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    ELECTRONIC DEVICE
    51.
    发明公开
    ELECTRONIC DEVICE 审中-公开
    电子设备

    公开(公告)号：EP2690936A1

    公开(公告)日：2014-01-29

    申请号：EP12866411.7

    申请日：2012-05-30

    Applicant: Sanyo Electric Co., Ltd.

    Inventor： SAITO, Takao ,  OSHIMA, Makoto ,  OHASHI, Masaaki

    IPC: H05K1/18

    CPC classification number: H01R12/58 ,  H05K3/303 ,  H05K3/3447 ,  H05K3/3468 ,  H05K3/4015 ,  H05K2201/09063 ,  H05K2201/09854 ,  H05K2201/10295 ,  H05K2201/10393 ,  H05K2201/10409 ,  H05K2201/10787 ,  H05K2201/10803 ,  H05K2201/10863 ,  H05K2201/10871 ,  H05K2203/0455

    Abstract: The electronic device of the present invention is an electronic device configured by soldering a terminal member to a printed circuit board, the terminal member comprising a top surface into which a screw is threaded and a side surface at the end connected to the top surface, the side surface having convex parts fitted into through-holes in the printed circuit board; wherein the terminal member has at least two convex parts in the end edge on the printed circuit board side of the side surface, an electro conductive pattern is provided on the printed circuit board facing the end edge between the convex parts, solder is filled into a gap between the end edge and the electro conductive pattern, when the two convex parts are inserted into the through-holes provided to the electro conductive pattern, and electrical continuity is established between the end edge and the electro conductive pattern.

    Abstract translation: 本发明的电子设备是通过将端子构件焊接到印刷电路板而构成的电子设备，该端子构件包括螺钉被拧入的顶面和连接到顶面的端部的侧面， 具有装配在印刷电路板上的通孔中的凸起部分的侧表面; 其中，所述端子构件在所述侧面的所述印刷电路板侧的所述端缘中具有至少两个凸起部分，在所述印刷电路板上面向所述凸起部分之间的端缘设置有导电图案，焊料填充到 当两个凸部插入到设置于导电图案的通孔中时，端部边缘与导电图案之间的间隙，并且在端部边缘与导电图案之间建立电连续性。

    Electronic device and on-vehicle module
    53.
    发明公开
    Electronic device and on-vehicle module 有权
    Elektronische Vorrichtung und Fahrzeugmodul

    公开(公告)号：EP2101552A2

    公开(公告)日：2009-09-16

    申请号：EP08017982.3

    申请日：2008-10-14

    Applicant: Hitachi Ltd.

    Inventor： Yamashita, Shiro ,  Yoshinari, Hideto

    IPC: H05K3/30

    CPC classification number: H05K1/119 ,  H05K1/0366 ,  H05K1/056 ,  H05K1/141 ,  H05K3/308 ,  H05K3/42 ,  H05K2201/09827 ,  H05K2201/09854 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/1059 ,  H05K2201/10803 ,  Y10S439/941

    Abstract: In a module, press-fit connection using a pin terminal (1) including a connection part (2) separated into two parts and a flat plane (2a) parallel to the lengthwise direction in the separation part and perpendicular to the separation direction of the pin terminal (1) is performed. A through-hole of a board is structured so that (1) an inner diameter of the through-hole at a middle part in the thickness direction of the board is smaller than that at obverse and reverse surfaces of the board (4) and (2) the length of the middle part of the through-hole connected to the pin terminal (1) is shorter than the length of the flat plane (2a) of the pin terminal (1).

    Abstract translation: 在模块中，使用包括分成两部分的连接部分（2）和在分离部分中与长度方向平行的垂直于分离方向的平面（2a）的销端子（1）的压配合连接 引脚端子（1）。 板的通孔构造成使得（1）在板的厚度方向上的中间部分处的通孔的内径小于板（4）和（4）的正面和反面的内径， 2）连接到销端子（1）的通孔的中间部分的长度短于销端子（1）的平面（2a）的长度。

    Electronic component with high density, low cost attachment
    56.
    发明公开
    Electronic component with high density, low cost attachment 有权
    一种用于制备电子组件，其包括具有高密度，低成本安装的电子部件的过程

    公开(公告)号：EP2048924A2

    公开(公告)日：2009-04-15

    申请号：EP08163094.9

    申请日：2006-11-29

    Applicant: Amphenol Corporation

    Inventor： Gailus, Mark W. ,  Khilchenko, Leon M.

