Abstract:
A method for manufacturing an electronic package is provided to simplify processes and to improve reliability by forming a thermal conductive layer through an ink jet manner. An electronic device is prepared(S11). A thermal conductive adhesive ink is coated on a surface of the electronic device by using an ink jet manner(S12). The thermal conductive adhesive ink is made of an adhesive medium and a thermal conductive particle. A heat release unit is coupled to the surface of the electronic device on which the thermal conductive adhesive ink is coated(S13). The thermal conductive adhesive ink is filtered. The heat release unit is coupled through a thermo-compression bonding. The heat release unit is comprised of a heat release plate coupled to the surface of the electronic device and a heat release fin formed on the heat release plate.
Abstract:
A method of forming an ink-jet printed wiring is provided to decrease a width of the printed wiring by applying an electric field in a vertical direction on the printed wiring, while a heating process is performed on the printed wiring. A metal nano ink is provided. An ink-jet scheme is used to spray the metal nano ink on a substrate(10). A wiring(20) is printed. While a heating process(30) is performed on the wiring, an electric field is applied in a vertical direction on the wiring, with a predetermined distance between the wiring and an electrode. The metal nano ink includes at least one metal nano particle which is selected from the group consisting of Ag, Au, Cu, Ni, Pd, Pt, and an alloy thereof. The metal nano ink contains the metal nano particles by a concentration of 15 and 85 w% with respect to the overall ink.
Abstract:
A silicone-based adhesive composition, a method for treating the surface of a substrate by using the composition for forming a circuit wiring, a method forming a micropattern by using the surface-treated substrate, and a circuit board containing the micropattern are provided to improve the adhesion of wiring and the spreading of an ink and to lower the surface energy of a substrate. A silicone-based adhesive composition comprises 55-65 parts by weight of a vinyl polysiloxane-based silicone polymer; 30-45 parts by weight of a polydimethyl siloxane-based silicone adhesive; 4-8 parts by weight of a hydrogen polysiloxane-based resin; and 0.1-2 parts by weight of a platinum catalyst. Preferably the vinyl polysiloxane-based silicone polymer is represented by the formula 1 (wherein n is an integer of 100-1,000); and the polydimethyl siloxane-based silicone adhesive is represented by the formula 2 (wherein n is an integer of 5,000-140,000).
Abstract:
A calibration method and apparatus for an ink-jet head are provided to detect an abnormal nozzle, and to form a reliable micro metal wire by removing the deviation between nozzles with an error compensating algorithm. A calibration method for an ink-jet head includes the steps of: discharging an ink droplet through a nozzle(100); measuring the physical properties of the ink droplet(110); calculating the deviation between a reference value and the measurement value(120); compensating the deviation in case that the deviation exceeds a predetermined error range(130); and driving the ink-jet head to discharge the ink droplet according to the compensated volume. The second step includes the steps of: irradiating light to the ink droplet(112); storing an image by receiving the light(114); and measuring the physical properties by analyzing the image(116).
Abstract:
A method for forming a fine wiring is provided to reduce the number of repeated printing by forming the wiring with a water based ink and repeating printing with a non-water based ink. A method for forming a fine wiring includes the steps of: preparing a substrate(10) for a PCB(Printed Circuit Board); forming a water based ink coating layer(20) with a water based ink which includes metal nano-particles, on the substrate; and printing a non-water based ink coating layer(30) which includes metal nano-particles, on the water based ink coating layer.
Abstract:
A method for manufacturing nickel nanoparticles is provided to produce nickel nanoparticles with a smooth surface having uniform size and excellent dispersion stability by reducing a nickel-hydrazine complex formed in reverse microemulsion. A method for manufacturing nickel nanoparticles includes the steps of: (a) forming an aqueous solution comprising a nickel precursor, a surfactant, and a hydrophobic solvent; (b) adding a hydrazine-containing compound into the mixed solution to form a nickel-hydrazine complex; and (c) adding a reducing agent into the mixed solution containing the nickel-hydrazine complex to form nickel nanoparticles. The nickel precursor is at least one compound selected from the group consisting of NiCl2, Ni(NO3)2, NiSO4, and (CH3COO)2Ni.
Abstract:
극성 용매 하에서도 나노입자의 분산안정성이 우수하여 수율이 우수하고, 균일한 크기의 입자를 대량 생산할 수 있고, 다중산을 안정제로 사용하여 다른 고분자를 안정제로 사용하는 경우보다 소량의 첨가만으로도 입자의 크기 제어 및 분산 안정성을 가질 수 있는 금속 나노입자의 제조방법 및 이에 의해 제조된 나노입자를 제공한다. 본 발명의 일 측면에 따르면, 다중산(polyacid)을 안정제로 사용하여 극성 용매 하에서 금속 전구체로부터나노 사이즈의 금속입자를 제조하는 금속 나노입자의 제조방법을 제시할 수 있다. 여기서 환원제를 더 첨가할 수 있다. 금속 나노입자, 은 나노입자, 극성용매, 다중산, 폴리올
Abstract:
A method for forming thick layer by using a screen printing and a method for forming piezoelectric actuator of inkjet head are provided to uniformly control the forms formed on the piezoelectric film. A method for forming a thick layer by using a screen printing includes the steps of forming a guide groove with the predetermined depth on the surface for the thick film, and forming the thick film by coating inside of the guide groove with pasty material by screen printing. The guide groove has a planar shape same with the thick film. In the step of forming the thick film, after the material at a state of a paste is coated narrower than the width of the guide groove, the width of the material becomes the same width of the guide groove with being planarized.
Abstract:
토출될 잉크가 채워지는 압력 챔버가 형성된 유로 형성판과, 상기 유로 형성판 상의 서로 다른 위치에 형성되어 상기 압력 챔버를 덮는 둘 이상의 멤브레인과, 상기 각각의 멤브레인 상에 형성되어 각 인가전압에 따라 상기 각각의 멤브레인의 형태를 변형시키는 둘 이상의 액츄에이터 및 상기 각각의 액츄에이터에 상기 각 인가전압을 인가하는 신호 인가부를 포함하되, 상기 각 인가전압에 따른 상기 멤브레인의 변형에 의해 상기 압력 챔버 내의 잉크가 토출되도록 하는 잉크젯 프린트 헤드에 관한 것이다. 잉크젯 프린트 헤드의 구동력을 향상시킬 수 있고, 다수의 액츄에이터를 가짐으로써 하나의 액츄에이터가 망가지더라도 다른 액츄에이터를 이용할 수 있도록 하여 잉크젯 프린트 헤드의 수율을 향상시킬 수 있다. 잉크젯, 프린트 헤드, 액츄에이터, 멤브레인, 유로