公开(公告)号：US20210333846A1

公开(公告)日：2021-10-28

申请号：US16860926

申请日：2020-04-28

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Harvey J. Lunsman ,  Ernesto Ferrer Medina ,  Tahir Cader ,  Steven Dean

IPC: G06F1/20 ,  H05K7/20

Abstract: Example implementations relate to a method and system for cooling a compute node tray including a board, a plurality of first and second devices, a cooling assembly, and a support structure assembly. The cooling assembly includes a supply section, a return section, and an intermediate section coupled to the supply and return sections. The supply section includes a first conduit extending along a perimeter of the board and forming a thermal contact with the first devices. The intermediate section includes a plurality of cold plates and a plurality of second conduits forming the thermal contact with the second devices. The second conduits extends parallel to one another. The return section includes a third conduit extending parallel to a portion of the first conduit. The support structure encompasses the board and forms the thermal contact with a portion of the board, a plurality of third devices, and the cooling assembly.

公开(公告)号：US11102083B2

公开(公告)日：2021-08-24

申请号：US16399831

申请日：2019-04-30

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Mehmet Kivanc Ozonat ,  Tahir Cader ,  Matthew Richard Slaby

IPC: G06F15/173 ,  H04L12/24 ,  G06F16/901 ,  G06N3/08 ,  G06N3/04

Abstract: In exemplary aspects of optimizing data centers, historical data corresponding to a data center is collected. The data center includes a plurality of systems. A data center representation is generated. The data center representation can be one or more of a schematic and a collection of data from among the historical data. The data center representation is encoded into a neural network model. The neural network model is trained using at least a portion of the historical data. The trained model is deployed using a first set of inputs, causing the model to generate one or more output values for managing or optimizing the data center using supplemental indicators.

公开(公告)号：US11015608B2

公开(公告)日：2021-05-25

申请号：US16215498

申请日：2018-12-10

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： John Paul Franz ,  Tahir Cader

IPC: F04D25/06 ,  F04D25/16 ,  F04D29/00 ,  F04D29/046 ,  H02K21/18 ,  F04D29/20 ,  F04D29/40 ,  H02K7/14 ,  F04D29/18 ,  F04D13/06

Abstract: An axial flow pump comprises a housing having a bore, a cylindrical permanent magnet within the housing bore, and at least one impeller inside the permanent magnet and adapted to cause fluid to flow within the cylindrical permanent magnet. The permanent magnet is configured to rotate in the bore around its longitudinal axis. A motor lamination stack surrounds the cylindrical permanent magnet. The motor lamination stack is formed substantially as a cuboid, extending in a width and height direction perpendicular to the axis of rotation of the cylindrical permanent magnet. The diameter of the bore is at least 80% of the dimension of the cuboid in the height direction. A coil of the motor lamination is configured to be energized and to create a rotating magnetic field in the lamination stack to rotate the cylindrical permanent magnet around its longitudinal axis. The coil is disposed to one or both sides of the pump.

公开(公告)号：US10791655B2

公开(公告)日：2020-09-29

申请号：US15570692

申请日：2016-01-22

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Tahir Cader ,  Minh H. Nguyen

IPC: H05K7/20 ,  H01L23/34 ,  G06F1/20 ,  H01L23/473

Abstract: Examples herein disclose a system including a board and a cooling member. The board includes a first surface, a second surface, and a midpoint between the first and the surface, the boards supports an electrical component on the first surface. The cooling member is routed along the second surface of the board and delivers cooling liquid to the electrical component by crossing the midpoint of the board from the second surface to the first surface. The cooling member routes heated liquid from the electrical component by crossing the midpoint of the board from the first surface to the second surface.

