆INPIT

公开(公告)号：JP2003177144A

公开(公告)日：2003-06-27

申请号：JP2002285165

申请日：2002-09-30

Applicant: FORMFACTOR INC

Inventor： KHANDROS IGOR Y ,  MATHIEU GAETAN L ,  ELDRIDGE BENJAMIN N ,  GRUBE GARY W

IPC: G01R1/073 ,  B23K1/00 ,  B23K20/00 ,  B23K31/02 ,  C23C18/16 ,  C25D5/08 ,  C25D5/16 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/04 ,  G01R1/06 ,  G01R1/067 ,  G01R31/26 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/58 ,  H01L21/60 ,  H01L21/603 ,  H01L21/607 ,  H01L21/66 ,  H01L21/68 ,  H01L23/02 ,  H01L23/12 ,  H01L23/32 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L25/07 ,  H01L25/16 ,  H01L25/18 ,  H01R9/00 ,  H01R12/16 ,  H01R12/71 ,  H01R13/05 ,  H01R13/24 ,  H01R29/00 ,  H01R33/74 ,  H01R33/76 ,  H01R107/00 ,  H05H1/18 ,  H05K1/14 ,  H05K1/18 ,  H05K3/20 ,  H05K3/24 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K7/10

Abstract: PROBLEM TO BE SOLVED: To provide a technique for probing semiconductor devices. SOLUTION: This probe card assembly 500 is constituted from a probe card 502 and a space converter 506. The space converter 506 has a restorable contact structure (probe element) 524 mounted directly on the surface and elongating from the surface. An interposer 504 is disposed between the space converter 506 and the probe card 502. The space transformer 506 and the interposer 504 are piled so that orientation of the space transformer 506, namely, orientation of the tip of the probe element 524, can be adjusted without changing orientation of the probe card 502. Proper mechanisms 532, 534, 538, 546 for adjusting the orientation of the space transformer 506 and determining the degree of adjustment are provided. COPYRIGHT: (C)2003,JPO

公开(公告)号：JPH11126800A

公开(公告)日：1999-05-11

申请号：JP23742498

申请日：1998-08-24

Applicant: FORMFACTOR INC

Inventor： KHANDROS IGOR Y ,  MATHIEU GAETAN L ,  ELDRIDGE BENJAMIN N ,  GRUBE GARY W ,  DOZIER THOMAS H

IPC: G01R1/073 ,  B23K1/00 ,  B23K20/00 ,  B23K31/02 ,  C23C18/16 ,  C25D5/08 ,  C25D5/16 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/04 ,  G01R1/06 ,  G01R1/067 ,  G01R31/26 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/58 ,  H01L21/60 ,  H01L21/603 ,  H01L21/607 ,  H01L21/66 ,  H01L21/68 ,  H01L23/02 ,  H01L23/12 ,  H01L23/32 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L25/07 ,  H01L25/16 ,  H01L25/18 ,  H01R9/00 ,  H01R12/16 ,  H01R12/71 ,  H01R13/05 ,  H01R13/24 ,  H01R29/00 ,  H01R33/74 ,  H01R33/76 ,  H01R107/00 ,  H05H1/18 ,  H05K1/14 ,  H05K1/18 ,  H05K3/20 ,  H05K3/24 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K7/10 ,  H01R23/68

Abstract: PROBLEM TO BE SOLVED: To form a solder ball and/or an uplifted solder bump on an electronic component, especially on a chip carrier or a semiconductor package, by forming mutually connected elements, especially spring elements, and mounting the mutually connected elements on the electronic component. SOLUTION: In a performing pattern 200 of a mutually connected element 210 which is mounted on an electronic component 212 wherein a terminal 214 is provided, one end of a soft wire core of gold or the like is bonded to the terminal 214. The core is extended from the terminal and formed so as to have the spring shape and cut so as to have the free end. The bonding, molding and cutting of the wire are performed by using a wire bonding device. The adhesive agent at an end part 216a of the core covers only the relatively small part of the exposed surface of the terminal 214. A shell is arranged along the wire core 16 and has an inner layer 218 and an outer layer 220 when multilayered pattern is formed. The both layers can be formed adequately by the plating process.

