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公开(公告)号：KR1020150070678A
公开(公告)日：2015-06-25
申请号：KR1020130157175
申请日：2013-12-17
Applicant: 삼성전기주식회사
IPC: H04N5/225 , H01L27/146 , G03B17/00
CPC classification number: G02B7/003 , H04N5/2257
Abstract: 본발명은카메라모듈에관한것으로, 인쇄회로기판에실장된이미지센서와, 상기이미지센서의상면에형성된기준마크및 상기인쇄회로기판의상부에상기기준마크를기준으로정렬되어결합되도록렌즈조립체가구비된하우징을포함한다.
Abstract translation: 本发明涉及一种相机模块，包括：安装在印刷电路基板上的图像传感器; 形成在图像传感器的上表面上的参考标记; 以及壳体，其具有通过在印刷电路基板的顶部处的参考标记周围对准而组合的透镜组件。
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公开(公告)号：KR1020150066164A
公开(公告)日：2015-06-16
申请号：KR1020130151393
申请日：2013-12-06
Applicant: 삼성전기주식회사
IPC: H05K13/04
CPC classification number: H05K3/305 , H05K1/0269 , H05K2203/161 , H05K2203/166 , Y02P70/613
Abstract: 본발명은접착력이향상된전자부품의접합방법에관한것으로, 인쇄회로기판을준비하는단계; 상기인쇄회로기판의전자푸품접착영역에광배향성고분자도포하는단계; UV를조사하여상기광배향성고분자를배향하는단계; 상기광배향성고분자상에접착제를도포하는단계; 상기접착제상에상기전자부품을실장하는단계; 를포함할수 있다.
Abstract translation: 本发明涉及一种胶粘具有改进粘合性的电子部件的方法，包括：准备印刷电路板的步骤; 将光取向聚合物扩散到印刷电路板上的电子部件粘附区域上的步骤; 通过辐射紫外线定向光取向聚合物的步骤; 在光取向聚合物上涂胶的步骤; 以及将电子部件安装在胶水上的步骤。
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公开(公告)号：KR1020150019400A
公开(公告)日：2015-02-25
申请号：KR1020130096211
申请日：2013-08-13
Applicant: 삼성전기주식회사
CPC classification number: B01D53/78 , H05K3/00 , H05K2203/08
Abstract: 본 발명은 인쇄회로기판 제조공정용 정화장치 및 이를 이용한 정화방법을 제공한다. 구체적으로는, 본 발명의 대표적인 실시 예에 따른 인쇄회로기판 제조공정용 정화장치 및 이를 이용한 정화방법에 있어서, 용수 저장탱크에 산 용액 저장탱크를 연결하여, 용수 내의 pH가 미리 설정된 pH를 초과할 경우 산 용액을 공급함으로써 정화탑 내의 스케일이 발생하는 것을 방지할 수 있다.
Abstract translation: 本发明提供了一种印刷电路板制造工艺的净化装置及其使用方法。 根据本发明的代表性实施例，当水的pH超过预定pH时，储水箱与酸溶液储罐连接以提供酸溶液。 因此，可以防止在净化塔中产生垢。 该装置包括：净化塔，其中废气与从外部供应的水接触; 储水罐; 酸溶液储罐; 以及当水的pH超过预定pH时供应酸溶液的对照部分。
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公开(公告)号：KR1020140147410A
公开(公告)日：2014-12-30
申请号：KR1020130070598
申请日：2013-06-19
Applicant: 삼성전기주식회사
IPC: H01L27/146 , H01L25/04 , H01L25/10
CPC classification number: H01L27/14618 , H01L25/041 , H01L25/105 , H01L27/14625 , H01L27/14632 , H01L27/14687 , H01L2924/0002 , H01L27/14605 , H01L2924/00
Abstract: The present invention relates to an image sensor module and a manufacturing method thereof. The image sensor module according to the embodiment of the present invention includes a base substrate including a groove for mounting an image sensor which includes a first groove and a second groove with stepped shapes, and the image sensor which is mounted on the groove of the base substrate. The image sensor is in surface contact with the first groove. An adhesive is filled in the second groove. The first groove is made of metal.
