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    SYSTEMS AND METHODS FOR A TIME-BASED OPTICAL PICKOFF FOR MEMS SENSORS
    54.
    发明申请
    SYSTEMS AND METHODS FOR A TIME-BASED OPTICAL PICKOFF FOR MEMS SENSORS 有权
    用于MEMS传感器的基于时间的光学PICKOFF的系统和方法

    公开(公告)号：US20160377434A1

    公开(公告)日：2016-12-29

    申请号：US14860443

    申请日：2015-09-21

    Applicant: Honeywell International Inc.

    Inventor： Robert D. Horning ,  Grant Lodden

    IPC: G01C19/5726 ,  G01C19/574 ,  G01P15/03 ,  G02B6/293

    CPC classification number: G01C19/5726 ,  B81B2201/0228 ,  B81B2201/04 ,  B81B2203/053 ,  G01C19/5621 ,  G01C19/5656 ,  G01C19/574 ,  G01C25/00 ,  G01P15/032 ,  G01P15/093 ,  G01P21/00 ,  G01P2015/0822 ,  G02B6/29331

    Abstract: Systems and methods for a time-based optical pickoff for MEMS sensors are provided. In one embodiment, a method for an integrated waveguide time-based optical-pickoff sensor comprises: launching a light beam generated by a light source into an integrated waveguide optical-pickoff monolithically fabricated within a first substrate, the integrated waveguide optical-pickoff including an optical input port, a coupling port, and an optical output port; and detecting changes in an area of overlap between the coupling port and a moving sensor component separated from the coupling port by a gap by measuring an attenuation of the light beam at the optical output port, wherein the moving sensor component is moving in-plane with respect a surface of the first substrate comprising the coupling port and the coupling port is positioned to detect movement of an edge of the moving sensor component.

    Abstract translation: 提供了用于MEMS传感器的基于时间的光学拾取的系统和方法。 在一个实施例中，一种用于集成波导时基的光学传感器传感器的方法包括：将由光源产生的光束发射到在第一衬底内单片制造的集成波导光学检测器，所述集成波导光学检测器包括 光输入端口，耦合端口和光输出端口; 并且通过测量光输出端口处的光束的衰减来检测耦合端口和与耦合端口分离的移动传感器部件之间的重叠区域的变化，其中移动传感器部件正在与平面内移动， 相对于包括耦合端口的第一基板的表面和耦合端口被定位成检测移动的传感器部件的边缘的移动。

    WAFER LEVEL MEMS PACKAGE INCLUDING DUAL SEAL RING
    55.
    发明申请
    WAFER LEVEL MEMS PACKAGE INCLUDING DUAL SEAL RING 有权
    WAFER LEVEL MEMS封装包括双密封圈

    公开(公告)号：US20160376146A1

    公开(公告)日：2016-12-29

    申请号：US14748482

    申请日：2015-06-24

    Applicant: Raytheon Company

    Inventor： Buu Q. Diep ,  Adam M. Kennedy ,  Thomas Allan Kocian ,  Mark Lamb

    IPC: B81C1/00 ,  B81B7/00

    CPC classification number: B81B7/0058 ,  B81B7/0041 ,  B81B2201/0207 ,  B81B2201/04 ,  B81C1/00269 ,  B81C1/00317 ,  B81C2203/0109 ,  B81C2203/0118 ,  B81C2203/0145 ,  B81C2203/019

    Abstract: A microelectromechanical systems (MEMS) package includes a substrate extending between a first pair of outer edges to define a length and a second pair of outer edges to define a width. A seal ring assembly is disposed on the substrate and includes at least one seal ring creating a first boundary point adjacent to at least one MEMS device and a second boundary point adjacent at least one of the outer edges. The package further includes a window lid on the seal ring assembly to define a seal gap containing the at least one MEMS device. The seal ring assembly anchors the window lid to the substrate at the second boundary point such that deflection of the window lid into the seal gap is reduced.

