Abstract:
An information provision apparatus has a detachable information storage medium that stores information, an information storing portion that storing information read from the information storage medium, a processing portion that performs a reproduction processing of information stored in the information storing portion, an output portion that outputs information reproduced by the processing portion, and a clocking portion that counts an elapsed time since the information storage medium is detached from the information provision apparatus, wherein the processing portion stops the reproduction processing when the elapsed time exceeds a specified value.
Abstract:
The invention relates to a module component having chip components buried in a circuit board, and a method of manufacturing the same, and more specifically it relates to a module component capable of obtaining desired circuit characteristics and functions stably if the size of the component is reduced, being produced very efficiently, and suited to machine mounting, and a method of manufacturing the same. According to the invention, since a desired circuit is composed by disposing a specific number of chip components according to a specified rule, it is not necessary to heat the buried chip components at high temperature when forming a module, chip components are obtained in specified values, and the circuit characteristics, functions, and dimensional precision are stably obtained exactly as designed, and moreover since the chip components are disposed according to a specified rule, it is easy to automate insertion of chip components and increase its operation speed, even if the size of the chip components is reduced, and the circuit composition may be flexibly and easily changed only by changing the inserting position and type of chip components.
Abstract:
A process cartridge detachably mountable to a main assembly of an electrophotographic image forming apparatus, the image forming apparatus including a cam member movable between a first position and a second position away from the first position, the process includes an electrophotographic photosensitive drum; a developing roller, contacted to the electrophotographic photosensitive drum, for developing an electrostatic latent image formed on the drum; a first frame for supporting the drum; a second frame for supporting the developing roller, the second frame being connected with the first frame for relative rotation about a shaft which is disposed downstream of the developing roller with respect to a mounting direction in which the process cartridge is mounted to a main assembly of the apparatus; an entering portion, provided at one end portion of the second frame with respect to a longitudinal direction of the drum and disposed downstream of the shaft with respect to the mounting direction, for permitting at least a part of the cam member with respect to the longitudinal direction to enter when the process cartridge is mounted to the main assembly of the apparatus; and a cam engaging portion for engagement by the cam member to receive from the cam member a force for spacing the drum and the developing roller from each other, the cam engaging portion being disposed at the one longitudinal end portion of the second frame and downstream of the entering portion with respect to the mounting direction.
Abstract:
A developer container of a developing device that is provided in an image forming apparatus, includes: a developer container main body provided with a developer containing portion that contains a developer and a developer supply opening; a sealing member that seals the developer supply opening of the developer container main body; and a grip member for pulling out the sealing member in a longitudinal direction of the developer container main body. The developer container main body and the grip member are integrally molded from resin materials having low compatibility to be separable from each other, and the grip member has a longitudinal dimension extending to an outside of a developer container mounting region of the image forming apparatus.
Abstract:
In a method of designing patterns of a semiconductor integrated circuit, the shape of each of a plurality of opening patterns formed by a plurality of contact holes is formed into a rectangular shape; and the contact holes are arranged in such a manner that a long side of each of the rectangular opening patterns is opposite to a long side of an adjacent rectangular opening pattern, and the positions of both ends of the long sides are trued up. Furthermore, a photomask is used for manufacturing a semiconductor integrated circuit as designed by the above method of designing patterns of a semiconductor integrated circuit, in which a plurality of rectangular opening patterns are provided thereon as a plurality of rectangular opening patterns for contact holes; and the a plurality of rectangular opening patterns are arranged in such a manner that adjacent long sides thereof are opposite to each other, and the position of both ends of each long side is trued up. Besides, a semiconductor device comprises a semiconductor integrated circuit designed by using a method of designing a semiconductor integrated circuit.
Abstract:
A TTP comprising two substrates each provided with a transparent resistive-layer, and an insulating section formed on at least one of the transparent resistive-layers using an ultra violet curing resin or an electron beam curing resin. The glass transition temperature of the cured resin in the insulating section is not higher than 80° C., and the insulating section contains a methyl ethyl keton soluble component of not less than 5 weight % and not more than 80 weight %. Since the insulating section is cured at a low temperature, it may be formed on a plastic substrate whose heat-withstanding capability is low. The insulating section can be formed in any desired shape and it can be cured within a short curing time, which are quite advantageous properties for the production of TTPs in volume. The insulating section spreads only minimally during the curing operation, therefore the initial shape, if it is a fine pattern, can be well preserved. Since an acid, alkaline solution or organic solvent is not used for forming the insulating section in the present invention, TTPs thus manufactured are free from the safety problems on the production floor as well as the environmental hazards associated with the use of these chemicals. The same applies also to an electronic system that incorporates the TTP.
Abstract:
In a substrate processing apparatus, processing units are stacked in a multistage manner around a transport robot arranged at the center of a processing area for forming a processing part. In a second hierarchy, rotary coating units are arranged through an indexer and a transport robot. In a fourth hierarchy located above the second hierarchy, rotary developing units are stacked above the rotary coating units respectively. Multistage thermal processing units and an edge exposure unit are horizontally arranged above an interface mechanism part. Thus, a substrate processing apparatus capable of reducing the area for setting the same is provided.
Abstract:
Using carrier having a template nucleic acid strand immobilized thereon, a probe nucleic acid strand is synthesized along the template strand, and the synthesized probe strand is immobilized on a separate substrate by utilizing an electric field to thereby manufacture a nucleic acid strand immobilized array simply and at low costs. By constructing the substrate of the array formed of an electrode, a DNA array enabling electric detection of DNAs can be obtained.
Abstract:
A detector detects frequencies in two predetermined bands separately with respective predetermined coupling. The detector includes a first transmission line, and second and third transmission lines and disposed near the first transmission line. One end of the first transmission line is connected to a terminating resistor, and the other end of the first transmission line is connected to an anode terminal of a detecting diode through a wideband matching circuit. A cathode terminal of the detecting diode is connected to a load circuit.
Abstract:
A method of reattaching a toner seal to a toner frame having a developer containing portion for containing a developer therein, a developer supplying opening for supplying the developer therethrough from the developer containing portion, in order to seal the developer supplying opening, which method includes (a) the detaching step of detaching the already taken-up toner seal from a take-up spool for taking up the toner seal, (b) the sticking step of sticking the toner seal on the toner frame so as to seal the developer supplying opening, (c) the folding-back step of folding back the toner seal from the end portion of the stuck portion of the toner seal, and (d) the attaching step of attaching the free end portion of the folded-back toner seal to the take-up spool for taking up the toner seal to unseal the developer supplying opening so that the operation of a detecting lever for detecting that a predetermined amount of the toner seal has been taken up to unseal the developer supplying opening may be restricted by the toner seal.