Abstract translation: 图像传感器模块及其制造方法技术领域本发明涉及图像传感器模块及其制造方法。 根据本发明的实施例的图像传感器模块包括：基底基板，包括用于安装图像传感器的凹槽，图像传感器包括第一凹槽和具有阶梯形状的第二凹槽，以及安装在基底的凹槽上的图像传感器 基质。 图像传感器与第一凹槽表面接触。 粘合剂填充在第二槽中。 第一个槽由金属制成。
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公开(公告)号：KR1020140147370A
公开(公告)日：2014-12-30
申请号：KR1020130070479
申请日：2013-06-19
Applicant: 삼성전기주식회사
Abstract: Disclosed is a specimen grinding apparatus. The present invention includes: a frame disposed on an upper side of a grinding film which grinds a specimen; a supporting unit coupled with the frame, and supports the specimen such that an end portion of the specimen is in contact with a surface of the grinding film in a case where the specimen is grounded; and a sensor disposed in the supporting unit to face the grinding film to measure the thickness of the specimen by measuring the distance between the supporting unit and the grinding film.
Abstract translation: 公开了一种试样研磨装置。 本发明包括：设置在研磨试样的研磨膜的上侧的框架; 与框架结合的支撑单元，并且在样本接地的情况下支撑样本，使得样本的端部与研磨膜的表面接触; 以及设置在所述支撑单元中以与所述研磨膜相对的传感器，以通过测量所述支撑单元和所述研磨膜之间的距离来测量所述样本的厚度。
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Patent Agency Ranking
公开(公告)号：KR1020140086537A
公开(公告)日：2014-07-08
申请号：KR1020120157169
申请日：2012-12-28
Applicant: 삼성전기주식회사
IPC: H01B3/46 , C08L83/04 , C07D403/10
CPC classification number: H05K1/0373 , H05K1/0353 , H05K2201/0141 , H05K2201/0251 , H05K2201/026
Abstract: The present invention relate to a soluble and thermosetting liquid crystal oligomer with polysilsesquioxane (POSS) bonded with a main chain of the soluble and thermosetting liquid crystal oligomer; an insulative layer composition including the same; and a substrate including the insulative layer using the insulative layer composition. In accordance with the present invention, a coefficient of thermal expansion can be effectively lowered by adding a material of a hybrid structure, in which polysilsesquioxane and a derivative thereof are introduced to the main chain of the solution and thermosetting liquid crystal oligomer, to the insulative layer composition. The present invention can also make a substrate with enhanced thermal stability and minimizing dimensional deformation by heat, using the insulative layer composition as an insulative material of the substrate.
Abstract translation: 本发明涉及与可溶性和热固性液晶低聚物的主链结合的聚倍半硅氧烷（POSS）的可溶性和热固性液晶低聚物; 包含其的绝缘层组合物; 以及包含使用该绝缘层组合物的绝缘层的基板。 根据本发明，通过将聚倍半硅氧烷及其衍生物引入溶液的主链和热固性液晶低聚物的混合结构材料添加到绝缘体中，可以有效地降低热膨胀系数 层组成。 本发明还可以使用绝缘层组合物作为基板的绝缘材料，制造具有增强的热稳定性和最小化热的尺寸变形的基板。
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公开(公告)号：KR1020140086474A
公开(公告)日：2014-07-08
申请号：KR1020120157023
申请日：2012-12-28
Applicant: 삼성전기주식회사
CPC classification number: H05K1/0209 , H01L23/36 , H01L23/3737 , H01L2924/0002 , H05K3/0061 , H05K2201/0187 , H05K2201/0209 , H01L2924/00
Abstract: An embodiment of the present invention relates to a circuit board module. The circuit board module includes a heat radiation member; a thermally conductive film disposed on the heat radiation member and including a thermally conductive filler; a circuit board formed on the thermally conductive film; and a heating element disposed on the circuit board. The thermally conductive filler is distributed in a first region corresponding to the heating element among the thermally conductive film and a second region extended from the first region by a predetermined distance on a plane.