公开(公告)号：JP2010266465A

公开(公告)日：2010-11-25

申请号：JP2010182073

申请日：2010-08-17

Applicant: Formfactor Inc ,  フォームファクター, インコーポレイテッド

Inventor： MATHIEU GAETAN L ,  ELDRIDGE BENJAMIN N ,  GRUBE GARY W

IPC: G01R1/073 ,  G01B7/34 ,  G01N27/00 ,  G01R1/067 ,  G01R3/00 ,  H01L21/48 ,  H01L21/60 ,  H01L21/66 ,  H01L23/48 ,  H01R12/16 ,  H01R33/76 ,  H05K3/32 ,  H05K3/40

CPC classification number: G01R3/00 ,  G01R1/06727 ,  G01R1/06761 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/14 ,  H05K3/326 ,  H05K3/4092 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To miniaturize an electric connection mechanism between electronic components. SOLUTION: This invention is directed to a method of forming an interconnection, including a spring contact element, by lithographic techniques. In one embodiment, the method includes applying a masking material over a first portion of a substrate, the masking material having an opening which will define a first portion of a spring structure, depositing a structure material (e.g., conductive material) in the opening, overfilling the opening with the structure material, removing a portion of the structure material, and removing a first portion of the masking material. In this embodiment, at least a portion of the first portion of the spring structure is freed of masking material. In one aspect of the invention, the method includes planarizing the masking material layer and structure material to remove a portion of the structure material. In another aspect, the formed spring structure includes one of a post portion 13, a beam portion 14, and a tip portion 16. COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：为了使电子部件之间的电连接机构小型化。 解决方案：本发明涉及通过光刻技术形成包括弹簧接触元件的互连的方法。 在一个实施例中，该方法包括在衬底的第一部分上施加掩模材料，掩模材料具有将限定弹簧结构的第一部分的开口，在开口中沉积结构材料（例如导电材料） 用结构材料过度填充开口，去除结构材料的一部分，以及去除掩模材料的第一部分。 在该实施例中，弹簧结构的第一部分的至少一部分没有掩蔽材料。 在本发明的一个方面中，该方法包括平坦化掩模材料层和结构材料以去除结构材料的一部分。 另一方面，所形成的弹簧结构包括柱部分13，梁部分14和末端部分16中的一个。版权所有：（C）2011，JPO＆INPIT

公开(公告)号：JP2007059931A

公开(公告)日：2007-03-08

申请号：JP2006277615

申请日：2006-10-11

Applicant: Formfactor Inc ,  フォームファクター, インコーポレイテッド

Inventor： KHANDROS IGOR Y ,  MATHIEU GAETAN L ,  ELDRIDGE BENJAMIN N ,  GRUBE GARY W

IPC: G01R1/06 ,  H01L21/66 ,  B23K1/00 ,  B23K20/00 ,  B32B15/08 ,  C23C18/16 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R31/26 ,  G01R31/28 ,  H01L21/00 ,  H01L21/02 ,  H01L21/288 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/603 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L25/065 ,  H01L25/16 ,  H01R12/52 ,  H05K1/14 ,  H05K3/20 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K7/10

CPC classification number: H05K7/1069 ,  B23K1/0016 ,  B23K20/004 ,  B23K2201/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/0483 ,  G01R31/2863 ,  H01L21/288 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/67138 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/05082 ,  H01L2224/05644 ,  H01L2224/1134 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13582 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/45644 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/48644 ,  H01L2224/48699 ,  H01L2224/48844 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2224/48744 ,  H01L2924/20751 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/00015 ,  H01L2924/2075 ,  H01L2924/20754

