터치 패널과 비어 홀 및 비어 전극 제조 방법
    61.
    发明公开
    터치 패널과 비어 홀 및 비어 전극 제조 방법 审中-实审
    触摸面板及其制作方法,用于通孔和电极

    公开(公告)号:KR1020140084879A

    公开(公告)日:2014-07-07

    申请号:KR1020120154868

    申请日:2012-12-27

    Abstract: The present invention relates to a touch panel and a manufacturing method for a via hole and a via hole electrode. The touch panel according to an embodiment of the present invention includes an electrode layer and a cover glass. First electrodes and second electrodes are alternatively arranged on the electrode layer. The cover glass is arranged on the electrode layer. A plurality of via holes and via electrodes filling the via holes are formed on the lower surface of the cover glass.

    Abstract translation: 本发明涉及触摸面板及其通孔和通孔电极的制造方法。 根据本发明的实施例的触摸面板包括电极层和覆盖玻璃。 第一电极和第二电极交替布置在电极层上。 盖玻璃布置在电极层上。 在盖玻璃的下表面上形成有多个通孔和填充通孔的通路电极。

    경화도 측정 장치 및 이를 이용한 측정 방법
    62.
    发明公开
    경화도 측정 장치 및 이를 이용한 측정 방법 审中-实审
    测量程度的设备和方法

    公开(公告)号:KR1020140084478A

    公开(公告)日:2014-07-07

    申请号:KR1020120153613

    申请日:2012-12-26

    Abstract: The present invention relates to an apparatus for measuring the degree of curing and a measuring method using the same. The apparatus for measuring the degree of curing comprises a base unit where a curing unit for storing a sample is placed, and which hardens the sample based on multiple curing environments different from one another; a curing environment setting unit which sets the multiple different curing environments; a measuring unit which measures the curing degree of the sample stored in the curing unit of the base unit; and a main control unit which calculates the relative curing degree of the sample measured by the measuring unit. Therefore, the apparatus for measuring the degree of curing can effectively perform a curing degree measuring process on a heat curing high polymer material in order to determine an optimum temperature and time for curing the heat curing high polymer material.

    Abstract translation: 本发明涉及一种测量固化程度的装置及其使用方法。 用于测量固化度的装置包括:基座单元,其中放置用于储存样品的固化单元,并且基于彼此不同的多个固化环境使样品硬化; 固化环境设定单元,其设定多种不同的固化环境; 测量单元,其测量存储在所述基座单元的固化单元中的样品的固化度; 以及主控制单元,其计算由所述测量单元测量的样本的相对固化度。 因此,为了确定固化高温聚合物材料的最佳温度和时间,用于测定固化度的装置能够有效地进行热固性高分子材料的固化度测定。

    패키지 기판 및 그 제조방법
    63.
    发明公开
    패키지 기판 및 그 제조방법 审中-实审
    包装基板及其制造方法

    公开(公告)号:KR1020140083512A

    公开(公告)日:2014-07-04

    申请号:KR1020120153373

    申请日:2012-12-26

    CPC classification number: H01L2224/10

    Abstract: The present invention relates to a package substrate and a manufacturing method thereof. According to an embodiment of the present invention, suggested is a package substrate which includes a circuit substrate where a solder resist layer has an open region; a chip device which is mounted on the circuit substrate and is connected to the pattern of the circuit substrate through the open region of the solder resist layer; a hydrophobic layer which is formed in the exposure region of the solder resist layer at least in the circuit substrate having the chip device; and a molding layer which covers the hydrophobic layer and protects the chip device. Also, a manufacturing method thereof is suggested.

    Abstract translation: 封装基板及其制造方法技术领域本发明涉及封装基板及其制造方法。 根据本发明的实施例,提出了一种封装基板,其包括其中阻焊层具有开放区域的电路基板; 芯片装置,其安装在电路基板上,并通过阻焊层的开放区域与电路基板的图案连接; 至少在具有芯片装置的电路基板中形成在阻焊层的曝光区域中的疏水层; 以及覆盖疏水层并保护芯片器件的成型层。 另外,提出了其制造方法。

    용액 내 포름알데히드 검출방법
    64.
    发明公开
    용액 내 포름알데히드 검출방법 审中-实审
    在溶液中检测甲醛的方法

    公开(公告)号:KR1020140081284A

    公开(公告)日:2014-07-01

    申请号:KR1020120150863

    申请日:2012-12-21

    Abstract: The present invention relates to a method for detecting formaldehyde in a solution, the method comprising the steps of: injecting formaldehyde in a reactor using a mobile phase organic solution; separating the formaldehyde by passing the solution through a reverse phase column; detecting the separated formaldehyde through a refractive index detector; and analyzing the detected formaldehyde. According to the present invention, formaldehyde in a solution, which is difficult to detect when the molecular weight thereof is low, can be easily detected without a complicated chemical pre-treating process by inducing a differential refractive index detector in liquid chromatography.

