Measuring method of measuring object on printed circuit board
    58.
    发明专利
    Measuring method of measuring object on printed circuit board 有权
    测量印刷电路板对象的测量方法

    公开(公告)号:JP2010266445A

    公开(公告)日:2010-11-25

    申请号:JP2010111468

    申请日:2010-05-13

    Abstract: PROBLEM TO BE SOLVED: To provide a measuring method of a measuring object on a printed circuit board. SOLUTION: In order to measure the measuring object on the printed circuit board, three-dimensional height information of the printed circuit board is obtained by utilizing a first image photographed by irradiating the printed circuit board with grid pattern light by utilizing a first illumination unit. Then, a first domain projecting higher than a reference height is defined as the measuring object on the printed circuit board by utilizing the obtained height information. Thereafter, color information of the printed circuit board is obtained by utilizing a second image photographed by irradiating the printed circuit board with light generated from a second illumination unit. First color information in the first domain defined in the measuring object in the obtained color information of the printed circuit board is set as reference color information. Then, color information in a domain other than the first domain is compared with the reference color information, to thereby determine whether the measuring object is formed in the domain other than the first domain or not. COPYRIGHT: (C)2011,JPO&INPIT

    Abstract translation: 要解决的问题:提供印刷电路板上的测量对象的测量方法。 解决方案:为了测量印刷电路板上的测量对象,印刷电路板的三维高度信息是通过利用第一图像获得的,所述第一图像通过利用第一图像通过用网格图案光照射印刷电路板而拍摄 照明单元 然后,通过利用获得的高度信息,将高于参考高度的第一区域定义为印刷电路板上的测量对象。 此后,通过利用通过从第二照明单元产生的光照射印刷电路板而拍摄的第二图像来获得印刷电路板的颜色信息。 将所获得的印刷电路板的颜色信息中的测量对象中定义的第一域中的第一颜色信息设置为参考颜色信息。 然后,将与第一域以外的域中的颜色信息与参考颜色信息进行比较,从而确定测量对象是否形成在除了第一域之外的域中。 版权所有(C)2011,JPO&INPIT

    SYSTEMS AND METHODS FOR OBLIQUE INCIDENCE SCANNING WITH 2D ARRAY OF SPOTS

    公开(公告)号:EP3295477A1

    公开(公告)日:2018-03-21

    申请号:EP16793208

    申请日:2016-05-04

    Abstract: A system to generate multiple beam lines in an oblique angle multi-beam spot scanning wafer inspection system includes a beam scanning device configured to scan a beam of illumination, an objective lens oriented at an oblique angle relative to the surface of a sample and with an optical axis perpendicular to a first scanning direction on the sample, and one or more optical elements positioned between the objective lens and the beam scanning device. The one or more optical elements split the beam into two or more offset beams such that the two or more offset beams are separated in a least a second direction perpendicular to the first direction. The one or more optical elements further modify the phase characteristics of the two or more offset beams such that the two or more offset beams are simultaneously in focus on the sample during a scan.

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