公开(公告)号：KR3007548120000S

公开(公告)日：2014-07-31

申请号：KR3020130011509

申请日：2013-03-07

Applicant: (주)파트론

Designer： 김종태 ,  김태원 ,  오준혁 ,  윤금영

公开(公告)号：KR1020140058216A

公开(公告)日：2014-05-14

申请号：KR1020120124961

申请日：2012-11-06

Applicant: (주)파트론

Inventor： 강승렬 ,  윤금영 ,  김종태

IPC: H01P5/18

CPC classification number: H01P5/184 ,  H01P1/203 ,  H01P3/121

Abstract: Provided is a directional coupler which minimizes the loss of signals corresponding to the frequency. The directional coupler comprises a signal detection line and a signal line which are disposed adjacent to each other. The signal detection line comprises a first region, a second region, and a third region which are arranged in order. The first region and the third region may be separated from the signal line by a first distance. The second region may be separated from the signal line by a second distance which is different from the first distance.

Abstract translation: 提供了一种定向耦合器，其最小化对应于频率的信号的损失。 定向耦合器包括彼此相邻布置的信号检测线和信号线。 信号检测线包括依次布置的第一区域，第二区域和第三区域。 第一区域和第三区域可以与信号线分开第一距离。 第二区域可以与信号线分开与第一距离不同的第二距离。

公开(公告)号：KR101262878B1

公开(公告)日：2013-05-09

申请号：KR1020120017996

申请日：2012-02-22

Applicant: (주)파트론

Inventor： 김종태 ,  윤금영 ,  전문수

IPC: G03B13/36 ,  G02B7/04 ,  H04N5/225

CPC classification number: G03B13/36 ,  G02B7/08 ,  G03B3/10 ,  G03B5/00 ,  H02K41/0356 ,  H04N5/2257

Abstract: PURPOSE: A module actuator and a manufacturing method thereof are provided to form a terminal unit in a base through injection molding, thereby freely designing a module actuator by easily transforming a shape of the terminal unit. CONSTITUTION: A module actuator comprises a base(540), a housing unit(420), conductive springs(310,320), a terminal unit, and driving modules(210-260). The housing unit is arranged on the base and includes a through-hole extended in a first direction. The conductive springs are interposed between the base and the housing unit and include conductivity and elasticity. The terminal unit is arranged in the base, is electrically connected to the conductive springs, and includes a base layer formed of a LDS(Laser Direct Structure) resin and plating patterns arranged on the base layer. The driving module is connected to the conductive springs and arranged inside the through-hole of the housing unit. A magnet and a coil are electrically connected to the conductive springs are arranged in the outer periphery of the driving unit.

Abstract translation: 目的：提供一种模块致动器及其制造方法，以通过注射成型在基座中形成端子单元，从而通过容易地转换端子单元的形状来自由地设计模块致动器。 构成：模块致动器包括基座（540），壳体单元（420），导电弹簧（310,320），端子单元和驱动模块（210-260）。 壳体单元布置在基座上并且包括沿第一方向延伸的通孔。 导电弹簧介于基座和壳体单元之间，并且包括导电性和弹性。 端子单元布置在基座中，电连接到导电弹簧，并且包括由LDS（激光直接结构）树脂形成的基底层和布置在基底层上的电镀图案。 驱动模块连接到导电弹簧并布置在壳体单元的通孔的内部。 在驱动单元的外周设置有与导电弹簧电连接的磁铁和线圈。

公开(公告)号：KR1020120071919A

公开(公告)日：2012-07-03

申请号：KR1020100133655

申请日：2010-12-23

Applicant: (주)파트론

Inventor： 김재명 ,  윤금영 ,  오준혁 ,  정범기

IPC: H01L23/28 ,  H01L23/48

CPC classification number: H01L23/31 ,  H01L21/563 ,  H01L23/29 ,  H01L23/50 ,  H01L24/42

Abstract: PURPOSE: An IC chip molding package for a crystal device and a manufacturing method thereof are provided to micro-miniaturize the crystal device by loading a crystal on an IC chip molding package after the IC chip molding package is formed by molding an IC chip bonded on a supporting substrate. CONSTITUTION: A supporting substrate, which is made out of a plurality of metal plates with a certain pattern, is prepared(S210). An IC chip is bonded to the supporting substrate(S220). The IC chip bonded to the supporting substrate is molded(S230). An IC chip molding package is formed by molding the bonded IC chip using a protection material(S240). A crystal is loaded on the IC chip molding package(S250).

Abstract translation: 目的：提供一种用于晶体器件的IC芯片成型封装及其制造方法，通过在IC芯片成型封装之后将晶体加载在IC芯片成型封装上，使结晶器件通过模制IC 支撑基板。 构成：制备由具有一定图案的多个金属板制成的支撑基板（S210）。 将IC芯片接合到支撑基板（S220）。 模制与支撑基板接合的IC芯片（S230）。 通过使用保护材料成型接合IC芯片来形成IC芯片成型封装（S240）。 将晶体装载在IC芯片成型封装（S250）上。