公开(公告)号：WO0111662A2

公开(公告)日：2001-02-15

申请号：PCT/US0022227

申请日：2000-08-11

Applicant: TESSERA INC

Inventor： HABA BELGACEM ,  SMITH JOHN W

IPC: H01L21/48 ,  H01L21/60 ,  H01L21/768 ,  H01L23/12 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H05K3/40 ,  H05K3/46 ,  H01L

CPC classification number: H05K3/4076 ,  H01L21/486 ,  H01L2924/0002 ,  H05K2203/083 ,  H05K2203/085 ,  H05K2203/1105 ,  H01L2924/00

Abstract: Electrical connections are made between a pair of elements (32, 38) disposed on opposite side of a hole (28) extending through a dielectric layer (20) by evaporating a conductive material (40) such as a metal having high vapor pressure within the hole while maintaining the hole in a substantially sealed condition. The process may be performed simultaneously to form numerous connections within a microelectronic unit as, for example, within a multilayer circuit panel.

Abstract translation: 通过蒸发导电材料（40），例如具有高蒸气压的金属，在穿过介电层（20）延伸穿过介电层（20）的相对侧上的一对元件（32,38） 同时保持孔处于基本密封的状态。 该过程可以同时进行以在微电子单元内形成多个连接，例如在多层电路板内。

公开(公告)号：WO2014066153A4

公开(公告)日：2014-06-19

申请号：PCT/US2013065605

申请日：2013-10-18

Applicant: TESSERA INC

Inventor： ZOHNI WAEL ,  HABA BELGACEM

IPC: H01L25/065 ,  G06K19/077 ,  H01L23/00 ,  H01L23/495

CPC classification number: G06K19/07747 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/4951 ,  H01L23/49575 ,  H01L23/49816 ,  H01L24/06 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/50 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/06155 ,  H01L2224/06156 ,  H01L2224/13017 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/14154 ,  H01L2224/16058 ,  H01L2224/16238 ,  H01L2224/26155 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/4826 ,  H01L2224/49111 ,  H01L2224/50 ,  H01L2224/73203 ,  H01L2224/73215 ,  H01L2224/73219 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81805 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06562 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/07811 ,  H01L2924/1431 ,  H01L2924/1435 ,  H01L2924/1436 ,  H01L2924/1438 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A microelectronic package (1310) can include a substrate (1340) having first and second surfaces (1341, 1342), and first and second microelectronic elements (1320, 1330). The substrate (1340) can have substrate contacts (1347a, 1347b) at a first surface (1341) and a plurality of terminals (1350) at a second surface (1342). Element contacts (1324, 1334) of the microelectronic elements 1320, 1330 can be joined with corresponding ones of the substrate contacts (1347a, 1347b). A front surface (1331) of the second microelectronic element (1330) can partially overlie a rear surface (1322) of the first microelectronic element (1320) and can be attached thereto. The element contacts (1324) of the first microelectronic element (1320) can be arranged in an area array and can be flip chip bonded with the substrate contacts (1347a). The element contacts (1334) of the second microelectronic element (1330) can be joined with the substrate contacts (1347b) by conductive masses (1375).

Abstract translation: 微电子封装（1310）可以包括具有第一和第二表面（1341,1342）以及第一和第二微电子元件（1320,1330）的衬底（1340）。 衬底（1340）可以在第一表面（1341）处具有衬底触点（1347a，1347b），并且在第二表面（1342）处可以具有多个端子（1350）。 微电子元件1320,1330的元件触点（1324,1334）可以与对应的基板触点（1347a，1347b）连接。 第二微电子元件（1330）的前表面（1331）可以部分地覆盖第一微电子元件（1320）的后表面（1322）并且可以附接到第一微电子元件（1320）的后表面（1322）。 第一微电子元件（1320）的元件触点（1324）可以布置在区域阵列中并且可以与衬底触点（1347a）倒装芯片键合。 第二微电子元件（1330）的元件触点（1334）可以通过导电块（1375）与衬底触点（1347b）连接。