    Abstract translation: 微机电系统（MEMS）封装包括在第一对外边缘之间延伸以限定长度的基板和限定宽度的第二对外边缘。 密封环组件设置在基板上，并且包括至少一个密封环，其形成与至少一个MEMS装置相邻的第一边界点和邻近至少一个外边缘的第二边界点。 封装还包括在密封环组件上的窗口盖，以限定包含至少一个MEMS器件的密封间隙。 密封圈组件在第二边界点将窗口盖固定到基底，使得窗口盖进入密封间隙的偏转减小。

    Micro-electromechanical system (MEMS) carrier
    56.
    发明授权
    Micro-electromechanical system (MEMS) carrier 有权
    微机电系统（MEMS）载波

    公开(公告)号：US09417425B2

    公开(公告)日：2016-08-16

    申请号：US14341344

    申请日：2014-07-25

    Applicant: GlobalMEMS TAIWAN CORPORATION LIMITED

    Inventor： Su-Jhen Lin ,  Ming-Ching Wu

    IPC: G02B7/02 ,  H02K41/02 ,  G02B7/08 ,  G02B7/182 ,  G02B26/08 ,  H02K33/18 ,  G02B7/18 ,  G02B26/10 ,  B81B3/00 ,  H02K35/00

    CPC classification number: G02B7/08 ,  B81B3/00 ,  B81B3/0018 ,  B81B2201/02 ,  B81B2201/04 ,  B81B2201/042 ,  G02B7/18 ,  G02B7/182 ,  G02B26/0833 ,  G02B26/085 ,  G02B26/101 ,  H02K33/18 ,  H02K35/00 ,  H02K41/02

    Abstract: A micro-electromechanical system (MEMS) carrier formed by a typical surface micro-machining and bulk micro-machining process on a silicon substrate, having a frame, a movable carrier element, a conductive coil, two return springs and a pair of permanent magnets. The movable carrier element is formed within the frame and movable along a path, the conductive coil is formed on or embedded in the movable carrier element. The two return springs are formed between the movable carrier element and the frame thereby connecting the movable carrier element to the frame and providing a return force to the carrier element, and the pair of permanent magnets are formed a magnetic field for co-acting with the conductive coil for generating an electromagnetic Lorentz force to drive the movable carrier element to move against the return force of the two return springs.

    Abstract translation: 通过在硅衬底上的典型的表面微加工和体微加工工艺形成的微机电系统（MEMS）载体，其具有框架，可移动载体元件，导电线圈，两个复位弹簧和一对永磁体 。 可移动的载体元件形成在框架内并沿着路径移动，导电线圈形成在可动载体元件上或嵌入可移动的载体元件中。 两个复位弹簧形成在可移动的载体元件和框架之间，从而将可移动的载体元件连接到框架上，并向载体元件提供返回力，并且该对永久磁铁形成一个磁场，用于与 导电线圈，用于产生电磁洛伦兹力，以驱动可移动的载体元件克服两个复位弹簧的返回力移动。

    Method for producing a micromechanical component, and micromechanical component
    57.
    发明申请
    Method for producing a micromechanical component, and micromechanical component 有权
    微机械部件的制造方法以及微机电部件

    公开(公告)号：US20150232323A1

    公开(公告)日：2015-08-20

    申请号：US14624071

    申请日：2015-02-17

    Applicant: Robert Bosch GmbH

    Inventor： Dietmar HABERER

    IPC: B81B1/00 ,  B81B7/02 ,  B81C1/00

    CPC classification number: B81B1/004 ,  B81B7/02 ,  B81B2201/04 ,  B81B2201/047 ,  B81B2203/0353 ,  B81C1/00087 ,  B81C1/00103 ,  B81C2201/0194 ,  B81C2203/0172

    Abstract: A method for producing a micromechanical component, and a micromechanical component, includes providing a substrate having first and second outer surfaces, the second surface facing away from the first surface; forming a through-hole through the substrate from the first outer surface up to the second outer surface; attaching an optical functional layer, on the second outer surface, to cover the through-hole; removing a first segment of the substrate on the first surface of the substrate so that there arises a third outer surface inclined relative to the second surface, the third surface facing away from the second surface, the inclined surface enclosing the through-hole; and separating the micromechanical component by separating a first part of the substrate, having the through-hole, and a second part, attached to the first part, of the optical functional layer from a remaining part of the substrate and a remaining part of the optical functional layer.

    Abstract translation: 微机械部件的制造方法和微机械部件包括提供具有第一和第二外表面的基板，所述第二表面背离所述第一表面; 从所述第一外表面到所述第二外表面形成穿过所述基板的通孔; 在所述第二外表面上附着光学功能层以覆盖所述通孔; 去除所述基板的所述第一表面上的所述基板的第一部分，使得出现相对于所述第二表面倾斜的第三外表面，所述第三表面背离所述第二表面，所述倾斜表面包围所述通孔; 以及通过从所述基板的剩余部分分离具有所述通孔的所述基板的第一部分和附接到所述第一部分的所述光学功能层的第二部分和所述光学部件的剩余部分来分离所述微机械部件 功能层。

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