公开(公告)号：JP2017107629A

公开(公告)日：2017-06-15

申请号：JP2015242586

申请日：2015-12-11

Applicant: 日東電工株式会社

Inventor： 田辺 浩之 ,  寺田 直弘 ,  杉本 悠 ,  山内 大輔

IPC: G11B21/21 ,  H05K1/05 ,  H05K3/44 ,  H05K3/28 ,  G11B5/60

CPC classification number: H05K1/05 ,  G11B5/483 ,  G11B5/4853 ,  H05K1/117 ,  H05K3/22 ,  H05K3/3442 ,  H05K3/4608 ,  H05K3/4644 ,  H05K2201/10151 ,  H05K2201/10227 ,  Y02P70/613

Abstract: 【課題】接続端子を、スライダの端子に対して確実に接続させることのできる回路付サスペンション基板、および、回路付サスペンション基板の製造方法を提供すること。 【解決手段】 回路付サスペンション基板1は、金属支持基板8と、金属支持基板8の上に配置されるベース絶縁層9と、ベース絶縁層9の上に配置され、スライダ4と電気的に接続されるヘッド側端子58を備える導体層10と、ヘッド側端子58を露出するように導体層10を被覆し、ベース絶縁層9の上に配置されるカバー絶縁層11と、ヘッド側端子58を被覆するめっき層12とを備え、カバー絶縁層11は、ベース絶縁層9の上に配置される第1カバー絶縁層71と、第1カバー絶縁層71の上に配置される第2カバー絶縁層72とを備え、めっき層12の厚みは、第1カバー絶縁層71の厚みと第2カバー絶縁層72の厚みとの総和以下である。 【選択図】図3

公开(公告)号：JP2013046057A

公开(公告)日：2013-03-04

申请号：JP2012161380

申请日：2012-07-20

Applicant: Kofukin Seimitsu Kogyo (Shenzhen) Yugenkoshi ,  鴻富錦精密工業(深▲セン▼)有限公司 ,  Hon Hai Precision Industry Co Ltd ,  鴻海精密工業股▲ふん▼有限公司

Inventor： ZHOU HAI-QING

IPC: H05K1/02

CPC classification number: G06F1/186 ,  H05K1/02 ,  H05K2201/09063 ,  H05K2201/10227 ,  H05K2201/10409

Abstract: PROBLEM TO BE SOLVED: To provide an electric circuit board having a handle which a user can easily hold.SOLUTION: The electric circuit board comprises: a circuit board body provided with at least one throughhole; at least one handle having a fixing end formed at one end thereof; and at least one connection part having an end wider than the width of the throughhole. The fixing end of the handle passes through the corresponding throughhole and is connected to the connection part, and the handle is mounted on an upper part of the circuit board body.

Abstract translation: 要解决的问题：提供一种具有用户可以容易地握持的手柄的电路板。 电路板包括：设置有至少一个通孔的电路板本体; 至少一个手柄，其一端形成有固定端; 以及具有比通孔的宽度更宽的端部的至少一个连接部件。 手柄的固定端通过相应的通孔，连接到连接部分，手柄安装在电路板主体的上部。 版权所有（C）2013，JPO＆INPIT

公开(公告)号：JP6260566B2

公开(公告)日：2018-01-17

申请号：JP2015062951

申请日：2015-03-25

Applicant: 株式会社オートネットワーク技術研究所 ,  住友電装株式会社 ,  住友電気工業株式会社

Inventor： 室野井 有 ,  陳 登

IPC: H05K7/06 ,  H02G3/16

CPC classification number: H05K1/0271 ,  H05K1/0204 ,  H05K1/0265 ,  H05K1/181 ,  H05K3/341 ,  H05K2201/068 ,  H05K2201/10227 ,  H05K2201/10272 ,  H05K2201/10416 ,  Y02P70/611

公开(公告)号：WO2019085572A1

公开(公告)日：2019-05-09

申请号：PCT/CN2018/099292

申请日：2018-08-08

Applicant: 匡海云

Inventor： 唐明宏

IPC: H05K3/32

CPC classification number: H05K1/18 ,  H05K3/325 ,  H05K3/34 ,  H05K2201/10227

Abstract: 本发明涉及一种电路板与导线的间接固定连接结构，包括电路板、导电布以及连接件，所述电路板上设有通孔焊盘；所述连接件的一部分埋设在所述导电布中，另一部分从导电布中裸露出来并与所述电路板上的通孔焊盘导电相连；所述导电布的外表面裹设有绝缘层。本发明采用导电布作为导线，在导电布的端部埋设有连接件，并通过连接件将导电布与所述电路板电性相连，结构简单，同时极大程度地增加了电路板与导线的连接柔性。