公开(公告)号：WO2012067992A3

公开(公告)日：2012-12-20

申请号：PCT/US2011060553

申请日：2011-11-14

Applicant: TESSERA INC ,  HABA BELGACEM

Inventor： HABA BELGACEM

IPC: H01L23/485 ,  H01L21/60

CPC classification number: H01L24/05 ,  H01L23/49838 ,  H01L24/03 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L25/0657 ,  H01L2224/03001 ,  H01L2224/03003 ,  H01L2224/0311 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05551 ,  H01L2224/05552 ,  H01L2224/05555 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05572 ,  H01L2224/05576 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05686 ,  H01L2224/0569 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/16145 ,  H01L2224/16221 ,  H01L2224/29018 ,  H01L2224/29026 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/1032 ,  H01L2924/10329 ,  H01L2924/1037 ,  H01L2924/1203 ,  H01L2924/12042 ,  H01L2924/1304 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1461 ,  H01L2924/20107 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An assembly 100 and method of making same are provided. The assembly 100 can include a first component 105 including a dielectric region 120 having an exposed surface 122, a conductive pad 134 at the surface 122 defined by a conductive element 132 having at least a portion extending in an oscillating or spiral path along the surface 122, and a an electrically conductive bonding material 140 joined to the conductive pad 134 and bridging an exposed portion 137 of the dielectric surface 122 between adjacent segments 136, 138. The conductive pad 134 can permit electrical interconnection of the first component 105 with a second component 107 having a terminal 108 joined to the pad 134 through the electrically conductive bonding material 140. The path of the conductive element 132 may or may not overlap or cross itself.

Abstract translation: 提供组件100及其制造方法。 组件100可以包括第一部件105，其包括具有暴露表面122的电介质区域120，在由导电元件132限定的表面122处的导电焊盘134，导电元件132具有沿着表面122的振荡或螺旋路径延伸的至少一部分 以及连接到导电焊盘134并桥接相邻段136,138之间的电介质表面122的暴露部分137的导电接合材料140.导电焊盘134可以允许第一部件105与第二部件 107具有通过导电接合材料140接合到焊盘134的端子108.导电元件132的路径可以或可以不与其自身重叠或交叉。

公开(公告)号：WO2012082881A3

公开(公告)日：2012-08-23

申请号：PCT/US2011064884

申请日：2011-12-14

Applicant: TESSERA INC ,  OGANESIAN VAGE ,  HABA BELGACEM ,  MOHAMMED ILYAS ,  SAVALIA PIYUSH ,  MITCHELL CRAIG

Inventor： OGANESIAN VAGE ,  HABA BELGACEM ,  MOHAMMED ILYAS ,  SAVALIA PIYUSH ,  MITCHELL CRAIG

IPC: H01L21/98 ,  B81C1/00 ,  H01L21/56 ,  H01L21/78 ,  H01L23/00 ,  H01L23/13 ,  H01L25/065 ,  H01L29/06

CPC classification number: H01L23/562 ,  B81C1/00269 ,  B81C1/00357 ,  H01L21/2007 ,  H01L21/561 ,  H01L21/563 ,  H01L21/568 ,  H01L23/13 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L29/0657 ,  H01L2224/29186 ,  H01L2224/2919 ,  H01L2224/32057 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/83051 ,  H01L2224/83191 ,  H01L2224/83345 ,  H01L2224/83385 ,  H01L2224/83855 ,  H01L2224/83856 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06555 ,  H01L2225/06575 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/1027 ,  H01L2924/1032 ,  H01L2924/1037 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/3511 ,  H01L2224/83 ,  H01L2924/00

Abstract: A method of bonding first and second microelectronic elements includes pressing together a first substrate 100 containing active circuit elements 108 therein with a second substrate 112, with a flowable dielectric material 102 between confronting surfaces of the respective substrates, each of the first and second substrates 100,112 having a coefficient of thermal expansion less than 10 parts per million/ °C, at least one of the confronting surfaces having a plurality of channels 118A-118F extending from an edge of such surface, such that the dielectric material 102 between planes defined by the confronting surfaces is at least substantially free of voids and has a thickness over one micron, and at least some of the dielectric material 102 flows into at least some of the channels.

Abstract translation: 结合第一微电子元件和第二微电子元件的方法包括将包含有源电路元件108的第一基板100与第二基板112一起压在一起，在相应基板的相对表面之间具有可流动电介质材料102，第一基板100和第二基板120中的每一个 具有小于10ppm /℃的热膨胀系数，面对表面中的至少一个具有从该表面的边缘延伸的多个通道118A-118F，使得介电材料102在由 面对的表面至少基本上没有空隙并且具有超过一微米的厚度，并且至少一些电介质材料102流入至少一些通道中。

