公开(公告)号：US11587911B2

公开(公告)日：2023-02-21

申请号：US17240789

申请日：2021-04-26

Applicant: 3D PLUS

Inventor： Christian Val

IPC: H01L25/065 ,  H01L23/48 ,  H01L25/00

Abstract: The field of the invention is that of producing 3D electronic modules, compatible with components operating beyond 1 GHz. The invention relates to a 3D electronic module featuring an interconnection between a horizontal conductor and a vertical conductor to which it is connected exhibits, in a vertical plane, a non-zero curvature. It also relates to the associated production process.

公开(公告)号：US20200003826A1

公开(公告)日：2020-01-02

申请号：US16455595

申请日：2019-06-27

Applicant: 3D PLUS

Inventor： Mohamed BOUSSADIA

IPC: G01R31/28

Abstract: An apparatus for burning in electronic components, which includes a plurality of assemblies placed in a holder, each assembly comprising a printed circuit board on which are placed sockets intended to receive electronic components and a burn-in driver. The holder is at room temperature, and each assembly comprises a single chamber that is regulated to a temperature T°>80° C., in which chamber at least four sockets are placed. The printed circuit board forming one wall of the chamber, the burn-in driver is soldered directly to the printed circuit board on the side exterior to the chamber, with a single burn-in driver per chamber, and the assembly furthermore comprises means for dissipating only the thermal energy of operation of the burn-in driver.

公开(公告)号：US20190356228A1

公开(公告)日：2019-11-21

申请号：US16469622

申请日：2017-12-15

Applicant: 3D PLUS

Inventor： Patrick DUBUS ,  Nicolas PERROT

IPC: H02M3/158 ,  H02M1/00

Abstract: A DC voltage converter of the quasi-resonant Buck type includes an input port having a first terminal designed to receive a voltage level to be converted, an output port having a first terminal designed to supply a converted voltage level, a first switch connected in series to the first terminal of the input port and a regulation circuit configured for: generating a ripple voltage, rising or falling depending on a closed or open state of the first switch; generating a setpoint signal proportional to a difference between an average level of converted voltage and a reference voltage; performing a first comparison between the setpoint signal and the converted voltage level to which the ripple voltage has been added; and depending on the result of the first comparison, generating or not an activation signal on its output controlling the closing of the first switch for a predefined period.

公开(公告)号：US20180172504A1

公开(公告)日：2018-06-21

申请号：US15843883

申请日：2017-12-15

Applicant: 3D PLUS

Inventor： Didier GAMBART

IPC: G01J1/02 ,  G01J1/42

CPC classification number: G01J1/0219 ,  G01J1/0204 ,  G01J1/0252 ,  G01J1/0271 ,  G01J1/42 ,  H01L27/14618 ,  H01L27/14683 ,  H04N5/2257

Abstract: A 3D imaging optoelectronic module intended to be fixed to an image-forming device comprises: an optoelectronic sensor comprising a package with a chip electrically connected to a stack of at least one printed circuit board, the sensor and stack assembly moulded in a resin and having faces according to Z with electrical interconnection tracks of the printed circuit boards. It comprises a thermally conductive rigid cradle in the form of a frame having a reference surface according to X, Y and: on a top surface: reference points intended to centre and align the image-forming device in relation to the reference surface, fixing points to allow the fixing of the image-forming device, and an inner bearing surface having bearing points of the sensor adjusted to centre and align the chip in relation to the reference surface.

公开(公告)号：US20180061731A1

公开(公告)日：2018-03-01

申请号：US15560479

申请日：2016-03-22

Applicant: 3D PLUS

Inventor： Christian VAL

IPC: H01L23/367 ,  H01L23/433 ,  H01L23/00

CPC classification number: H01L23/367 ,  H01L23/13 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L25/0657 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85205 ,  H01L2225/06513 ,  H01L2225/06589 ,  H01L2924/00014

Abstract: An electronic chip device with improved thermal resistance comprises at least one electrical connection pad with an electrical interconnection link, at least one thermal pad arranged on a face of the chip, at least one heat exchange element, and at least one thermal link between a thermal pad and a heat exchange element.

