公开(公告)号：KR101588927B1

公开(公告)日：2016-01-26

申请号：KR1020130087522

申请日：2013-07-24

Applicant: 주식회사 엘지화학

Inventor： 오덕수 ,  박성수 ,  강민수

IPC: H01L51/52 ,  H05B33/06 ,  G09F9/00

CPC classification number: H05K1/028 ,  H01L27/3276 ,  H05K1/111 ,  H05K1/117 ,  H05K1/118 ,  H05K1/14 ,  H05K1/141 ,  H05K1/142 ,  H05K1/145 ,  H05K1/147 ,  H05K1/189 ,  H05K3/323 ,  H05K3/361 ,  H05K3/363 ,  H05K2201/0397 ,  H05K2201/046 ,  H05K2201/05 ,  H05K2201/058 ,  H05K2201/09418 ,  H05K2201/10128 ,  H05K2201/10681 ,  H05K2203/049

Abstract: 본명세서는디스플레이소자에서기판상에설치된연성인쇄회로기판의구조에관한것이다.

Abstract translation: 本说明书涉及安装在显示装置中的基板上的柔性印刷电路板的结构。

公开(公告)号：KR1020100030096A

公开(公告)日：2010-03-18

申请号：KR1020080088880

申请日：2008-09-09

Applicant: 삼성전자주식회사

Inventor： 백중현

IPC: H01L23/36 ,  H01L23/34 ,  H01L23/50

CPC classification number: H01L23/467 ,  H01L23/5385 ,  H01L25/18 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2225/06579 ,  H01L2225/06589 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16251 ,  H01L2924/3011 ,  H05K1/141 ,  H05K1/144 ,  H05K1/147 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/046 ,  H05K2201/056 ,  H05K2201/10159 ,  H05K2201/10734 ,  H01L2224/0401

Abstract: PURPOSE: A semiconductor module and an electronic system including the same are provided to improve the performance of a semiconductor circuit by reducing the route of a signal and improving the efficiency of cooling. CONSTITUTION: A module substrate(130), a logic device(110) and a plurality of memory devices(125) are prepared. The module electrically connects the logic device and the memory devices. The logic device is formed on one part of the module substrate. The memory devices are formed on the other part of the module substrate to be vertically arranged with respect to the logic device. The module substrate is supported by a support unit.

Abstract translation: 目的：提供半导体模块和包括该半导体模块的电子系统，以通过减少信号的路径并提高冷却效率来提高半导体电路的性能。 构成：准备模块衬底（130），逻辑器件（110）和多个存储器件（125）。 该模块电连接逻辑器件和存储器件。 逻辑器件形成在模块基板的一部分上。 存储器件形成在模块基板的另一部分上，以相对于逻辑器件垂直布置。 模块基板由支撑单元支撑。

公开(公告)号：KR1020150068789A

公开(公告)日：2015-06-22

申请号：KR1020130154863

申请日：2013-12-12

Applicant: 엘지이노텍 주식회사

Inventor： 최만휴 ,  김민재 ,  라세웅 ,  박현규 ,  조인희 ,  홍승권

IPC: H05K1/18

CPC classification number: H05K1/0281 ,  G02F1/133615 ,  G02F2001/133612 ,  H05K1/0278 ,  H05K1/181 ,  H05K1/189 ,  H05K3/28 ,  H05K2201/046 ,  H05K2201/10106

Abstract: 본발명은인쇄회로기판에관한것으로, 발광소자가실장되는제1 영역, 상기제1 영역으로부터연결되는제2 영역, 및상기제1 영역및 상기제2 영역의사이의절곡부를포함하는지지기판; 상기지지기판상의절연기판; 상기절연기판상의배선부; 및상기배선부상의보호층;을포함하여구성된다.

Abstract translation: 印刷电路板技术领域本发明涉及一种印刷电路板，包括：支撑板，包括安装有发光装置的第一区域，从第一区域连接的第二区域和第一区域与第二区域之间的弯曲部分; 位于支撑板上的绝缘板; 位于绝缘板上的布线部分; 以及位于配线部上的保护层。

公开(公告)号：KR1020140100325A

公开(公告)日：2014-08-14

申请号：KR1020130013492

申请日：2013-02-06

Applicant: 삼성전자주식회사

Inventor： 윤영정 ,  최기원

IPC: H01L33/48 ,  H01L33/64

CPC classification number: H01L33/62 ,  F21S41/141 ,  F21S41/192 ,  F21S43/14 ,  F21S43/195 ,  H01L2224/48091 ,  H05K1/0284 ,  H05K1/117 ,  H05K1/14 ,  H05K3/366 ,  H05K3/403 ,  H05K2201/046 ,  H05K2201/09063 ,  H05K2201/09145 ,  H05K2201/09163 ,  H05K2201/10106 ,  H01L2924/00014

Abstract: The present invention relates to a light emitting device package module. The light emitting device package module of the present invention may comprise a light emitting device; a first circuit board which stores the light emitting device and is electrically connected to the light emitting device; and a second circuit board which is assembled with the first circuit board by using a connecting member and electrically connected the first circuit board.