公开(公告)号：WO2012012323A3

公开(公告)日：2012-07-05

申请号：PCT/US2011044346

申请日：2011-07-18

Applicant: TESSERA INC ,  HABA BELGACEM

Inventor： HABA BELGACEM

IPC: H01L25/10 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/498

CPC classification number: H01L25/0657 ,  H01L21/56 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/315 ,  H01L23/3157 ,  H01L23/49805 ,  H01L23/49811 ,  H01L23/49838 ,  H01L24/14 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/05554 ,  H01L2224/1401 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06548 ,  H01L2225/06565 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/10161 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599

Abstract: A microelectronic package has a microelectronic element 110 overlying or mounted to a first surface 102 of a substrate 100 and substantially rigid conductive posts 106 projecting above the first surface or projecting above a second surface 104 of the substrate remote therefrom. Conductive elements 108 exposed at a surface of the substrate opposite the surface above which the conductive posts project are electrically interconnected with the microelectronic element. An encapsulant 130 overlies at least a portion of the microelectronic element 110 and the surface 102 of the substrate 100 above which the conductive posts 106 project, the encapsulant having a recess 336 or one or more openings 136, 236 each permitting at least one electrical connection to be made to at least one conductive post. At least some conductive posts 106 are electrically insulated from one another and adapted to simultaneously carry different electric potentials. In particular embodiments, the openings 136, 140, 146, 236 in the encapsulant 130 at least partially expose conductive masses 144 joined to posts, fully expose top surfaces 126 of posts 106 and partially expose edge surfaces 138 of posts, or may only partially expose top surfaces 126 of posts.

Abstract translation: 微电子封装具有覆盖或安装到基板100的第一表面102上的微电子元件110和基本上刚性的导电柱106，所述导电柱106突出在第一表面上方或突出到远离基板100的第二表面104上方。 导电元件108暴露在衬底的与导电柱突出的表面相对的表面上的表面与微电子元件电互连。 密封剂130覆盖微电子元件110的至少一部分和导电柱106突出于其上的衬底100的表面102，密封剂具有凹部336或一个或多个开口136,236，每个开口允许至少一个电连接 对至少一个导电柱进行。 至少一些导电柱106彼此电绝缘并且适于同时承载不同的电势。 在特定实施例中，密封剂130中的开口136,140,​​146,236至少部分地暴露连接到柱的导电块144，完全暴露柱106的顶面126并且部分地暴露柱的边缘表面138，或者可能仅部分暴露 立柱的顶面126。

公开(公告)号：WO2012082227A2

公开(公告)日：2012-06-21

申请号：PCT/US2011057294

申请日：2011-10-21

Applicant: TESSERA INC ,  HABA BELGACEM ,  ZOHNI WAEL ,  CRISP RICHARD DEWITT

Inventor： HABA BELGACEM ,  ZOHNI WAEL ,  CRISP RICHARD DEWITT

IPC: H01L25/065

CPC classification number: H05K1/11 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/50 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/06136 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/45144 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/49427 ,  H01L2224/73215 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/1434 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19103 ,  H01L2924/19107 ,  H01L2924/30107 ,  H05K1/115 ,  H05K1/181 ,  H05K2201/10507 ,  H05K2201/10628 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A microelectronic assembly 700 includes a dielectric element 730 having at least one aperture 733 and electrically conductive elements thereon including terminals 740 exposed at the second surface of the dielectric element 730; a first microelectronic element 712 having a rear surface and a front surface facing the dielectric element 730, the first microelectronic element 712 having a plurality of contacts exposed at the front surface thereof; a second microelectronic element 714 having a rear surface and a front surface facing the rear surface of the first microelectronic element 712, the second microelectronic element 714 having a plurality of contacts exposed at the front surface and projecting beyond an edge of the first microelectronic element 712; and an electrically conductive plane 790 attached to the dielectric element 730 and at least partially positioned between the first and second apertures 733,739, the electrically conductive plane 790 being electrically connected with one or more of the contacts of at least one of the first or second microelectronic elements 712,714.

Abstract translation: 微电子组件700包括具有至少一个孔733的介电元件730和其上的导电元件，其中包括在电介质元件730的第二表面处暴露的端子740; 第一微电子元件712具有后表面和面向电介质元件730的前表面，第一微电子元件712具有在其前表面处暴露的多个触点; 第二微电子元件714具有后表面和面向第一微电子元件712的后表面的前表面，第二微电子元件714具有在前表面处暴露并突出超过第一微电子元件712的边缘的多个触点 ; 以及连接到电介质元件730并且至少部分地定位在第一和第二孔733,739之间的导电平面790，导电平面790与第一或第二微电子中的至少一个的一个或多个触点电连接 元素712,714。