公开(公告)号：WO2016128243A1

公开(公告)日：2016-08-18

申请号：PCT/EP2016/052093

申请日：2016-02-01

Applicant: CONTI TEMIC MICROELECTRONIC GMBH

Inventor： BEART, Karin ,  MÜLLER, Stefan ,  SCHMIDT, Thomas ,  SCHUCH, Bernhard ,  WITTMANN, Frieder

IPC: H05K1/02 ,  H05K3/00 ,  H05K7/20

CPC classification number: H05K1/181 ,  H05K1/0204 ,  H05K1/11 ,  H05K3/0061 ,  H05K3/321 ,  H05K3/341 ,  H05K7/205 ,  H05K2201/066 ,  H05K2201/09745 ,  H05K2201/10227 ,  H05K2201/10545 ,  H05K2201/1056 ,  H05K2203/049

Abstract: Die Erfindung betrifft eine elektronische Komponente (E), umfassend -eine Leiterplatte (1) mit zwei sich gegenüberliegenden Flachseiten (1.2,1.3) und einer Mehrzahl elektronischer Bauteile (2), und -eine Grundplatte (3). Erfindungsgemäß ist vorgesehen, dass eine Anzahl der elektronischen Bauteile (2) auf einer rückseitigen Flachseite (1.2) der Leiterplatte (1) und eine weitere Anzahl der elektronischen Bauteile (2) auf einer vorderseitigen Flachseite (1.3) der Leiterplatte (1) jeweils fixiert und elektrisch leitend mit dieser verbunden sind, wobei die Grundplatte (3) mindestens eine erste Aussparung (3.1) zur Aufnahme elektronischer Bauteile (2) aufweist, die auf der rückseitigen Flachseite (1.2) der Leiterplatte (1) angeordnet sind. Die Erfindung betrifft weiterhin ein Verfahren zur Herstellung einer solchen elektronischen Komponente (E).

Abstract translation: 本发明涉及的电子部件（E），包括：（1）具有两个相对的平坦侧（1.2,1.3）和多个电子部件（2）的-a电路板，和-a基板（3）。 根据所提供的数字上的印刷电路板（1）和在所述印刷电路板的前平面侧（1.3）的电子部件（2）的进一步的数的后平面侧（1.2）的电子部件（2）根据（1）的发明中，每个固定和 导电连接于此，其中所述底板（3）包括至少一个第一凹部（3.1），用于容纳（2）安装在印刷电路板（1）被布置的后方平坦面（1.2）的电子元件。 本发明还涉及用于制备这样的电子部件（E）的方法。

公开(公告)号：US20230319975A1

公开(公告)日：2023-10-05

申请号：US17928356

申请日：2021-05-31

Applicant: MITSUBISHI MATERIALS CORPORATION

Inventor： Yoshiaki Sakaniwa ,  Toyo Ohashi

IPC: H05K1/02 ,  H05K1/03

CPC classification number: H05K1/0209 ,  H05K1/0313 ,  H05K2201/0154 ,  H05K2201/10227 ,  H05K3/0061

Abstract: There is provided an insulating resin circuit substrate including an insulating resin layer and a circuit layer consisting of a plurality of metal pieces disposed to be spaced apart in a circuit pattern shape on one surface of the insulating resin layer, in which in a case where a surface of the insulating resin layer in a gap between the metal pieces is analyzed by SEM-EDX, the area rate of a metal element constituting the metal pieces is less than 2.5%.

公开(公告)号：US20180168038A1

公开(公告)日：2018-06-14

申请号：US15892740

申请日：2018-02-09

Applicant: International Business Machines Corporation

Inventor： Ai Kiar Ang ,  Michael Lauri

IPC: H05K1/11 ,  H05K3/34 ,  H05K1/18 ,  H01L23/495 ,  H05K1/03 ,  H01L25/00 ,  H01L25/10 ,  H05K3/32 ,  H05K1/14 ,  H01L21/48

CPC classification number: H05K1/11 ,  H01L21/4839 ,  H01L23/49537 ,  H01L23/49555 ,  H01L23/49565 ,  H01L23/49575 ,  H01L25/105 ,  H01L25/50 ,  H01L2225/1029 ,  H01L2924/181 ,  H05K1/0313 ,  H05K1/144 ,  H05K1/18 ,  H05K1/181 ,  H05K3/328 ,  H05K3/341 ,  H05K3/3421 ,  H05K3/3426 ,  H05K2201/10015 ,  H05K2201/10227 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10962 ,  Y02P70/613 ,  H01L2924/00012

Abstract: A method includes forming a multi-stacked electronic device having two or more electronic components, each of the electronic components includes a leadframe, the leadframes of each electronic component are physically joined together using a non-solder metal joining process to form a joint, and the joint is located outside a solder connection region.

