公开(公告)号：AU2003217346A1

公开(公告)日：2003-10-13

申请号：AU2003217346

申请日：2003-02-05

Applicant: INTEL CORP

Inventor： HECK JOHN ,  BERRY MICHELE ,  WONG DANIEL ,  RAO VALLURI

IPC: B81B3/00 ,  B81B7/00 ,  H01L23/31

Abstract: A packaged microelectromechanical system may be formed in a hermetic cavity by forming the system on a semiconductor structure and covering the system with a thermally decomposing film. That film may then be covered by a sealing cover. Subsequently, the thermally decomposing material may be decomposed, forming a cavity, which can then be sealed to hermetically enclose the system.