公开(公告)号：WO2012078709A2

公开(公告)日：2012-06-14

申请号：PCT/US2011063653

申请日：2011-12-07

Applicant: TESSERA INC ,  OGANESIAN VAGE ,  HABA BELGACEM ,  MOHAMMED LLYAS ,  SAVALIA PIYUSH ,  MITCHELL CRAIG

Inventor： OGANESIAN VAGE ,  HABA BELGACEM ,  MOHAMMED LLYAS ,  SAVALIA PIYUSH ,  MITCHELL CRAIG

IPC: H01L25/065 ,  H01L21/60 ,  H01L21/98 ,  H01L27/06

CPC classification number: H01L21/76898 ,  H01L23/3171 ,  H01L23/481 ,  H01L23/562 ,  H01L24/03 ,  H01L24/05 ,  H01L24/16 ,  H01L24/80 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/02123 ,  H01L2224/0215 ,  H01L2224/0311 ,  H01L2224/0332 ,  H01L2224/03466 ,  H01L2224/03602 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/05013 ,  H01L2224/05014 ,  H01L2224/05015 ,  H01L2224/05022 ,  H01L2224/05073 ,  H01L2224/05186 ,  H01L2224/05191 ,  H01L2224/05548 ,  H01L2224/05551 ,  H01L2224/05552 ,  H01L2224/05555 ,  H01L2224/05564 ,  H01L2224/05567 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05578 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/06181 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06544 ,  H01L2225/06548 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15165 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/81805 ,  H01L2924/06

Abstract: A microelectronic unit 12 includes a substrate 20 and an electrically conductive element 40. The substrate 20 can have a CTE less than 10 ppm/°C, a major surface 21 having a recess 30 not extending through the substrate, and a material 50 having a modulus of elasticity less than 10 GPa disposed within the recess. The electrically conductive element 40 can include a joining portion 42 overlying the recess 30 and extending from an anchor portion 41 supported by the substrate 20. The joining portion 42 can be at least partially exposed at the major surface 21 for connection to a component 14 external to the microelectronic unit 12.

Abstract translation: 微电子单元12包括基板20和导电元件40.基板20可以具有小于10ppm /℃的CTE，具有未延伸穿过基板的凹部30的主表面21和具有 设置在凹槽内的弹性模量小于10GPa。 导电元件40可以包括覆盖凹部30并且从由基板20支撑的锚定部分41延伸的连接部分42.接合部分42可以在主表面21处至少部分地暴露以连接到外部部件14 到微电子单元12。

公开(公告)号：WO2012054335A1

公开(公告)日：2012-04-26

申请号：PCT/US2011056352

申请日：2011-10-14

Applicant: TESSERA INC ,  HABA BELGACEM ,  ZOHNI WAEL ,  CRISP RICHARD DEWITT

Inventor： HABA BELGACEM ,  ZOHNI WAEL ,  CRISP RICHARD DEWITT

IPC: H01L25/065 ,  H01L23/36 ,  H01L23/367 ,  H01L23/42 ,  H01L23/498 ,  H01L25/10

CPC classification number: H01L25/0652 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/3731 ,  H01L23/3736 ,  H01L23/4334 ,  H01L23/49816 ,  H01L24/14 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/06136 ,  H01L2224/13014 ,  H01L2224/14519 ,  H01L2224/32145 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/4824 ,  H01L2224/484 ,  H01L2224/49111 ,  H01L2224/731 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A microelectronic assembly includes a dielectric element 930B having oppositely-facing first and second surfaces and one or more apertures 972 extending between the surfaces, the dielectric element further having conductive elements thereon; a first microelectronic element 900A having a rear surface and a front surface facing the first surface of the dielectric element 930B, the first microelectronic element 900A having a first edge and a plurality of contacts exposed at the front surface thereof; a second microelectronic element 900B including having a rear surface and a front surface facing the rear surface of the first microelectronic element 900A, a projecting portion of the front surface of the second microelectronic element 900B extending beyond the first edge of the first microelectronic element 900A, the projecting portion being spaced from the first surface of the dielectric element 930B, the second microelectronic element 900B having a plurality of contacts exposed at the projecting portion of the front surface; leads extending from contacts of the microelectronic elements through the at least one aperture to at least some of the conductive elements; and a heat spreader 970 thermally coupled to at least one of the first microelectronic element 900A or the second microelectronic element 900B.