    Abstract translation: 本发明涉及一种用于检测溶液中甲醛的方法,所述方法包括以下步骤:使用流动相有机溶液在反应器中注射甲醛; 通过使溶液通过反相柱分离甲醛; 通过折射率检测器检测分离的甲醛; 并分析检测到的甲醛。 根据本发明,通过在液相色谱法中诱导差示折射率检测器,可以容易地检测到当分子量低时难以检测的溶液中的甲醛,而不需要复杂的化学预处理过程。

    산소 투과 방지막을 포함하는 드라이필름 포토레지스트 및 그 제조방법
    65.
    发明公开
    산소 투과 방지막을 포함하는 드라이필름 포토레지스트 및 그 제조방법 审中-实审
    具有氧气渗透性阻隔层的干膜胶片及其制造方法

    公开(公告)号:KR1020140081022A

    公开(公告)日:2014-07-01

    申请号:KR1020120150308

    申请日:2012-12-21

    Abstract: Provided is a dry film photoresist comprising: a supporter film having an oxygen permeable barrier layer on the upper part; a photosensitive resin layer formed on the oxygen permeable barrier layer; and a protection film formed on the photosensitive resin layer. According to the present invention, the oxygen permeable barrier layer is formed on the film of the supporter in order to prevent decrease in curing reaction due to oxygen penetration of the dry film photoresist, through which faulty process in production procedures can be minimized by reducing non-exfoliated residue.

    Abstract translation: 提供了一种干膜光致抗蚀剂,其包含:在上部具有透氧阻挡层的支撑膜; 形成在透氧阻挡层上的感光性树脂层; 以及形成在感光性树脂层上的保护膜。 根据本发明,为了防止干膜光致抗蚀剂的氧渗透导致的固化反应降低,可以在支撑体的膜上形成透氧阻挡层 脱落残留物。

    반도체 패키지 구조
    66.
    发明公开
    반도체 패키지 구조 审中-实审
    半导体封装结构

    公开(公告)号:KR1020140080114A

    公开(公告)日:2014-06-30

    申请号:KR1020120149566

    申请日:2012-12-20

    CPC classification number: H01L2224/10 H01L2924/15311

    Abstract: Disclosed is a semiconductor package structure. The semiconductor package structure includes a package substrate; a cavity formed to depress a portion of the package substrate; an interposer installed to be inserted into the cavity; and a semiconductor chip mounted on the interposer. The semiconductor package structure prevents the whole thickness of the semiconductor package from being thicker due to the use of the interposer by forming the semiconductor package structure in a method of inserting the interposer into an FC-BGA.

    Abstract translation: 公开了半导体封装结构。 半导体封装结构包括封装衬底; 形成为压缩所述封装基板的一部分的空腔; 插入器被安装以插入腔中; 以及安装在插入件上的半导体芯片。 半导体封装结构通过在将插入器插入FC-BGA的方法中形成半导体封装结构,由于使用了插入件,因此半导体封装的整体厚度不会变厚。

    경화도 측정장치
    67.
    发明公开
    경화도 측정장치 审中-实审
    测量程度的测量设备

    公开(公告)号:KR1020140063159A

    公开(公告)日:2014-05-27

    申请号:KR1020120130180

    申请日:2012-11-16

    CPC classification number: G01N21/47 G01N21/274 G01N2021/4769

    Abstract: The present invention relates to a hardness measurement device, and more specifically, to a hardness measurement device which can be carried and used in a production line. The present invention comprises: a light source; a light-penetrating/reflecting mirror which penetrates light irradiated from the light source and reflects scattered light reflected and coming back from a sample; a light splitting mirror which penetrates and reflects the scattered light to detect intensity of the scattered light reflected through the light-penetrating/reflecting mirror; a detector for detecting the intensity of the penetrated and reflected through the light splitting mirror; and a data acquisition unit for collecting intensity data of the scattered light detected through the detector.