    IPC: H05K3/34 ,  H01L21/60

    CPC classification number: H05K3/3426 ,  H01L23/49811 ,  H01L24/80 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/351 ,  H05K2201/10704 ,  H05K2201/10795 ,  H05K2201/10803 ,  H05K2201/10924 ,  H05K2203/048 ,  Y02P70/613 ,  H01L2924/00

    Abstract: A contact tail for an electronic component compatible with surface mount manufacturing techniques. The contact tail is stamped, providing a relatively low manufacturing cost and high precision. High precision in the contact tails in turn provides more reliable solder joints across an array of contact tails in an electronic component. Further, the contact tail may be shaped to reduce the propensity for solder to wick from the attachment area during a reflow operation. Reducing the propensity of solder to wick reduces the chance that solder will interfere with the operation of the electronic component. Additionally, reducing the propensity for solder to wick allows pads to which the contact tail is attached to be positioned over vias, thereby increasing the density with which contacts may be attached to a substrate. The reliability with which electronic assemblies incorporating components using the contact tail is also increased when the contact tail is used in self-centering arrays.

    Abstract translation: 的接触尾部（272）用于在与表面兼容的电子元件装配的制造技术。 触头尾部被冲压，提供了一个相对较低的制造成本，精度高。 高精度在触点尾线又在以电子部件提供跨越到触点尾线的阵列更可靠的焊接接头。 此外，触头尾部可以被成形以降低的倾向焊料从所述附接区域中的回流操作期间灯芯。 降低焊料的倾向灯芯的几率降低焊锡没有将电子元件的干扰手术。 此外，减少了对焊料灯芯的倾向允许（302）到接触尾部被安装哪个焊盘到超过通孔（304）被定位，从而增加了密度与触点可以连接到基底上。 与电子组件结合使用触头尾部部件的可靠性，从而提高了当触点尾部在自动定心阵列中使用。

    ELECTRONIC COMPONENT WITH HIGH DENSITY, LOW COST ATTACHMENT
    57.
    发明公开
    ELECTRONIC COMPONENT WITH HIGH DENSITY, LOW COST ATTACHMENT 有权
    具有高密度，低成本附件的电子元器件

    公开(公告)号：EP1984981A2

    公开(公告)日：2008-10-29

    申请号：EP06851995.8

    申请日：2006-11-29

    Applicant: Amphenol Corporation

    Inventor： GAILUS, Mark, W. ,  KHILCHENKO, Leon, M.

    IPC: H01R12/00

    CPC classification number: H05K3/3426 ,  H01L23/49811 ,  H01L24/80 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/351 ,  H05K2201/10704 ,  H05K2201/10795 ,  H05K2201/10803 ,  H05K2201/10924 ,  H05K2203/048 ,  Y02P70/613 ,  H01L2924/00

    Abstract: A contact tail for an electronic component compatible with surface mount manufacturing techniques. The contact tail is stamped, providing a relatively low manufacturing cost and high precision. High precision in the contact tails in turn provides more reliable solder joints across an array of contact tails in an electronic component. Further, the contact tail may be shaped to reduce the propensity for solder to wick from the attachment area during a reflow operation. Reducing the propensity of solder to wick reduces the chance that solder will interfere with the operation of the electronic component. Additionally, reducing the propensity for solder to wick allows pads to which the contact tail is attached to be positioned over vias, thereby increasing the density with which contacts may be attached to a substrate. The reliability with which electronic assemblies incorporating components using the contact tail is also increased when the contact tail is used in self-centering arrays.

