Abstract:
In order to form a cavity for a fusible link in a semiconductor device, an etchable material is applied over and around a portion of the fusible link and the etchable material is coated with a protection layer. The access abutting the etchable material is formed through the protection layer. After the removal of the etchable material, the access is partially filled with a refilling material to thereby form the cavity.
Abstract:
A method of making a photolithography mask for use in creating an electrical fuse on a semiconductor structure comprises initially determining a pattern for a desired electrical fuse, with the pattern including a fuse portion of substantially constant width except for a localized narrowed region of the fuse portion at which the electrical fuse is designed to blow. The method then includes providing a photolithography mask substrate and creating on the photolithography mask substrate a fuse mask element adapted to absorb transmission of an energy beam. The fuse mask element has a first mask portion of substantially constant width corresponding to the desired electrical fuse pattern portion of substantially constant width, and a second mask portion corresponding to the localized narrowed region of the fuse portion. The second mask portion comprises either an additional mask element spaced from the first mask portion, a narrowed width portion, or a gap in the first mask portion. The second mask portion is of a configuration sufficient to create a latent image of the electrical fuse pattern, including the localized narrowed region of the fuse portion at which the electrical fuse is designed to blow, upon passing the energy beam through the photolithography mask and onto a resist layer. Preferably, the fuse portion of substantially constant width on the determined fuse pattern has a design width less than about 0.25 mu m, and wherein the localized narrowed region of the fuse portion has a design width less than the design width of the fuse portion.
Abstract:
Antifuse, die folgendes umfasst:ein Halbleitersubstrat mit einem aktiven Bereich (152; 202; 302), der von einer Grenze (154; 204; 304) einer Flachgrabenisolation umgeben ist;einen über dem Halbleitersubstrat angeordneten und über zumindest einem Teil der Grenze der Flachgrabenisolation liegenden Gateleiter (156; 206; 306);ein zwischen dem Halbleitersubstrat und dem Gateleiter angeordnetes Dielektrikum (157);einen ersten an den Gateleiter gekoppelten Anschluss (158); undeinen zweiten an das Halbleitersubstrat gekoppelten Anschluss (160),wobei der von der Grenze der Flachgrabenisolation umgebene aktive Bereich des Halbleitersubstrates ein längliches Glied (152A; 302A) und mehrere Fingerteile (152B; 302B) enthält, die sich von dem länglichen Glied des aktiven Bereichs erstrecken und quer zu dem länglichen Glied des aktiven Bereichs derart verlaufen, daß der Gateleiter zumindest über einem Teil von zumindest einigen der Fingerteile (152B; 302B) des aktiven Bereichs liegt, undwobei der Gateleiter (156; 206; 306) ein längliches Glied (306A) und mehrere Fingerteile (306B) enthält, die sich von dem länglichen Glied des Gateleiters erstrecken und quer zu dem länglichen Glied des Gateleiters verlaufen.
Abstract:
An integrated circuit has primary devices and redundant devices being selective substituted for the primary devices through at least one fuse. The fuse includes a first layer having at least one fuse link region, a second layer over the first layer and cavities in the second layer above the fuse link region.