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公开(公告)号：EP4201903A1
公开(公告)日：2023-06-28
申请号：EP22205195.5
申请日：2022-11-03
Applicant: INTEL Corporation
Inventor： DOGIAMIS, Georgios C. , KAMGAING, Telesphor , RAWLINGS, Brandon , PRABHU GAUNKAR, Neelam , STRONG, Veronica , ALEKSOV, Aleksandar
Abstract: Embodiments disclosed herein include electronic packages and methods of forming such packages. In an embodiment, an electronic package comprises a core, where the core comprises glass. In an embodiment, a via opening is formed through the core. In an embodiment, the via opening has an aspect ratio (depth:width) that is approximately 5:1 or greater. In an embodiment, the electronic package further comprises a via in the via opening, where the via opening is fully filled.
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62.发明公开
公开(公告)号：EP3732784A1
公开(公告)日：2020-11-04
申请号：EP17935989.8
申请日：2017-12-28
Applicant: INTEL Corporation
Inventor： SWAN, Johanna M. , EID, Feras , KAMGAING, Telesphor , NAIR, Vijay K. , DOGIAMIS, Georgios C. , LEUSCHNER, Stephan
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公开(公告)号：EP3437191A1
公开(公告)日：2019-02-06
申请号：EP17776049.3
申请日：2017-01-24
Applicant: Intel Corporation
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公开(公告)号：WO2019132921A1
公开(公告)日：2019-07-04
申请号：PCT/US2017/068725
申请日：2017-12-28
Applicant: INTEL CORPORATION , DOGIAMIS, Georgios C. , KAMGAING, Telesphor , EID, Feras , NAIR, Vijay K. , SWAN, Johanna M.
Inventor： DOGIAMIS, Georgios C. , KAMGAING, Telesphor , EID, Feras , NAIR, Vijay K. , SWAN, Johanna M.
Abstract: Embodiments of the invention include an acoustic wave resonator (AWR) module. In an embodiment, the AWR module may include a first AWR substrate and a second AWR substrate affixed to the first AWR substrate. In an embodiment, the first AWR substrate and the second AWR substrate define a hermetically sealed cavity. A first AWR device may be positioned in the cavity and formed on the first AWR substrate, and a second AWR device may be positioned in the cavity and formed on the second AWR substrate. In an embodiment, a center frequency of the first AWR device is different than a center frequency of the second AWR device. In additional embodiment of the invention, the AWR module may be integrated into a hybrid filter. The hybrid filter may include an AWR module and other RF passive devices embedded in a packaging substrate.
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公开(公告)号：WO2018125240A1
公开(公告)日：2018-07-05
申请号：PCT/US2016/069621
申请日：2016-12-30
Applicant: INTEL CORPORATION
Inventor： KAMGAING, Telesphor , OSTER, Sasha N. , DOGIAMIS, Georgios C.
IPC: H01L23/66 , H01L23/498 , H01L23/522 , H01Q1/24 , H01Q1/38
Abstract: Embodiments of the invention include a microelectronic device that includes a first substrate having organic dielectric material, conductive layers, and a first portion of a distributed antenna unit. The first substrate supports at least one radio frequency (RF) component. A second substrate is coupled to the first substrate. The second substrate is integrated with a housing of the microelectronic device and includes a second portion of the distributed antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher.
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Patent Agency Ranking
公开(公告)号：WO2018063708A1
公开(公告)日：2018-04-05
申请号：PCT/US2017/049350
申请日：2017-08-30
Applicant: INTEL CORPORATION
Inventor： OSTER, Sasha N. , ALEKSOV, Aleksandar , DOGIAMIS, Georgios C. , KAMGAING, Telesphor , ELSHERBINI, Adel A. , LIFF, Shawna M. , SWAN, Johanna M. , RAWLINGS, Brandon M. , DISCHLER, Richard J.
CPC classification number: H01P3/122 , H01P3/14 , H01P3/16 , H01P11/006
Abstract: A method of making a waveguide ribbon that includes a plurality of waveguides comprises joining a first sheet of dielectric material to a first conductive sheet of conductive material, patterning the first sheet of dielectric material to form a plurality of dielectric waveguide cores on the first conductive sheet, and coating the dielectric waveguide cores with substantially the same conductive material as the conductive sheet to form the plurality of waveguides.
Abstract translation: 制造包括多个波导的波导带的方法包括将第一片介电材料接合到第一导电材料的导电片，图案化第一片介电材料以形成多个 在第一导电片上形成电介质波导芯，并且用与导电片基本上相同的导电材料涂覆电介质波导芯以形成多个波导。
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公开(公告)号：WO2018063687A1
公开(公告)日：2018-04-05
申请号：PCT/US2017/049226
申请日：2017-08-29
Applicant: INTEL CORPORATION
Inventor： HUA, Fay , RAWLINGS, Brandon , DOGIAMIS, Georgios C. , KAMGAING, Telesphor
IPC: H01L49/02 , H01L21/768
Abstract: Embodiments are generally directed to non-planar on-package via capacitor. An embodiment of an embedded capacitor includes a first plate that is formed in a package via; a dielectric layer that is applied on the first plate; and a second plate that is formed in a cavity in the dielectric layer, wherein the first plate and the second plate are non-planar plates.