公开(公告)号：US20180153035A1

公开(公告)日：2018-05-31

申请号：US15880155

申请日：2018-01-25

Applicant: International Business Machines Corporation

Inventor： Ai Kiar Ang ,  Michael Lauri

IPC: H05K1/11 ,  H05K3/32 ,  H05K1/18 ,  H01L25/10 ,  H05K3/34 ,  H01L23/495 ,  H05K1/03 ,  H01L21/48 ,  H01L25/00 ,  H05K1/14

CPC classification number: H05K1/11 ,  H01L21/4839 ,  H01L23/49537 ,  H01L23/49555 ,  H01L23/49565 ,  H01L23/49575 ,  H01L25/105 ,  H01L25/50 ,  H01L2225/1029 ,  H01L2924/181 ,  H05K1/0313 ,  H05K1/144 ,  H05K1/18 ,  H05K1/181 ,  H05K3/328 ,  H05K3/341 ,  H05K3/3421 ,  H05K3/3426 ,  H05K2201/10015 ,  H05K2201/10227 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10962 ,  Y02P70/613 ,  H01L2924/00012

Abstract: A method includes forming a multi-stacked electronic device having two or more electronic components, each of the electronic components includes a leadframe, the leadframes of each electronic component are physically joined together using a non-solder metal joining process to form a joint, and the joint is located outside a solder connection region.

公开(公告)号：US20180049316A1

公开(公告)日：2018-02-15

申请号：US15557142

申请日：2016-03-15

Applicant: AutoNetworks Technologies, Ltd. ,  Sumitomo Wiring Systems, Ltd. ,  SUMITOMO ELECTRIC INDUSTRIES, LTD.

Inventor： Yu MURONOI ,  Tou CHIN

IPC: H05K1/02 ,  H05K3/34 ,  H05K1/18

CPC classification number: H05K1/0271 ,  H05K1/0204 ,  H05K1/0265 ,  H05K1/181 ,  H05K3/341 ,  H05K2201/068 ,  H05K2201/10227 ,  H05K2201/10272 ,  H05K2201/10416 ,  Y02P70/611

Abstract: A circuit structure that has a high rigidity, has high cooling performance for an electronic component, and can reduce electrical resistance between the electronic component and a bus bar. The circuit structure has a circuit board, bus bars, a binding material, metal chips, and electronic components. The circuit board has opening portions that penetrate in the thickness direction. The bus bars are overlaid on the circuit board. The binding material is interposed between the circuit board and the bus bars and binds them. The metal chips are arranged inside the opening portions and also placed on the bus bars. The metal chips each have a top face, which is located in approximately the same plane as an opening end face of an opening portion, and a bottom face, approximately the entire surface of which is joined to a bus bar. The electronic components are soldered to the circuit board and the top faces of the metal chips.

公开(公告)号：US20170339786A1

公开(公告)日：2017-11-23

申请号：US15671549

申请日：2017-08-08

Applicant: NITTO DENKO CORPORATION

Inventor： Hiroyuki TANABE ,  Naohiro TERADA ,  Yuu SUGIMOTO ,  Daisuke YAMAUCHI

IPC: H05K1/05 ,  H05K1/11 ,  G11B5/48 ,  H05K3/40 ,  H05K3/44

CPC classification number: H05K1/05 ,  G11B5/4826 ,  G11B5/484 ,  G11B5/4853 ,  H05K1/0278 ,  H05K1/0393 ,  H05K1/11 ,  H05K1/18 ,  H05K1/181 ,  H05K3/4007 ,  H05K3/44 ,  H05K2201/10151 ,  H05K2201/10227

Abstract: A suspension board with circuit includes a metal supporting board, a base insulating layer disposed at one side in a thickness direction of the metal supporting board, and a conductor layer disposed at one side in the thickness direction of the base insulating layer and including a connecting terminal electrically connected to a slider. The base insulating layer has a terminal region, when projected in the thickness direction, overlapped with at least the connecting terminal and a circumferential region not overlapped with the terminal region and around the terminal region, and the thickness of the terminal region is thicker than that of the circumferential region.