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1.发明公开
公开(公告)号：KR1020150000296A
公开(公告)日：2015-01-02
申请号：KR1020130072568
申请日：2013-06-24
Applicant: 삼성전기주식회사
Abstract: 본 발명은 금속-수지 접합 구조물에 관한 것으로, 본 발명의 실시예에 따른 금속-수지 접합 구조물은 수지층, 수지층에 접합된 금속층, 그리고 수지층과 금속층의 접합면에 제공되어 수지층과 금속층 간의 접합력을 제공하기 위해 실란계 커플링제를 함유하는 개질층을 포함한다.
Abstract translation: 本发明提供一种能够提高产品的安全性和可靠性的金属树脂粘合结构体，其制造方法以及具有金属 - 树脂粘合结构的电路板和覆铜层压板。 根据本发明实施方案的金属 - 树脂粘合结构包括：树脂层; 粘附到树脂层的金属层; 以及设置在树脂层和金属层上并含有硅烷基偶联剂以在树脂层和金属层之间提供粘附力的重整层。
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公开(公告)号：KR1020140084478A
公开(公告)日：2014-07-07
申请号：KR1020120153613
申请日：2012-12-26
Applicant: 삼성전기주식회사
Abstract: The present invention relates to an apparatus for measuring the degree of curing and a measuring method using the same. The apparatus for measuring the degree of curing comprises a base unit where a curing unit for storing a sample is placed, and which hardens the sample based on multiple curing environments different from one another; a curing environment setting unit which sets the multiple different curing environments; a measuring unit which measures the curing degree of the sample stored in the curing unit of the base unit; and a main control unit which calculates the relative curing degree of the sample measured by the measuring unit. Therefore, the apparatus for measuring the degree of curing can effectively perform a curing degree measuring process on a heat curing high polymer material in order to determine an optimum temperature and time for curing the heat curing high polymer material.
Abstract translation: 本发明涉及一种测量固化程度的装置及其使用方法。 用于测量固化度的装置包括：基座单元，其中放置用于储存样品的固化单元，并且基于彼此不同的多个固化环境使样品硬化; 固化环境设定单元，其设定多种不同的固化环境; 测量单元，其测量存储在所述基座单元的固化单元中的样品的固化度; 以及主控制单元，其计算由所述测量单元测量的样本的相对固化度。 因此，为了确定固化高温聚合物材料的最佳温度和时间，用于测定固化度的装置能够有效地进行热固性高分子材料的固化度测定。
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公开(公告)号：KR1020140081022A
公开(公告)日：2014-07-01
申请号：KR1020120150308
申请日：2012-12-21
Applicant: 삼성전기주식회사
IPC: G03F7/09 , G03F7/20 , H01L21/027
CPC classification number: G03F7/092 , G03F7/11 , G03F7/16 , G03F7/343 , G03F7/70058 , H01L21/0274
Abstract: Provided is a dry film photoresist comprising: a supporter film having an oxygen permeable barrier layer on the upper part; a photosensitive resin layer formed on the oxygen permeable barrier layer; and a protection film formed on the photosensitive resin layer. According to the present invention, the oxygen permeable barrier layer is formed on the film of the supporter in order to prevent decrease in curing reaction due to oxygen penetration of the dry film photoresist, through which faulty process in production procedures can be minimized by reducing non-exfoliated residue.
Abstract translation: 提供了一种干膜光致抗蚀剂，其包含：在上部具有透氧阻挡层的支撑膜; 形成在透氧阻挡层上的感光性树脂层; 以及形成在感光性树脂层上的保护膜。 根据本发明，为了防止干膜光致抗蚀剂的氧渗透导致的固化反应降低，可以在支撑体的膜上形成透氧阻挡层 脱落残留物。
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公开(公告)号：KR1020150007761A
公开(公告)日：2015-01-21
申请号：KR1020130082205
申请日：2013-07-12
Applicant: 삼성전기주식회사
Abstract: 본 발명은 유기 고분자 분리장치에 관한 것으로, 유기 고분자가 포함된 용액을 공급하며, 균일한 크기로 용액을 토출하는 토출부와, 상기 토출부의 하부에 구비되며, 상기 토출부에서 토출되는 용액이 안착되는 금속판과, 상기 금속판을 가열하는 가열부 및 상기 토출부와 가열부를 제어하는 제어부를 포함한다.
Abstract translation: 本发明涉及有机聚合物分离装置。 根据本发明，有机聚合物分离装置包括：排出部，供给含有有机聚合物的溶液，并使溶液均匀排出; 安装在排出部的下侧的金属板，使从排出部排出的溶液安装在其上; 加热部件加热金属板; 以及控制排出部和加热部的控制部。 根据本发明的有机聚合物分离装置，能够均匀地分离有机聚合物的尺寸，即使有机聚合物的量少，也可以使用红外光谱法精确地分析有机聚合物的成分。 此外，有机聚合物分离装置能够通过加热部分在正常温度下加热金属板而不移动金属板，从而安全地分离有机聚合物并提高分离有机聚合物的效率。
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Patent Agency Ranking
公开(公告)号：KR1020140148194A
公开(公告)日：2014-12-31
申请号：KR1020130071818
申请日：2013-06-21
Applicant: 삼성전기주식회사
IPC: G01N27/26 , G01N27/416
Abstract: The present invention relates to a real-time monitoring device of process liquid comprising: a body part which has a flow path having an inlet and an outlet; a mixing pipe which is connected to the inlet; first and second connection pipes which are connected to the mixing pipe; a heater part which is located on one surface of the body part; and a detector which is connected to the outlet.