公开(公告)号：US10667431B1

公开(公告)日：2020-05-26

申请号：US16398115

申请日：2019-04-29

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Harvey J. Lunsman ,  John Franz ,  Tahir Cader ,  Ernesto Ferrer Medina

IPC: G06F1/20 ,  H05K7/20 ,  H05K1/02

Abstract: An example thermal interface device to attach to and cool a memory module. The device includes two sides sections that cover and contact the side faces of the memory module when installed. The device includes an outer layer that is a thermally conductive and resilient material, and an inner layer that is a thermally conductive and malleable metal. The inner layer may be nested within the outer layer, and the inner layer contacts the memory circuits of the memory module when installed. The outer layer includes spring fingers extending outward so as to contact and be compressed by a heat transfer device, such as a heat pipe, that is positioned on a side of the memory module. A thermally conductive path is thereby provided between the memory module and the heat transfer device via the thermal interface device.

公开(公告)号：US20200163253A1

公开(公告)日：2020-05-21

申请号：US16196372

申请日：2018-11-20

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Harvey J. Lunsman ,  Tahir Cader

IPC: H05K7/20 ,  G06F1/20 ,  H05K1/18 ,  H05K1/02

Abstract: An example cooling system is described herein. The cooling system can include a first cold plate including a first heat pipe to couple to a side of a dual in-line memory module (DIMM) where the first heat pipe transfers heat from the DIMM to the first cold plate; and a second cold plate including a second heat pipe to couple to the side of the DIMM, where the second heat pipe transfers heat from the DIMM to the second cold plate.

公开(公告)号：US20200159297A1

公开(公告)日：2020-05-21

申请号：US16774137

申请日：2020-01-28

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Zhikui Wang ,  Tuong Q. Tran ,  Tahir Cader ,  Chunjian Ni

IPC: G06F1/20 ,  G05D23/19 ,  H05K7/20

Abstract: In one implementation, a system for hybrid cooling control of a computing system includes a coordinated controller engine to: determine a number of liquid loop set-points and a number of air loop set-points, determine a number of system parameters corresponding to the number of liquid loop set-points and the number of air loop set-points, determine a correlation factor for the number of system parameters; and alter the number of liquid loop set-points and the number of air loop set-points based on the correlation factor to lower an energy consumption or to maximize energy reuse of a number of cooling resources associated with the number of system parameters.

公开(公告)号：US10548242B2

公开(公告)日：2020-01-28

申请号：US15329246

申请日：2014-07-31

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Tahir Cader ,  Wade D Vinson ,  Douglas Kent Garday ,  John P Franz

IPC: H05K7/20 ,  G06F1/20 ,  H05K7/14

Abstract: A system to cool a module data center including a fluid cooling device to cool a first set of components of the module data center using a fluid cooling loop and an air cooling device to provide an air to cool a second set of components of the module data center. Also, a control apparatus to determine an air cooling temperature for the air cooling loop based on an environmental condition, determine a fluid cooling temperature for the fluid cooling loop based on the environmental condition, transmit an air signal to the air cooling device to set the air cooling temperature, and transmit a fluid signal to the fluid cooling device to set the fluid cooling temperature.

公开(公告)号：US10512195B2

公开(公告)日：2019-12-17

申请号：US15522634

申请日：2014-10-31

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： John P Franz ,  Tahir Cader

IPC: H05K7/20 ,  H05K1/14 ,  H05K7/14

Abstract: Example implementations relate to a server device with a capacitive circuit. For example, a server device with a capacitive circuit can include a capacitive circuit located on a printed circuit assembly (PCA) of the server device and a baseboard management controller unit (BMC) to provide a communication interface between the capacitive circuit and a computing device. A voltage can be applied across the capacitive circuit and a signal can be sent from the capacitive circuit to the computing device using the BMC in response to a change in voltage.

公开(公告)号：US10356957B2

公开(公告)日：2019-07-16

申请号：US15523674

申请日：2014-10-31

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： John P Franz ,  Tahir Cader

IPC: H05K7/04 ,  H05K7/14 ,  H05K7/20

Abstract: Example implementations relate to an adaptive cooling assembly. For example, an adaptive cooling assembly includes a removable shelf installed in the adaptive cooling assembly, an adaptive cooling bay located in a slot formed by the removable shelf, and a removable thermal bus bar installed in the adaptive cooling bay and connected to a pair of connectors. The adaptive cooling bay includes the pair of connectors and the removable thermal bus bar provides liquid cooling to an electronic device.