Abstract translation: 实施例通常针对非平面封装过孔电容器。 嵌入式电容器的实施例包括：第一板，其形成在封装件通孔中; 施加在第一板上的介电层; 以及形成在介电层中的空腔中的第二板，其中第一板和第二板是非平面板。
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公开(公告)号：WO2018063647A1
公开(公告)日：2018-04-05
申请号：PCT/US2017/048947
申请日：2017-08-28
Applicant: INTEL CORPORATION
Inventor： LIFF, Shawna M. , DOGIAMIS, Georgios C. , OSTER, Sasha N. , EID, Feras , ELSHERBINI, Adel A. , SOUNART, Thomas L. , SWAN, Johanna M.
IPC: H02N2/04
Abstract: Embodiments of the invention include a self-propelled sensor system. In an embodiment, the self-propelled sensor system includes a piezoelectrically actuated motor that is integrated with a substrate. In an embodiment, the self-propelled sensor system may also include a sensor and an integrated circuit electrically coupled to the piezoelectrically actuated motor. Embodiments of the invention may also include self-propelled sensor systems that include plurality of piezoelectrically actuated motors. In an embodiment the piezoelectrically actuated motors may be one or more different types of motors including, but not limited to, stick and slip motors, inchworm stepping motors, standing acoustic wave motors, a plurality of piezoelectrically actuated cantilevers, and a piezoelectrically actuated diaphragm. Additional embodiments of the invention may include a plurality of self-propelled sensor systems that are communicatively coupled to form a sensor mesh.
Abstract translation: 本发明的实施例包括自推进传感器系统。 在一个实施例中，自推进传感器系统包括与衬底集成的压电致动马达。 在一个实施例中，自推进传感器系统还可以包括传感器和电联接到压电致动马达的集成电路。 本发明的实施例还可以包括包括多个压电致动马达的自推进传感器系统。 在一个实施例中，压电致动马达可以是一种或多种不同类型的马达，包括但不限于棒式和滑动马达，尺w步进马达，驻声波马达，多个压电致动悬臂和压电致动隔膜。 本发明的附加实施例可以包括通信地耦合以形成传感器网格的多个自推进传感器系统。
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公开(公告)号：WO2018063362A1
公开(公告)日：2018-04-05
申请号：PCT/US2016/054888
申请日：2016-09-30
Applicant: INTEL CORPORATION
Inventor： KAMGAING, Telesphor Teles , DOGIAMIS, Georgios C. , OSTER, Sasha , ELSHERBINI, Adel A. , RAWLINGS, Brandon M. , ALEKSOV, Aleksandar , LIFF, Shawna M. , DISCHLER, Richard , SWAN, Johanna M.
CPC classification number: H01P11/002 , H01P3/122
Abstract: An apparatus comprises a waveguide section including an outer layer of conductive material tubular in shape and having multiple ends; and a joining feature on at least one of the ends of the waveguide section configured for joining to a second separate waveguide section.
Abstract translation: 一种设备包括：波导部分，其包括形状为管状且具有多个端部的导电材料外层; 以及在波导部分的至少一个端部上的连接特征，其被配置用于连接到第二分开的波导部分。
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公开(公告)号：WO2018057002A1
公开(公告)日：2018-03-29
申请号：PCT/US2016/053463
申请日：2016-09-23
Applicant: INTEL CORPORATION
Inventor： OSTER, Sasha N. , DOGIAMIS, Georgios C. , KAMGAING, Telesphor , ELSHERBINI, Adel A. , LIFF, Shawna M. , ALEKSOV, Aleksandar , SWAN, Johanna M.
Abstract: A waveguide coupling system may include at least one waveguide member retention structure disposed on an exterior surface of a semiconductor package. The waveguide member retention structure may be disposed a defined distance or at a defined location with respect to an antenna carried by the semiconductor package. The waveguide member retention structure may engage and guide a waveguide member slideably inserted into the respective waveguide member retention structure. The waveguide member retention structure may position the waveguide member at a defined location with respect to the antenna to maximize the power transfer from the antenna to the waveguide member.
Abstract translation: 波导耦合系统可以包括设置在半导体封装的外表面上的至少一个波导构件保持结构。 波导构件保持结构可以相对于由半导体封装承载的天线设置限定的距离或者限定的位置。 波导构件保持结构可接合并引导可滑动地插入到相应的波导构件保持结构中的波导构件。 波导构件保持结构可以将波导构件定位在相对于天线的限定位置处，以最大化从天线到波导构件的功率传输。
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