Abstract:
본 발명은 커패시터가 로딩된 다중층 1/4 파장 공진기를 이용한 이단 적층 대역통과 여파기에 관한 것으로, 보다 자세하게는 통신 단말기 등의 대역통과 여파기를 요구하는 기기의 소형, 경량화에 따라, 공진기의 구조 변경이 가능하고, 소형화할 수 있으며, 공진기 간 결합 구조가 용이한 초소형 대역통과 여파기에 관한 것이다. 본 발명의 커패시터가 로딩된 다중층 1/4 파장 공진기를 이용한 이단 적층 대역통과 여파기는 유전체 기판을 사이에 두고 양면에 한 조의 도체 박막으로 되어있는 스트립 선로와 상기 스트립 선로의 일 측단이 비아홀을 통하여 접지면으로 연결되는 제 1연결부 및 상기 스트립 선로의 타 측단이 비아홀을 통하여 커패시터와 연결되는 제 2연결부로 구성된 소정의 다중층 1/4 파장 공진기가 에지 커플링 구조로 결합되어짐에 기술적 특징이 있다. 따라서, 본 발명의 대역통과 여파기의 경우, 공진 특성은 스트립 선로의 길이 및 넓이, 스트립 선로와 접지면 사이의 거리 등에 의해서 영향을 받으므로 구조의 변경이 가능하고, 여파기 회로의 크기를 줄일 수 있으며, 공진기 간 결합 구조가 가능하며, 공진기의 기준 공진 주파수(f 0 )와 첫 번째 기생 공진 주파수(f 1 )의 비(f 1 /f 0 )가 종래의 전송 선로를 이용한 공진기에 비해 훨씬 크게 나타나기 때문에, 넓은 상향 저지대역을 갖는 여파기를 설계할 수 있을 뿐만 아니라, 기생 신호를 제어할 수 있음으로 인해 광대역 특성의 회로를 설계할 수 있는 기술적 장점과 효과가 있다.
Abstract:
PURPOSE: A two-layer stacked band pass filter using a multi-layered 1/4-wavelength resonator for forming loading capacitance between a capacitor and ground is provided to reduce the size by changing a structure of a resonator. CONSTITUTION: A two-layer stacked band pass filter includes a plurality of multi-layered 1/4-wavelength resonators(540). The multi-layered 1/4-wavelength resonators are coupled each other by a mutual coupling structure. Each multi-layered 1/4-wavelength resonator includes the first connector and the second connector. The first connector is used for connecting one side end of a strip line(510) to a ground part(500) through a via-hole(520). The second connector is used for connecting the other side end of the strip line to a capacitor(530) through the via-hole.
Abstract:
PURPOSE: An oscillator module is provided to reduce harmonics and improve an attenuation characteristic of phase noise by a high-frequency choke coil pattern on a dielectric substrate. CONSTITUTION: An oscillator module includes a dielectric substrate, a plurality of micro-strip lines, a ground-etching resonance pattern, and a component mounting part. The micro-strip lines(350-356) are formed on an upper surface of the dielectric substrate(300). A metal layer is formed on a rear surface of the dielectric substrate. The ground-etching resonance pattern is used for operating the micro-strip lines as a high-frequency choke coil by etching the metal layer. The component mounting part(360) is formed on the dielectric substrate in order to mount the remaining components of an oscillator except for the high-frequency choke coil.
Abstract:
PURPOSE: A device for controlling a phase and a method for the same are provided to exactly control the phase of the multi bandwidth frequency in response to the set phase control value with utilizing a small amount of memory. CONSTITUTION: A device for controlling a phase includes a phase controller(40), a digital/analog converter(44) and an analog phase shifter(46). The phase controller(40) searches the digital phase control voltage at the memory in response to the frequency and phase control value to be controlled and calculates the digital phase control voltage in response to the frequency and phase control value by linear interpolation method. The digital/analog converter(44) converts the searched and calculated digital phase control voltage into analog phase voltage by the phase controller(40). And, the analog phase shifter(46) shifts the phase of the signal having the frequency in response to the analog phase control voltage converted by the digital/analog converter(44).
Abstract:
PURPOSE: A variable phase device of multi-chip module type and method making the same is provided to improve a performance of the variable phase device by adopting a multi-chip module manner. CONSTITUTION: A plurality of green sheets(10), which are a dielectric on which a conductor pattern is printed, are stacked to form an internal conductor pattern. A capacitor, a coupler and a ground line are formed by the green sheets and the internal conductor pattern. A plurality of side electrodes are formed at the side of the dielectric layer, and a plurality of surface electrodes(63) are formed on the dielectric layer. The side electrodes comprise an input terminal(71), an output terminal(73), a phase control terminal(72) and a dummy terminal. A plurality of resistors and varactors are connected to the surface electrodes. Through holes(80) connect the conductor pattern with the surface electrodes.
Abstract:
PURPOSE: An amplification circuit for a low noise for use in a mobile communication terminal is provided to minimize a noise thereof and to operate the device stably. CONSTITUTION: An amplification circuit for a low noise for use in a mobile communication includes an input impedance junction circuit provided with a capacitor and an inductor and an output impedance junction circuit. The amplification circuit further includes at least one resister, connected between the input impedance circuit and the output impedance circuit, for operating with an optimum condition. The amplification circuit further includes a bias circuit portion provided with a capacitor and controls at least one resistor for the amplification circuit not to oscillate. In the amplification circuit, a number of chips are assembled into one package to thereby reduce an overall size and obtain a reliability by modulating a part or a partial function of the system board into one module. And also, if the ceramic substrate is used as a wiring substrate material, the amplification circuit has a high quality index, a good gain characteristics and a good noise index by reducing a thermal noise thereof.