Abstract: PROBLEM TO BE SOLVED: To directly fit elastic contact structure to connection pads on semiconductor dies, before the semiconductor dies are made into unit bodies (separated) from a semiconductor wafer. SOLUTION: A circuit board (710), having a plurality of terminals (712) arranged on the surface of the semiconductor die or an object similar to the board, is connected to the semiconductor dies (702 and 704). Thus, the semiconductor dies can be trained (tested and/or burnt in). Finally, the semiconductor dies are formed into the unit bodies from the semiconductor wafer, and the same elastic contact structure (708) can be used for performing mutual connection between the semiconductor dies and the other electronic element (such as wiring boards and semiconductor packages). When the metal compound mutual interconnecting element (708) is used as the elastic contact structure, burn-in is conducted in at least a temperature of 150°C and it is completed in a period which is shorter than 60 minutes. COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：在将半导体管芯制造成与半导体晶片的单位体（分离）之前，将弹性接触结构直接配合到半导体管芯上的连接焊盘。 解决方案：具有布置在半导体管芯的表面上的多个端子（712）或与板类似的物体的电路板（710）连接到半导体管芯（702和704）。 因此，可以对半导体管芯进行培训（测试和/或烧毁）。 最后，将半导体管芯从半导体晶片形成为单元体，并且可以使用相同的弹性接触结构（708）来实现半导体管芯和另一个电子元件（例如布线板和半导体封装）之间的相互连接， 。 当金属化合物互连元件（708）用作弹性接触结构时，在至少150℃的温度下进行老化，并且在短于60分钟的时间内完成。 版权所有（C）2007，JPO＆INPIT

公开(公告)号：JP2004186670A

公开(公告)日：2004-07-02

申请号：JP2003322281

申请日：2003-09-12

Applicant: Formfactor Inc ,  フォームファクター,インコーポレイテッド

Inventor： MATHIEU GAETAN L ,  ELDRIDGE BENJAMIN N ,  GRUBE GARY W

IPC: G01R1/073 ,  G01B7/34 ,  G01N27/00 ,  G01R1/067 ,  G01R3/00 ,  H01L21/48 ,  H01L21/60 ,  H01L21/66 ,  H01L23/48 ,  H01R12/16 ,  H01R33/76 ,  H05K3/32 ,  H05K3/40

CPC classification number: G01R3/00 ,  G01R1/06727 ,  G01R1/06761 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/14 ,  H05K3/326 ,  H05K3/4092 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a suitable mutual connection with respect to a present electrical connection of fine pitch, which can be expanded to future technology. SOLUTION: This method is for manufacturing the mutual connection including a spring contact element, using a lithography technology. A mask material is applied to a first portion of a substrate, the mask material has an opening, where the first portion of a spring structure is delimited, a structure material(such as conductive material) is deposited in the opening, the opening is excessively filled with the structure material, a part of the structure material is removed, and the first portion of the mask material is removed. In the embodiment, at least a part of the first portion of the spring structure is relieved from the mask material. As a point of view, the method includes the processes of flattening the mask material layer and the structure material and of removing a part of the structure material. From the other viewpoint, the formed spring structure includes one from among a post portion 13, a beam portion 14, and a chip portion 16. COPYRIGHT: (C)2004,JPO&NCIPI

公开(公告)号：JP2008224688A

公开(公告)日：2008-09-25

申请号：JP2008150928

申请日：2008-06-09

Applicant: Formfactor Inc ,  フォームファクター, インコーポレイテッド

Inventor： ELDRIDGE BENJAMIN N ,  GRUBE GARY W ,  MATSUBAYASHI KEN S ,  LARDER RICHARD A ,  SHINDE MAKARAND S ,  MATHIEU GAETAN L ,  MARTENS ROD

IPC: G01R1/073 ,  G01R31/28 ,  H01L21/66

CPC classification number: G01R31/2891 ,  G01R1/07342 ,  G01R1/44 ,  G01R31/2886

Abstract: PROBLEM TO BE SOLVED: To compensate for thermally induced motion of probe cards used in testing die on a wafer. SOLUTION: The present invention relates to an apparatus, incorporating a temperature control device, which maintains a uniform temperature throughout the thickness of a probe card. An apparatus of the present invention includes a probe card for testing a die on a wafer and an energy transmissive element located adjacent to the probe card at a portion of the probe card, wherein the energy transmissive element utilizes energy transmitted to selectively deflect a portion of the probe card to selectively control the geometric planarity of the probe card. COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：为了补偿在晶片上测试模具中使用的探针卡的热诱导运动。 解决方案：本发明涉及一种结合了温度控制装置的装置，其在探针卡的整个厚度上保持均匀的温度。 本发明的装置包括用于在晶片上测试晶片的探针卡和在探针卡的一部分位于探针卡附近的能量传递元件，其中能量传输元件利用透射的能量来选择性地偏转一部分 探针卡可选择性地控制探针卡的几何平面性。 版权所有（C）2008，JPO＆INPIT