Abstract translation: 本发明涉及发光器件封装模块。 本发明的发光器件封装模块可以包括发光器件; 第一电路板，其存储所述发光器件并电连接到所述发光器件; 以及第二电路板，其通过使用连接构件与第一电路板组装并电连接第一电路板。

公开(公告)号：US20180316375A1

公开(公告)日：2018-11-01

申请号：US15769723

申请日：2015-12-08

Applicant: Intel Corporation

Inventor： Telesphor KAMGAING ,  Richard J. DISCHLER

IPC: H04B1/18 ,  H01L23/498 ,  H01L25/16 ,  H01P5/08 ,  H01P3/16 ,  H01L23/66 ,  H01P1/24 ,  H01L23/367 ,  H01L25/065 ,  H05K1/18 ,  H05K1/14

CPC classification number: G06F1/16 ,  H05K1/0274 ,  H05K1/147 ,  H05K2201/045 ,  H05K2201/046

Abstract: Wireless interconnects are shown on flexible cables for communication between computing platforms. One example has an integrated circuit chip, a package substrate to carry the integrated circuit chip, the package substrate having conductive connectors to connect the integrated circuit chip to external components, a cable on the package substrate coupled to the integrated circuit chip at one end, a radio chip on the cable coupled to the cable at the other end, the radio chip to modulate data over a carrier and to transmit the modulated data, and a waveguide transition coupled to a dielectric waveguide to receive the transmitted modulated data from the radio and to couple it into the waveguide, the waveguide to carry the modulated data to an external component.

公开(公告)号：US20180220536A1

公开(公告)日：2018-08-02

申请号：US15506035

申请日：2015-09-24

Applicant: KONINKLIJKE PHILIPS N.V.

Inventor： RALF GORDON CONRADS ,  HENDRIK HUISMAN ,  CARSTEN DEPPE ,  XI GU ,  GERO HEUSLER

IPC: H05K3/36 ,  H05K1/14 ,  H05K1/11 ,  H05K3/34

CPC classification number: H05K3/366 ,  H05K1/111 ,  H05K1/117 ,  H05K1/141 ,  H05K3/3405 ,  H05K3/403 ,  H05K2201/046 ,  H05K2203/049

Abstract: The invention describes a printed circuit board with a top side and a bottom side, the printed circuit board comprising at least two electrically conductive layers (112, 114, 116, 212, 214, 312, 314, 212i, 214i, 212j, 214j) for transmitting electrical current and at least one electrically insulating layer (102, 104, 106, 108, 202, 204, 302, 304, 202i, 204i, 202j, 204j) comprising electrically insulating material, wherein the electrically conductive layers (112, 114, 116, 212, 214, 312, 314, 212i, 214i, 212j, 214j) and the electrically insulating layer (102, 104, 106, 108, 202, 204, 302, 304, 202i, 204i, 202j, 204j) are arranged in an alternating assembly such that the two electrically conductive layers (112, 114, 116, 212, 214, 312, 314, 212i, 214i, 212j, 214j) are electrically insulated with respect to each other by means of the electrically insulating layer (102, 104, 106, 108, 202, 204, 302, 304, 202i, 204i, 202j, 204j), wherein each of the electrically conductive layers (112, 114, 116, 212, 214, 312, 314, 212i, 214i, 212j, 214j) is adapted to be coupled to a bond wire (460a, 460b) independently from the other electrically conductive layer (112, 114, 116, 212, 214, 312, 314, 212i, 214i, 212j, 214j) at a side surface of the printed circuit board being inclined to the top side and the bottom side of the printed circuit board. The invention further describes a corresponding method of fabricating the printed circuit board. The invention further describes a printed circuit board arrangement comprising the printed circuit board and a corresponding method of fabricating the printed circuit board arrangement.

公开(公告)号：US20180205166A1

公开(公告)日：2018-07-19

申请号：US15859906

申请日：2018-01-02

Applicant: Methode Electronics, Inc.

Inventor： Robert Skepnek ,  Joseph Llorens ,  Alexandros Pirillis

IPC: H01R12/81 ,  H01R12/77 ,  H01R12/82

CPC classification number: H01R12/81 ,  G02B6/4281 ,  G06F1/1632 ,  H01R12/62 ,  H01R12/772 ,  H01R12/82 ,  H01R35/02 ,  H05K1/028 ,  H05K1/147 ,  H05K2201/046 ,  H05K2201/2018

Abstract: A transceiver assembly is provided that includes a transceiver housing having first end, having a connector and an opposite second end having a passage in communication with a printed circuit board mounted in the housing. A peripheral connector having a first end and opposite second end includes a receptacle opening at the second end. A flex circuit is disposed between the first end of the peripheral connector and the second end of the transceiver housing. The peripheral connector is capable of being displaced with respect to the transceiver housing via the flex circuit.

