COPOLYMER POLYESTER RESIN
    51.
    发明专利

    公开(公告)号:JPH03275715A

    公开(公告)日:1991-12-06

    申请号:JP7763490

    申请日:1990-03-26

    Abstract: PURPOSE:To obtain the title resin useful as plastic, etc., having excellent balance of heat resistance and mechanical properties, improved strength at welded part, by copolymerizing compounds selected from specific ester-forming reactive group-containing aromatic compounds. CONSTITUTION:The objective resin which is obtained by copolymerizing at least one structural unit comprising structural units shown by formula I to formula IV (R1 is group shown by formula V, formula VI, etc. ; R2 is group shown by formula V, formula VII, etc.) and obtained from polyfunctional compounds having structural units shown by formula VIII and formula IX (X1 to X7 are each independently polyester-forming -O- or group shown by formula X; Ar1 is trisubstituted aromatic residue; Ar2 is tetrasubstituted aromatic residue) and has 0.01-5 mol% structural units shown by formulas (VIII+ IX) based on structural units shown by formulas (I+II+III+IV) and 0.5-15 dl logarithmic viscosity.

    THERMOTROPIC COPOLYESTER
    52.
    发明专利

    公开(公告)号:JPH03229722A

    公开(公告)日:1991-10-11

    申请号:JP2476190

    申请日:1990-02-02

    Abstract: PURPOSE:To obtain the title copolyester excellent in heat resistance, moldability, flowability, and mechanical properties and low in anisotropy by synthesizing the copolyester which comprises a plurality of specific structural units and has specified melt viscosity and logarithmic viscosity. CONSTITUTION:The title copolyester comprises structural units selected from the group consisting of formulas I to V [wherein X is -CH3, or a group of formula VI or VII; R1 is a group selected from formulas VIII to X, etc.; and R2 is a group selected from formulas IX to XI (wherein Z is Cl or H), etc.], contains structural unit II in an ant. of 1-40mol% based on the sum of structural units I, II, and III, contains structural unit V in an amt. equimolar to the sum of structural units II, III, and IV, and has a melt viscosity of 10000P or lower and a logarithmic viscosity (in pentafluorophenol, 0.1g/dl concn., at 60 deg.C) of 0.2-20.0dl/g.

    ELECTRONIC PART SEALER
    53.
    发明专利

    公开(公告)号:JPH03217416A

    公开(公告)日:1991-09-25

    申请号:JP1310390

    申请日:1990-01-22

    Abstract: PURPOSE:To provide the title sealer low in melt viscosity, high in toughness, excellent in resistance to moisture and heat and durability, composed of an aromatic polyester made up of each specific structural unit at specified proportion. CONSTITUTION:The objective sealer composed of an aromatic polyester made up of structural units of formula I-III [Ar1 are at least two groups of formula VI, V, and IV; Ar2 is at least one group of formula IV, VI, VII, and VIII (X is H or Cl), except that Ar1 are of formula IV and V, and Ar2 is of formula IV], respectively. The amounts of the respective structural units are such as to be as follows: (1) the structural unit of the formula I: 40-95mol% of the formula I + formula II; (2) the structural unit of the formula II: 60-5mol% of the formula II + formula III; (3) the structural unit of the formula III is virtually equimolar to that of the formula II.

    CONNECTOR
    54.
    发明专利

    公开(公告)号:JPH03149774A

    公开(公告)日:1991-06-26

    申请号:JP28820589

    申请日:1989-11-06

    Abstract: PURPOSE:To obtain excellent tenacity, strength, size precision and heat resistance by molding liquid crystal polyester with a specific structure and a composite material mainly made of liquid crystal polyester with a specific structure. CONSTITUTION:Liquid crystal polyester is molded, where structure units are constituted of formulas (I)-(IV), structure units (I)+(II) are 75-95 mole % of structure units (I)+(II)+(III), the structure unit (III) is 25-5 mole % of structure units (I)+(II)+(III), and the mole fraction of structure units (I)/(II) is 75/24-95/5. R1 in the formula II indicates one or more groups selected from formulas V and VI, and R2 in the formula IV indicates one or more groups selected from formulas VII and VIII. An electric/electronic circuit connecting connector which has excellent tenacity, strength and size precision and very high heat resistance and can be used for surface mounting is obtained.

    RESIN CONNECTOR
    55.
    发明专利

    公开(公告)号:JPH03149773A

    公开(公告)日:1991-06-26

    申请号:JP28766189

    申请日:1989-11-02

    Abstract: PURPOSE:To obtain excellent tenacity, strength, size precision and heat resistance by molding liquid crystal polyester with a specific structure and a composite material mainly made of liquid crystal polyester with a specific structure. CONSTITUTION:Liquid crystal polyester is molded, where structure units are constituted of formulas (I)-(IV), the structure unit (I) is 40-90 mole % of structure units (I)+(II)+(III), and the mole fraction of structure units (II)/(III) is 9/1-1/9. R1 in the formula III indicates one or more groups selected from formulas V and VI, and R2 in the formula IV indicates one or more groups selected from formulas VII and VIII. An electric/electronic circuit connecting connector which has excellent tenacity, strength and size precision and very high heat resistance and can be used for surface mounting is obtained.