Abstract translation: 本发明的实施例涉及电路板模块。 电路板模块包括散热构件; 导热膜，其设置在所述散热构件上并且包括导热填料; 形成在导热膜上的电路板; 以及设置在电路板上的加热元件。 导热性填料分布在对应于导热膜中的加热元件的第一区域和从第一区域在平面上延伸预定距离的第二区域。
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公开(公告)号：KR1020140086417A
公开(公告)日：2014-07-08
申请号：KR1020120156866
申请日：2012-12-28
Applicant: 삼성전기주식회사
IPC: H01L23/00 , H01L23/528 , H01L23/48
CPC classification number: H01L2224/48091 , H01L2224/73265 , H01L24/97 , H01L23/481 , H01L23/5286 , H01L2924/00014
Abstract: The present invention relates to a semiconductor package and a manufacturing method thereof. The semiconductor package according to the present invention comprises a substrate which forms a base of the semiconductor package; an interposer formed on the substrate to facilitate the bonding between the substrate and a semiconductor chip mounted on the substrate; and at least one semiconductor chip which is stacked to be mounted on the substrate by using the interposer, wherein a ground layer for grounding is formed on the interposer, and the semiconductor chip and the ground layer as well as the substrate and the ground layer are connected by a connection via. According to the present invention, a ground layer for grounding is installed on the interposer, and the ground layer for grounding and the interposer are connected by the connection via instead of a wire, thereby providing a stable reference voltage with respect to a common signal and improving stability of a signal by reducing noise.
Abstract translation: 半导体封装及其制造方法技术领域本发明涉及半导体封装及其制造方法。 根据本发明的半导体封装包括形成半导体封装的基极的衬底; 形成在所述基板上以便于所述基板与安装在所述基板上的半导体芯片之间的接合的插入器; 以及至少一个半导体芯片，其通过使用所述插入件被层叠以安装在所述基板上，其中在所述插入件上形成用于接地的接地层，并且所述半导体芯片和所述接地层以及所述基板和所述接地层是 通过连接通过连接。 根据本发明，用于接地的接地层安装在插入器上，并且用于接地的接地层和插入器通过连接通路而不是线连接，从而相对于公共信号提供稳定的参考电压，并且 通过降低噪声来提高信号的稳定性。
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公开(公告)号：KR1020140081358A
公开(公告)日：2014-07-01
申请号：KR1020120151013
申请日：2012-12-21
Applicant: 삼성전기주식회사
CPC classification number: G01N19/04 , G01N1/286 , G01N2203/0023 , G01N2203/0298
Abstract: A method for evaluating bonding strength, according to the present invention, includes a step for setting a micro-zone including a bonding boundary on a sample for evaluation; a step for forming a first groove having a predetermined depth around the micro-zone; a step for forming a second groove connected to the bonding boundary by processing the sides of the micro-zone; and a step for measuring a critical point where detachment of the micro-zone occurs by pressurizing the micro-zone.
Abstract translation: 根据本发明的评价接合强度的方法包括将用于评价的样品上的包含接合边界的微区设定的步骤; 用于形成具有围绕微区的预定深度的第一凹槽的步骤; 通过加工微区的侧面形成连接到接合边界的第二槽的步骤; 以及通过对微区进行加压来测量微区发生分离的临界点的步骤。
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公开(公告)号：KR1020140078215A
公开(公告)日：2014-06-25
申请号：KR1020120147311
申请日：2012-12-17
Applicant: 삼성전기주식회사
IPC: C23C16/448 , C23C16/455
CPC classification number: C23C16/46 , C23C16/4488
Abstract: The present invention relates to a chemical vapor deposition device for accurate and precise deposition and a chemical vapor deposition method using the same. The chemical vapor deposition device according to the present invention comprises a reaction chamber; a heating part for heating the reaction chamber; a preliminary chamber coupled to one end of the reaction chamber; and a transfer part arranged in the preliminary chamber and transferring precursors to the reaction chamber.
Abstract translation: 本发明涉及一种用于精确和精确沉积的化学气相沉积装置以及使用其的化学气相沉积方法。 根据本发明的化学气相沉积装置包括反应室; 用于加热反应室的加热部件; 耦合到反应室的一端的初级室; 以及设置在预备室中并将前体转移到反应室的转印部分。
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