公开(公告)号：MY138825A

公开(公告)日：2009-07-31

申请号：MYPI20030639

申请日：2003-02-25

Applicant: INTEL CORP

Inventor： HECK JOHN ,  BERRY MICHELE ,  WONG DANIEL ,  RAO VALLURI

IPC: B81B7/00 ,  B81B3/00 ,  H01L23/31

Abstract: A PACKAGED MICROELECTROMECHANICAL SYSTEM (18) MAY BE FORMED IN A HERMETIC CAVITY (22) BY FORMING THE SYSTEM (18) ON A SEMICONDUCTOR STRUCTURE (12) AND COVERING THE SYSTEM WITH A THERMALLY DECOMPOSING FILM (25). THAT FILM (25) MAY THEN BE COVERED BY A SEALING COVER (20). SUBSEQUENTLY, THE THERMALLY DECOMPOSING MATERIAL (25) MAY BE DECOMPOSED, FORMING A CAVITY (22), WHICH CAN THEN BE SEALED TO HERMETICALLY ENCLOSE THE SYSTEM (18).

公开(公告)号：AU2003212969A8

公开(公告)日：2003-10-13

申请号：AU2003212969

申请日：2003-02-07

Applicant: INTEL CORP

Inventor： WONG DANIEL ,  BERRY MICHELE ,  RAO VALLURI ,  MA QING ,  HECK JOHN

IPC: B81B7/00 ,  H01L23/10

Abstract: A MEMS device may be formed in a hermetic cavity by sealing a pair of semiconductor structures to one another, enclosing the MEMS device. The two structures may be coupled using surface mount techniques as one example, so that the temperatures utilized may be compatible with many MEMS applications. Electrical interconnection layers in one or the other of these structures may be utilized to allow electrical interconnections from the exterior world to the MEMS components within the cavity.

公开(公告)号：MY138751A

公开(公告)日：2009-07-31

申请号：MYPI20030546

申请日：2003-02-18

Applicant: INTEL CORP

Inventor： MA QING ,  RAO VALLURI ,  HECK JOHN ,  WONG DANIEL ,  BERRY MICHELE

IPC: H05K5/06 ,  B81B7/00 ,  H01L23/10

Abstract: A MEMS DEVICE (14) MAY BE FORMED IN A HERMETIC CAVITY (42) BY SEALING A PAIR OF SEMICONDUCTOR STRUCTURES (22. 32) TO ONE ANOTHER, ENCLOSING THE MEMS DEVICE (12). THE TWO STRUCTURES (22. 32) MAY BE COUPLED USING SURFACE MOUNT TECHNIQUES AS ONE EXAMPLE. SO THAT THE TEMPERATURES UTILIZED MAY BE COMPATIBLE WITH MANY MEMS APPLICATIONS. ELECTRICAL INTERCONNECTION LAYERS (40) IN ONE OR THE OTHER OF THESE STRUCTURES MAY BE UTILIZED TO ALLOW ELECTRICAL INTERCONNECTIONS FROM THE EXTERIOR WORLD TO THE MEMS COMPONENTS (14) WITHIN THE CAVITY (42).

公开(公告)号：AU2003217346A1

公开(公告)日：2003-10-13

申请号：AU2003217346

申请日：2003-02-05

Applicant: INTEL CORP

Inventor： HECK JOHN ,  BERRY MICHELE ,  WONG DANIEL ,  RAO VALLURI

IPC: B81B3/00 ,  B81B7/00 ,  H01L23/31

Abstract: A packaged microelectromechanical system may be formed in a hermetic cavity by forming the system on a semiconductor structure and covering the system with a thermally decomposing film. That film may then be covered by a sealing cover. Subsequently, the thermally decomposing material may be decomposed, forming a cavity, which can then be sealed to hermetically enclose the system.

公开(公告)号：AU2003212969A1

公开(公告)日：2003-10-13

申请号：AU2003212969

申请日：2003-02-07

Applicant: INTEL CORP

Inventor： WONG DANIEL ,  RAO VALLURI ,  HECK JOHN ,  MA QING ,  BERRY MICHELE

IPC: B81B7/00 ,  H01L23/10

Abstract: A MEMS device may be formed in a hermetic cavity by sealing a pair of semiconductor structures to one another, enclosing the MEMS device. The two structures may be coupled using surface mount techniques as one example, so that the temperatures utilized may be compatible with many MEMS applications. Electrical interconnection layers in one or the other of these structures may be utilized to allow electrical interconnections from the exterior world to the MEMS components within the cavity.