Abstract:
PURPOSE: A power transmitter and a method for detecting a non-power receiving target are provided to precisely determine foreign materials by comparing a measurement value with a received value. CONSTITUTION: If the change of a load is sensed above a critical value, power for communication is transmitted(205). It is determined whether a subscription request about a multiple wireless power transmission network is received in preset time by corresponding to power transmission(210). It is determined whether the change of the load is within a preset range based on the initial information of a power receiver(225). If the change of the load exceeds the preset range, the power receiver to send the subscription request is determined as the non-power receiving target(215). The power transmission for the determined non-power receiving target is stopped(245). [Reference numerals] (200) Sensing a load change?; (205) Transmitting power for communication; (210) Receiving a network subscription request message?; (215) Determining a non-power receiving object; (220) Comparing a reference load value with a load change value; (225) Is it within an allowable range?; (230) Is a network subscription possible?; (235) Transmitting a network subscription approval message; (240) Transmitting a network subscription refusal message; (245) Stopping power transmission to a corresponding charging object; (AA) Start; (BB,DD,FF,II) No; (CC,EE,GG,HH) Yes; (JJ) Finish
Abstract:
PURPOSE: A transmitter and receiver in a wireless power transmission system and a wireless power transceiving method are provided to have high resonance characteristics by including a controller controlling a power conversion unit. CONSTITUTION: A Tx power conversion unit(13) converts a DC voltage into a first AC voltage. The Tx power conversion unit amplifies the converted first AC voltage into a second AC voltage. A Tx matching circuit(12) matches impedance for a receiver. The receiver receives the second AC voltage. A Tx resonator(11) resonates the second AC voltage to a resonance wave. A Tx controller(15) determines an amplification rate of the first AC voltage. The Tx controller controls the Tx power conversion unit.
Abstract:
PURPOSE: A built-in antenna and a mobile communications terminal thereof are provided to minimize the change of a reception frequency band due to the body contact of a user by placing the center frequency of a second antenna in the edge of the reception frequency band of a built-in antenna. CONSTITUTION: A first antenna(210) comprises a first antenna pattern(211) formed on a first dielectric layer(213). A second antenna(220) comprises a second antenna pattern(221) formed in the second dielectric layer(222) and a second dielectric layer. The second dielectric layer has a dielectric constant higher than that of the first dielectric layer. The first and the second antenna are electro-magnetically combined in order to be reciprocity resonant. The first antenna pattern and the second dielectric layer are branched around the same feeding point.
Abstract:
PURPOSE: A manufacturing method of a printed circuit board is provided to improve failure rate and obtain reliability by spreading conductive material of low viscosity on the inner wall of a via hole to conduct a wire formed on both sides of a base film. CONSTITUTION: A base film(101) including a first side and a second side faced to the first side is manufactured. A first wire(111) is printed on the first side with conductive material of high viscosity. Passing through the both sides of the base film, via holes(115,195) passing through the first wire is formed. A second wire(121) is printed on the second side with the conductive material of low viscosity.
Abstract:
A printing electric device connector and a manufacturing method thereof are provided to bond a solder even to an external connection terminal of an upper surface and an internal coating layer of a through hole as well as an external connection terminal of a connector's lower surface. A connector(200) of a printing electric device(100) comprises a film layer(210), a circuit layer(220), at least one through hole(230), and an internal coating layer(240a). The film layer comprises an upper surface and a lower surface. The circuit layers are formed in the same form on the upper and lower surfaces. The through hole is formed by passing through the film layer and circuit layer. The internal coating layer is formed along an inner wall of the through hole. The internal coating layer electrically connects the circuit layer of the upper surface and a circuit layer of the lower surface.
Abstract:
A wafer handling apparatus of the multi sorter is provided, in which the identification of the wafer required for each process is arranged in the wafer cassette at the same time and ID is read. A wafer handling apparatus of the multi sorter comprises the sorter(1) and the location moving part(2). The sorter sets up the align roller, the notch finder, and the step motor(43a) on the pad plate. The sorter circulates the align roller and notch finder to the belt connected to each pulley. The sorter performs the wafer align and notch search. The location moving part sets the location of sorter.
Abstract:
A stage moving apparatus for use of multi sorter is provided to arrange consecutively wafers and make the internal fabric simple. The stage moving apparatus for use of multi sorter comprises a stage part(110) and a driving part(130). The stage part has a stage(111), a frame, and a driving arm(114) and a rotation axis. The stage mounts the various-size wafer cassettes. The wafer cassette transfers the wafers. The frame is positioned in the bottom side of the stage and unites with the stage into one body. The driving arm is arranged in frame in order to extend from the frame. The driving arm is fixed to the axis of rotation. The driving part rotates the driving arm.
Abstract:
A wiring of MID(Molded Interconnection Device) and a manufacturing method thereof are provided to reduce thickness of an electronic device by excluding an additional contact member. A MID wiring(120) is formed on a surface of a molded case(110) having electric insulated property. The molded case is formed by an injection-molding of thermoplastic resin. A first electronic part is loaded inside the molded case. A second electronic part is mounted on a surface of the molded case. The MID wiring contacts the first electronic part with the second electronic part. The MID wiring is protruded in a contact point of the first electronic part and the second electronic part, and is made of soft conductive material. The soft conductive material includes a conductive rubber.
Abstract:
본 발명에 따라 유리 튜브의 내부로 원료물질을 투입하면서 열원을 이용한 다수의 지름 방향 증착 단계들을 수행함으로써 다중모드 광섬유 모재를 제조하는 방법은, (a) 상기 모재 단면의 굴절률 프로파일을 결정하는 기준 화학 코어형상지수를 설정하는 과정과; (b) 상기 기준 화학 코어형상지수에 의해 정해진 상기 모재의 길이 방향에 따른 화학 코어형상지수 분포의 오차를 보상하여 길이 방향에 따라 균일한 화학 코어형상지수를 얻기 위해, 상기 유리 튜브의 길이 방향을 따라 변화하는 길이 방향 증착 단계별 코어형상지수 분포를 설정하는 과정과; (c) 상기 각 지름 방향 증착 단계에서 길이 방향 증착 단계별로 기설정된 화학 코어형상지수에 해당하는 양의 원료 물질을 투입하면서 증착을 수행하는 과정을 포함한다. 다중모드 광섬유, 모재, 코어형상지수, 증착
Abstract:
PURPOSE: Provided is a Ge-Ga-S-based glass composition for laser amplification which is improved in laser amplification efficiency by moving the center wavelength of the light laser amplified to the wavelength of 1,310 nm. CONSTITUTION: The glass composition comprises a Ge-Ga-S-based glass host containing a rare earth metal-based active material containing a Pr¬3+ ion which induces fluorescence and laser amplification; and a transition metal ion whose content is 0.01-0.2 mol% and which changes the distribution of laser amplification gain. Preferably the transition metal ion is a Cu¬+ ion.