公开(公告)号：US20170372935A1

公开(公告)日：2017-12-28

申请号：US15621908

申请日：2017-06-13

Applicant: 3D PLUS

Inventor： Christian VAL

IPC: H01L21/683 ,  H01L25/00 ,  H01L23/00 ,  H05K3/32

CPC classification number: H01L21/6835 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3135 ,  H01L24/06 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/48 ,  H01L24/73 ,  H01L24/82 ,  H01L24/92 ,  H01L24/96 ,  H01L24/97 ,  H01L25/03 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2225/1035 ,  H01L2924/142 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/18165 ,  H01L2924/3511 ,  H05K3/321 ,  H01L2924/00014 ,  H01L2224/32225 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A method of collective fabrication of 3D electronic modules, each 3D electronic module comprising a stack of at least two, surface transferable, ball grid electronic packages, tested at their operating temperature and frequency comprises: a step of fabricating reconstituted wafers, each reconstituted wafer being fabricated according to the following sub-steps in the following order: A1)) the electronic packages are placed on a first sticky skin, balls side, B1) molding of the electronic packages in the resin and polymerization of the resin, to obtain the intermediate wafer, C1) thinning of the intermediate wafer on the face of the intermediate wafer opposite to the balls, D1) removal of the first sticky skin and placing of the intermediate wafer on a second sticky skin, side opposite to the balls, E1) thinning of the intermediate wafer on the balls side face, F1) formation of a balls side redistribution layer, G1) removal of the second sticky skin to obtain a reconstituted wafer of smaller thickness than the original thickness of the electronic packages, several reconstituted wafers having been obtained on completion of the previous sub-steps, stacking of the reconstituted wafers, dicing of the stacked reconstituted wafers to obtain 3D modules.

公开(公告)号：US20210391801A1

公开(公告)日：2021-12-16

申请号：US17342487

申请日：2021-06-08

Applicant: 3D PLUS

Inventor： Cédric COLONNA

IPC: H02M3/335 ,  H02M1/00 ,  H02M3/337

Abstract: A power converter having a parallel resonant circuit, includes an inverter, a resonant circuit, a transformer comprising a primary circuit and a secondary circuit, control means for the inverter, the inverter being connected to the resonant circuit, which is intended to be connected to an output load via the transformer, the power converter wherein the inverter comprises a first half-bridge and a second half-bridge in parallel with the first half-bridge, a first inductor between the first half-bridge and the resonant circuit, a second inductor between the second half-bridge and the resonant circuit, and in that the first and second inductors have the same inductance and are coupled in the opposite direction to one another.

公开(公告)号：US11067621B2

公开(公告)日：2021-07-20

申请号：US16455595

申请日：2019-06-27

Applicant: 3D PLUS

Inventor： Mohamed Boussadia

IPC: G01R31/28 ,  G05B1/00 ,  G01R1/00 ,  G11C5/00

Abstract: An apparatus for burning in electronic components, which includes a plurality of assemblies placed in a holder, each assembly comprising a printed circuit board on which are placed sockets intended to receive electronic components and a burn-in driver. The holder is at room temperature, and each assembly comprises a single chamber that is regulated to a temperature T°>80° C., in which chamber at least four sockets are placed. The printed circuit board forming one wall of the chamber, the burn-in driver is soldered directly to the printed circuit board on the side exterior to the chamber, with a single burn-in driver per chamber, and the assembly furthermore comprises means for dissipating only the thermal energy of operation of the burn-in driver.

公开(公告)号：US20210040620A1

公开(公告)日：2021-02-11

申请号：US16966805

申请日：2019-02-13

Applicant: 3D PLUS

Inventor： Christian VAL

IPC: C23C18/16 ,  C23C18/34 ,  C23C18/40 ,  H05K3/42

Abstract: A liquid-phase process is provided for depositing metal layers in holes of an electronic module placed in a hermetic chamber, from a chemical liquid containing metal compounds intended to form a metal layer. The holes have a depth P and a diameter D such that D>80 μm and P/D>10, and the process comprises at least one cycle comprising the following substeps: M1) bringing the chamber to a preset pressure P0 and filling the chamber with the liquid; M2) degassing the holes by bringing the chamber to a low pressure P1, with P1

公开(公告)号：US10727748B2

公开(公告)日：2020-07-28

申请号：US16469622

申请日：2017-12-15

Applicant: 3D PLUS

Inventor： Patrick Dubus ,  Nicolas Perrot

IPC: H02M3/158 ,  H02M1/00

Abstract: A DC voltage converter of the quasi-resonant Buck type includes an input port having a first terminal designed to receive a voltage level to be converted, an output port having a first terminal designed to supply a converted voltage level, a first switch connected in series to the first terminal of the input port and a regulation circuit configured for: generating a ripple voltage, rising or falling depending on a closed or open state of the first switch; generating a setpoint signal proportional to a difference between an average level of converted voltage and a reference voltage; performing a first comparison between the setpoint signal and the converted voltage level to which the ripple voltage has been added; and depending on the result of the first comparison, generating or not an activation signal on its output controlling the closing of the first switch for a predefined period.