    DISK SUBSTRATE
    56.
    发明专利

    公开(公告)号:JPH03147517A

    公开(公告)日:1991-06-24

    申请号:JP28766289

    申请日:1989-11-02

    Abstract: PURPOSE:To obtain a disk substrate having excellent molding workability, dimensional accuracy, and mechanical properties by constituting the substrate of liquid crystal polyester containing specified amts. of specified structural units. CONSTITUTION:The liquid crystal polyester contains structural units represented by formulae I - IV, satisfying that the amt. of units of formula I + formula II is 75 - 95mol% of the amt. of formula I + formula II + formula III, the amt. of unit of formula III is 25 - 5mol% of the amt. of formula I + formula II + formula III, the molar ratio of formula I/formula II is 75/25 - 95/5. In formula II, R1 is one or more groups selected from formulae V, VI, etc., R2 in formula IV is one or more groups selected from formulae VII, VIII, etc., X in formula VIII is a hydrogen or chlorine atom. By this method, the obtd. disk substrate, namely a magnetic disk substrate or optical disk substrate, has excellent molding workability, dimensional accuracy, and mechanical properties.

    MAGNETIC MATERIAL COMPOSITION
    57.
    发明专利

    公开(公告)号:JPS6454054A

    公开(公告)日:1989-03-01

    申请号:JP21215687

    申请日:1987-08-25

    Abstract: PURPOSE:To obtain a magnetic material composition excellent in moldability, heat resistance and magnetic and mechanical properties, comprising a magnetic material and a binder resin having three specified kinds of structural units and forming an anisotropic molten phase. CONSTITUTION:A melt-moldable magnetic material composition comprises a binder resin (A) which comprises structural units of formulas I, II and III and forms an anisotropic molten phase and a magnetic material (B), wherein resin A is 1-99wt.% based on the total of resin A and magnetic powder B. In each of the above formulas, X is a group selected from among formulas IV-IX, etc., the amount of structural units of formula I is 40-90mol.% based on the total, the sum of the amount of structural units of formula II and that of structural units of formula III is 60-10mol.% based on the total, the molar ratio of structural units of formula II to structural units of formula II is 1/9-9/1, the amount of structural units of formula II is 5-23mol.% based on the total when X is formula IX, and the carbonyl group of the dicarboxylic acid component in each of formulas II and III are meta or para to each other. This composition can give a plastic magnet excellent in heat resistance and mechanical and magnetic properties.

    ELECTRONIC COMPONENT SEALING AGENT
    58.
    发明专利

    公开(公告)号:JPS6437045A

    公开(公告)日:1989-02-07

    申请号:JP19330587

    申请日:1987-07-31

    Abstract: PURPOSE:To obtain an electronic component sealing agent quite low in melt viscosity, high in tenacity, and excellent in heat- and humidity-resistant features by a method wherein such a sealing agent is composed of a specified aromatic polyester. CONSTITUTION:The agent of this design is an aromatic polyester which includes structural units represented by formulas I-IV. Unit I occupies 40-90mol% of the entirety, II+III+IV occupies 60-10mol%, mol ratio II/III is 8/2-2/8, and IV/[II+III+IV] occupies 0-40mol% of the entirety. There exists a 'meta-' or 'para-' relationship, wherein the meta/para ratio is 0/100-35/65, between carbonyl groups in dicarboxylic acids in formulas I and III. In the formulas, R represents one or more substitutional groups selected out of t-butyl groups and phenyl groups, X represents a group such as formula V, and Y represents a group such as formula VI. This method yields an electronic component sealing agent, low in melt viscosity, high in tenacity, and excellent in humidity- and heat-resistant features.

    PRODUCTION OF GLASS FIBER-REINFORCED POLYESTER RESIN COMPOSITION

    公开(公告)号:JPS62292849A

    公开(公告)日:1987-12-19

    申请号:JP13612686

    申请日:1986-06-13

    Abstract: PURPOSE:To obtain a compsn. having excellent impact resistance, rigidity, etc. and suitable for use in the production of electronic components, etc., by blending an arom polyester with glass fibers having a surface treated with a polyfunctional epoxy compd. and a specified modified olefin copolymer. CONSTITUTION:100pts.wt. arom. polyester (A) is mixed with 3-200pts.wt. glass fiber (B) having a surface treated with 0.01-10wt% (based on the amount of glass fiber) polyfunctional epoxy compd. of the formula (wherein n is a number of 0-30) and 1-100pts.wt. modified olefin copolymer (C) obtd. by grafting 0.01-20wt% unsaturated epoxy monomer (e.g., glycidyl methacrylate) onto an ethylene/3C or higher alpha-olefin copolymer or an ethylene/3C or higher non-conjugated diene copolymer having a melt flow rate of 0.05-100 to obtain the desired glass fiber-reinforced polyester resin compsn.

    NONWOVEN FABRIC MADE OF LIQUID CRYSTAL RESIN FIBER

    公开(公告)号:JP2006342458A

    公开(公告)日:2006-12-21

    申请号:JP2005169043

    申请日:2005-06-09

    Abstract: PROBLEM TO BE SOLVED: To provide a nonwoven fabric solving the alignment deviation caused by the formation of skin layer and core layer in a conventional liquid crystal resin fiber, suppressing partial fibrillation, and suitable e.g. as a substrate of a printed circuit board made of a liquid crystal resin fiber resistant to the lowering of strength in fibrillation, and having excellent strength and high-temperature dimensional stability and extremely small compressive deformation. SOLUTION: The nonwoven fabric is composed of a liquid crystal resin composed of the following structural units (I), (II), (III), (IV) and (V) provided that the amount of the structural unit (I) is 65-80 mol% based on the sum of the structural units (I), (II) and (III), the amount of the structural unit (II) is 60-75 mol% based on the sum of the structural units (II) and (III), the amount of the structural unit (IV) is 60-92 mol% based on the sum of the structural units (IV) and (V), and the sum of the structural units (II) and (III) is essentially equimolar to the sum of the structural units (IV) and (V). COPYRIGHT: (C)2007,JPO&INPIT

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