Abstract translation: 微电子组件包括具有相对面对的第一和第二表面的介电元件930B和在表面之间延伸的一个或多个孔972，该介电元件还具有导电元件; 第一微电子元件900A，其具有背面和与介质元件930B的第一表面相对的前表面，第一微电子元件900A具有第一边缘和在其前表面处暴露的多个触点; 第二微电子元件900B，包括具有背面和面向第一微电子元件900A的后表面的前表面，第二微电子元件900B的前表面的突出部分延伸超过第一微电子元件900A的第一边缘， 所述突出部分与所述电介质元件930B的第一表面间隔开，所述第二微电子元件900B具有在所述前表面的突出部分处露出的多个触点; 从微电子元件的接触通过至少一个孔延伸到至少一些导电元件的引线; 以及热耦合到第一微电子元件900A或第二微电子元件900B中的至少一个的散热器970。

公开(公告)号：WO2009017835A3

公开(公告)日：2009-04-16

申请号：PCT/US2008009356

申请日：2008-07-31

Applicant: TESSERA INC ,  HABA BELGACEM ,  HUMPSTON GILES ,  MARGALIT MOTI

Inventor： HABA BELGACEM ,  HUMPSTON GILES ,  MARGALIT MOTI

IPC: H01L21/60 ,  H01L23/12

CPC classification number: H01L21/76898 ,  H01L21/76805 ,  H01L23/3114 ,  H01L23/481 ,  H01L24/12 ,  H01L24/18 ,  H01L24/82 ,  H01L24/95 ,  H01L24/96 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/13024 ,  H01L2224/13025 ,  H01L2224/2518 ,  H01L2224/82039 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/00

Abstract: A microelectronic unit 400 can include a semiconductor element 401 having a front surface, a microelectronic semiconductor device adjacent to the front surface, contacts 403 at the front surface and a rear surface remote from the front surface. The semiconductor element 401 can have through holes 410 extending from the rear surface through the semiconductor element 401 and through the contacts 403. A dielectric layer 411 can line the through holes 410. A conductive layer 412 may overlie the dielectric layer 411 within the through holes 410. The conductive layer 412 can conduct ively interconnect the contacts 403 with unit contacts.

Abstract translation: 微电子单元400可以包括具有前表面的半导体元件401，与前表面相邻的微电子半导体器件，在前表面处的触点403和远离前表面的后表面。 半导体元件401可以具有从后表面延伸穿过半导体元件401并穿过触点403的通孔410.电介质层411可以将通孔410排成线。导电层412可以覆盖通孔内的电介质层411 410.导电层412可以导电地将触点403与单元触点互连。

公开(公告)号：WO2009017758A2

公开(公告)日：2009-02-05

申请号：PCT/US2008009207

申请日：2008-07-25

Applicant: TESSERA INC ,  MIRKARIMI LAURA ,  HABA BELGACEM ,  HUMPSTON GILES ,  OVRUTSKY DAVID

Inventor： MIRKARIMI LAURA ,  HABA BELGACEM ,  HUMPSTON GILES ,  OVRUTSKY DAVID

IPC: H01L25/065 ,  H01L21/98

CPC classification number: H01L21/50 ,  H01L24/24 ,  H01L24/96 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/02371 ,  H01L2224/04105 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/00

Abstract: A stacked microelectronic unit is provided which can include a plurality of vertically stacked microelectronic elements (12, 12A) each having a front surface (117), contacts (22) exposed at the front surface, a rear surface (118) and edges (18, 20) extending between the front and rear surfaces. Traces (24) connected with the contacts may extend along the front surfaces towards edges of the microelectronic elements with the rear surface of at least one of the stacked microelectronic elements being adjacent to a top face (90) of the microelectronic unit. A plurality of conductors (66) may extend along edges of the microelectronic elements from the traces (24) to the top face (90). The conductors may be conductively connected with unit contacts (76) such that the unit contacts overlie the rear surface (118) of the at least one microelectronic element (12A) adjacent to the top face.

Abstract translation: 提供了一种堆叠微电子单元，其可以包括多个垂直堆叠的微电子元件（12,12A），每个微电子元件具有前表面（117），暴露在前表面处的触点（22），后表面（118）和边缘 ，20）在前表面和后表面之间延伸。 与触点连接的迹线（24）可以沿着前表面朝向微电子元件的边缘延伸，其中至少一个堆叠的微电子元件的后表面与微电子单元的顶面（90）相邻。 多个导体（66）可以沿着微电子元件的边缘从迹线（24）延伸到顶面（90）。 导体可以与单元触点（76）导电连接，使得单元接触覆盖邻近顶面的至少一个微电子元件（12A）的后表面（118）。