公开(公告)号：US20170213923A1

公开(公告)日：2017-07-27

申请号：US15325045

申请日：2015-07-06

Applicant: Sumitomo Electric Industries, Ltd.

Inventor： Kazumasa Toya ,  Takashi Iwasaki ,  Youichi Nagai ,  Koji Mori ,  Kenji Saito ,  Rui Mikami ,  Takeshi Yamana

IPC: H01L31/0392 ,  H02S40/34 ,  H05K1/18 ,  H01L31/02 ,  H05K1/02 ,  H02S40/22 ,  H02S20/32

CPC classification number: H01L31/03926 ,  H01L31/02013 ,  H01L31/0508 ,  H01L31/0543 ,  H02S20/32 ,  H02S30/10 ,  H02S40/22 ,  H02S40/42 ,  H05K1/028 ,  H05K1/189 ,  H05K2201/046 ,  H05K2201/09263 ,  H05K2201/10121 ,  Y02E10/52

Abstract: This power generation module includes: a power generating portion (30) including a power generating element (19); and a wiring substrate. The wiring substrate includes: a reinforcement plate; and a flexible printed circuit (79) provided above the reinforcement plate. The flexible printed circuit (79) has: an FPC land portion (70) configured to have the power generating portion (30) mounted thereto; and a FPC wire portion (73) connected to the FPC land portion (70). The width of the FPC wire portion (73) is smaller than the width of the FPC land portion (70).

公开(公告)号：US20170212317A1

公开(公告)日：2017-07-27

申请号：US15328472

申请日：2015-07-22

Applicant: FCI USA LLC

Inventor： Alexander Eichler-Neumann ,  Michael Richter

IPC: G02B6/42

CPC classification number: G02B6/4281 ,  G02B6/4206 ,  G02B6/4245 ,  G02B6/4246 ,  G02B6/4257 ,  G02B6/4269 ,  G02B6/428 ,  G02B6/4292 ,  H05K1/147 ,  H05K3/0061 ,  H05K2201/046 ,  H05K2201/056 ,  H05K2201/10121

Abstract: The present disclosure relates to an optoelectrical connector module comprising a flexible circuit board (10) having a first region and a second region and a printed circuit board (PCB) (20) that is attached to the first region of the flexible circuit board, and an optical module (30) that is attached to the second region of the flexible circuit board. The optical module is configured to transmit and/or receive light signals. The optoelectrical connector module comprises further a rigid support structure (40) having a first and a second surface that enclose a defined angle. The first surface of the rigid support structure is thereby arranged in parallel to the PCB and the second surface of the rigid support structure is connected to the flexible circuit board opposite the second region.

公开(公告)号：US20160227652A1

公开(公告)日：2016-08-04

申请号：US14999145

申请日：2016-04-01

Applicant: James E. Clayton ,  Zakaryae Fathi

Inventor： James E. Clayton ,  Zakaryae Fathi

IPC: H05K3/36 ,  H05K3/32 ,  H05K3/40

CPC classification number: H05K3/363 ,  B23K1/0016 ,  B23K2101/42 ,  H05K1/141 ,  H05K3/32 ,  H05K3/366 ,  H05K3/40 ,  H05K2201/046 ,  H05K2201/048 ,  H05K2201/052 ,  Y10T29/49126 ,  Y10T156/1002

Abstract: A method for making an electrical circuit comprises the steps of: forming a rigid printed circuit board having a plurality of electrical contacts on at least one surface; forming a second rigid printed circuit board having a plurality of electrical components on at least one surface, and further having two flexible circuits area along one edge; forming electrode pads on the surfaces of the flexible circuits that are alignable respectively with the electrical contacts on the rigid circuit board when the two flexible circuits are spread apart by about 180°; spreading the flexible circuits apart and aligning the electrode pads respectively with the electrical contacts; and forming an electrical connection between the electrode pads and the electrical contacts.

Abstract translation: 一种制造电路的方法包括以下步骤：在至少一个表面上形成具有多个电触点的刚性印刷电路板; 在至少一个表面上形成具有多个电气部件的第二刚性印刷电路板，并且还沿着一个边缘具有两个柔性电路区域; 当两个柔性电路分开约180°时，在柔性电路的表面上分别形成可与电路板上的电触点对准的电极焊盘; 将柔性电路分开并将电极焊盘对准电触头; 以及在电极焊盘和电触点之间形成电连接。