    Abstract translation: 与表面安装制造技术兼容的电子元件的触点尾部。 触点尾部被冲压，提供相对较低的制造成本和高精度。 触点尾部的高精度依次为电子元件中的一系列触点尾部提供更可靠的焊点。 此外，接触尾部可以被成形为降低在回流操作期间焊料从附接区域吸芯的倾向。 降低焊料对灯芯的倾向可降低焊料干扰电子元件工作的可能性。 此外，降低焊料至芯的倾向性允许接触尾部附接至的焊盘位于通孔上，由此增加接触件可附着至基板的密度。 当触点尾部用于自对中阵列时，使用触点尾部将电子部件并入组件的可靠性也得到提高。

    電子装置
    58.
    发明专利
    電子装置 有权
    该电子设备

    公开(公告)号：JPWO2013179404A1

    公开(公告)日：2016-01-14

    申请号：JP2013546466

    申请日：2012-05-30

    Applicant: パナソニックIpマネジメント株式会社

    Inventor： 孝夫 齋藤 ,  孝夫 齋藤 ,  誠 大島 ,  誠 大島

    IPC: H05K1/18 ,  H01R4/02 ,  H01R12/55

    CPC classification number: H01R12/58 ,  H05K3/303 ,  H05K3/3447 ,  H05K3/3468 ,  H05K3/4015 ,  H05K2201/09063 ,  H05K2201/09854 ,  H05K2201/10295 ,  H05K2201/10393 ,  H05K2201/10409 ,  H05K2201/10787 ,  H05K2201/10803 ,  H05K2201/10863 ,  H05K2201/10871 ,  H05K2203/0455 ,  Y02P70/613

    Abstract: 本発明の電子装置は、ネジが螺合する上面と当該面に繋がり端部に電装基板のスルーホールに嵌る凸部を有する側面とから成る端子部材を電装基板に半田付けして成る電子装置において、端子部材は側面の電装基板側の端縁に凸部を少なくとも2つ有しこれら凸部間の端縁と相対向する電装基板上に導電パターンを設け、この導電パターンに設けられたスルーホールに2つの凸部を挿入した際に端縁と導電パターンとの間に構成される隙間に半田をつけて端縁と前記導電パターンとを導通させるものである。

    Abstract translation: 本发明的电子设备是通过焊接进行的侧表面的具有凸螺纹电气设备基板部的端子部件形成的电子器件嵌入到通过电气元件安装板的引线端部的上表面和平面的孔，以啮合 ，设置在电气元件安装板的边缘和至少两个之间面向上的导体图案的端子构件具有这些突起安装的侧表面的板端边缘上的电组件上的突起，通过在导电性图案上的孔 它旨在进行，并且所述导电图案和与当插入到两个突起边缘和导电图案之间形成的间隙的焊接边缘。

    SUBSTRATE TERMINAL-EQUIPPED PRINTED CIRCUIT BOARD
    60.
    发明申请
    SUBSTRATE TERMINAL-EQUIPPED PRINTED CIRCUIT BOARD 审中-公开

    公开(公告)号：US20180062290A1

    公开(公告)日：2018-03-01

    申请号：US15683051

    申请日：2017-08-22

    Applicant: Sumitomo Wiring Systems, Ltd.

    Inventor： Hideki Goto

    IPC: H01R12/71 ,  H01R12/70

    CPC classification number: H01R12/718 ,  H01R4/02 ,  H01R12/526 ,  H01R12/585 ,  H01R12/7064 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/10295 ,  H05K2201/1059 ,  H05K2201/10787 ,  H05K2201/10803

    Abstract: Provided is a substrate terminal-equipped printed circuit board having configured to enable a substrate terminal to be fixed to a printed circuit board without using a pedestal, and to reduce the pressure and the insertion force applied to an inner surface of a through hole when the substrate terminal is press-fitted therein. A conducting portion of a substrate terminal includes: a press-fitted portion disposed at a proximal end portion thereof and is press-fitted into a through hole; and a loosely inserted portion that extends from the press-fitted portion to a distal end portion thereof, has a narrower width than the press-fitted portion, and is inserted into the through hole with a gap therebetween, and the press-fitted portion of the conducting portion is in pressure contact only with printed wiring provided on a surface layer of the printed circuit board and with an insulating layer located immediately below the printed wiring.

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