Abstract translation: 本发明涉及一种处理液体的实时监测装置，包括：主体部分，其具有具有入口和出口的流路; 连接到入口的混合管; 连接到混合管的第一和第二连接管; 位于身体部分的一个表面上的加热器部分; 以及连接到出口的检测器。
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公开(公告)号：KR1020140020661A
公开(公告)日：2014-02-19
申请号：KR1020120087912
申请日：2012-08-10
Applicant: 삼성전기주식회사
CPC classification number: H05K3/0094 , H05K3/225 , H05K3/4069 , H05K3/42 , H05K2203/121 , Y10T29/49004 , Y10T29/49124
Abstract: The present invention relates to a method for repairing a via in which a dimple phenomenon is generated if a dimple error is generated in a via forming process for electrically connecting layers on a multilayer circuit board. The method for repairing the via according to an embodiment of the present invention includes the steps of: determining the dimple error of the via by measuring the thickness of the via; and repairing the via with the dimple error. [Reference numerals] (S110) Complete a via filling process; (S120) Determine the dimple error of the via; (S130) Measured thickness of the via is satisfied with a predetermined thickness?; (S140) End; (S150) Select a detailed repair method; (S160) Refilling thickness of the via is 5μm or greater?; (S170) Select a first repair process; (S180) Perform a first repair process; (S190) Select a second repair process; (S200) Perform a second repair process
Abstract translation: 本发明涉及一种修补通孔的方法，其中如果在用于电连接多层电路板上的层的通孔形成工艺中产生凹坑误差，则产生凹坑现象。 根据本发明的实施例的修补通孔的方法包括以下步骤：通过测量通孔的厚度来确定通孔的凹坑误差; 并用凹坑错误修复通孔。 （参考号）（S110）完成通孔填充处理; （S120）确定通孔的凹坑误差; （S130）以规定的厚度θ满足通孔的测定厚度; （S140）结束; （S150）选择详细的维修方法; （S160）通孔的再充填厚度为5μm以上。 （S170）选择第一修复过程; （S180）执行第一修复过程; （S190）选择第二修复过程; （S200）进行第二修复处理
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公开(公告)号：KR1020150066164A
公开(公告)日：2015-06-16
申请号：KR1020130151393
申请日：2013-12-06
Applicant: 삼성전기주식회사
IPC: H05K13/04
CPC classification number: H05K3/305 , H05K1/0269 , H05K2203/161 , H05K2203/166 , Y02P70/613
Abstract: 본발명은접착력이향상된전자부품의접합방법에관한것으로, 인쇄회로기판을준비하는단계; 상기인쇄회로기판의전자푸품접착영역에광배향성고분자도포하는단계; UV를조사하여상기광배향성고분자를배향하는단계; 상기광배향성고분자상에접착제를도포하는단계; 상기접착제상에상기전자부품을실장하는단계; 를포함할수 있다.
Abstract translation: 本发明涉及一种胶粘具有改进粘合性的电子部件的方法，包括：准备印刷电路板的步骤; 将光取向聚合物扩散到印刷电路板上的电子部件粘附区域上的步骤; 通过辐射紫外线定向光取向聚合物的步骤; 在光取向聚合物上涂胶的步骤; 以及将电子部件安装在胶水上的步骤。
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公开(公告)号：KR1020150054256A
公开(公告)日：2015-05-20
申请号：KR1020130136470
申请日：2013-11-11
Applicant: 삼성전기주식회사
IPC: G01N1/36
Abstract: 분석용시료고정장치가개시된다. 본발명의실시예에따른분석용시료고정장치는, 분석용시료의횡단면이분석이가능한각도를향하도록시료를위치시키는파지부, 파지부가시료를가압하도록회전에의해파지부의위치를이동시키는가압조절부, 및가압조절부의회전에따른가압조절부의이동을가이드하도록가압조절부를지지하는지지부를포함한다.
Abstract translation: 提供一种用于夹紧试样的装置，以便于分析样品的横截面并分析夹具并进行夹紧。 根据本发明的实施例的用于夹紧用于分析的样本的装置包括：夹持单元，其将用于分析的样本的横截面的样本放置成可以被分析的角度面对; 压力调节单元，其通过旋转移动所述夹持单元的位置，以使所述夹持单元对所述样本加压; 以及支撑单元，其支撑所述压力调节单元，以根据所述压力调节单元的旋转引导所述压力调节单元的移动。
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公开(公告)号：KR1020140135007A
公开(公告)日：2014-11-25
申请号：KR1020130055194
申请日：2013-05-15
Applicant: 삼성전기주식회사
Abstract: 본 발명은 구리염, 산, 광택보조제, 광택제 (brightner), 폴리비닐피롤리돈 (polyvinylpyrrolidone) 및 환원제를 포함되는 인쇄회로기판용 동 도금액 조성물 및 이를 이용한 비아 홀 (via hole) 충전방법을 제공한다. 본 발명에 따른 상기 인쇄회로기판용 동 도금액 조성물은 전기 동 도금법에 따른 비아 홀을 충전하는 과정에서, 상기 비아 홀 내의 보이드 (void), 딤플 (dimple) 및 오버 필 (over fill) 현상을 방지하는 효과가 있다.
Abstract translation: 本发明提供了一种用于印刷电路板的铜电镀液组合物，包括铜盐，酸，光泽补充剂，增白剂，聚乙烯吡咯烷酮和还原剂; 以及使用该通孔填充通孔的方法。 根据本发明，当电镀铜工艺中填充通孔时，铜电镀液组合物可以防止通孔空洞，具有凹坑，并且过度填充。
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