    Abstract translation: 硬度测量装置技术领域本发明涉及一种硬度测量装置,更具体地说,涉及可在生产线中承载和使用的硬度测量装置。 本发明包括:光源; 穿透/反射镜,其穿透从光源照射的光并反射从样品反射回来的散射光; 透射并反射散射光的分光镜,以检测通过透光/反射镜反射的散射光的强度; 检测器,用于检测通过分光镜的穿透和反射的强度; 以及数据获取单元,用于收集通过检测器检测到的散射光的强度数据。

    기판 절연층 조성물, 이를 이용한 프리프레그 및 기판
    68.
    发明公开
    기판 절연층 조성물, 이를 이용한 프리프레그 및 기판 审中-实审
    用于基材,PREPREG和使用该基材的基材的绝缘组合物

    公开(公告)号:KR1020130118572A

    公开(公告)日:2013-10-30

    申请号:KR1020120041538

    申请日:2012-04-20

    Abstract: PURPOSE: A composition for insulation layer is provided to lower a thermal expansion coefficient by adding a graphene oxide and a metal alkoxide, minimize size distortion when used as an insulation materials for substrates, and rapidly improve strength and rigidity by adding short fiber. CONSTITUTION: A composition for insulation layer comprises: a soluble liquid crystal thermosetting oligomer, a metal alkoxide, a graphene oxide, and a short fiber. The average molecular weight of the soluble liquid crystal thermosetting oligomer is 500-15,000. The metal of the metal alkoxide is selected from the group comprising Ti, Al, Ge, Co, Ca, Hf, Fe, Ni, Nb, Mo, La, Re, Sc, Si, Ta, W, Y, Zr, and V. The metal alkoxide comprises a substrate for covalent bonding with a thermosetting group contained in the soluble liquid crystal thermosetting oligomer. [Reference numerals] (AA) Example 1; (BB) Comparative example 3; (CC) Comparative example 2; (DD) Comparative example 1; (EE) Reference example

    Abstract translation: 目的:提供一种用于绝缘层的组合物,通过添加石墨烯氧化物和金属醇盐来降低热膨胀系数,当用作基材的绝缘材料时使尺寸变形最小化,并通过添加短纤维快速提高强度和刚性。 构成:用于绝缘层的组合物包括:可溶性液晶热固性低聚物,金属醇盐,氧化石墨烯和短纤维。 可溶性液晶热固性低聚物的平均分子量为500-15,000。 金属醇盐的金属选自Ti,Al,Ge,Co,Ca,Hf,Fe,Ni,Nb,Mo,La,Re,Sc,Si,Ta,W,Y,Zr和V 金属醇盐包括与可溶性液晶热固性低聚物中所含的热固性基团共价键合的基材。 (标号)(AA)实施例1; (BB)比较例3; (CC)比较例2; (DD)比较例1; (EE)参考示例

    경화도 측정 보조장치 및 이를 이용한 경화도 측정방법
    69.
    发明公开
    경화도 측정 보조장치 및 이를 이용한 경화도 측정방법 无效
    用于测量固化程度的辅助装置和使用其的固化程度的测量方法

    公开(公告)号:KR1020130052877A

    公开(公告)日:2013-05-23

    申请号:KR1020110118194

    申请日:2011-11-14

    Abstract: PURPOSE: A hardness measurement assisting device and a hardness measuring method using the same are provided to control the amount of light irradiated on each point of a sample by a shielding unit arranged to be movable, thereby curing the sample in order to change hardness successively. CONSTITUTION: A hardness measurement assisting device(100) comprises a base(120) where a sample is mounted, a shielding member(140), and a driving unit(160). The shielding member blocks or allows the sample so that the total light amount is consecutively changed from one side of a sample and to the other side of the sample. The driving unit is installed on the base and connected to the shielding member, thereby moving the shielding member.

    Abstract translation: 目的:提供一种硬度测量辅助装置和使用该硬度测量辅助装置的硬度测量方法,以通过布置成可移动的屏蔽单元来控制照射在样品的每个点上的光量,从而固化样品以连续改变硬度。 构成:硬度测量辅助装置(100)包括安装样品的基座(120),屏蔽构件(140)和驱动单元(160)。 屏蔽构件阻挡或允许样品,使得总光量从样品的一侧和样品的另一侧连续变化。 驱动单元安装在基座上并连接到屏蔽构件,从而移动屏蔽构件。

Patent Agency Ranking