公开(公告)号：WO2018118338A1

公开(公告)日：2018-06-28

申请号：PCT/US2017/063119

申请日：2017-11-22

Applicant: INTEL CORPORATION

Inventor： DOGIAMIS, Georgios C. ,  COHEN, Emanuel ,  OSTER, Sasha N. ,  KAMGAING, Telesphor

IPC: H04B10/2507 ,  H04B10/2575 ,  H04B3/52

Abstract: Embodiments of the present disclosure may relate to a transmitter that includes a baseband dispersion compensator to perform baseband dispersion compensation on an input signal. Embodiments may also include a receiver that includes a radio frequency (RF) dispersion compensator to perform RF dispersion compensation. Embodiments may also include a dielectric waveguide coupled with the transmitter and the receiver, the dielectric waveguide to convey the RF signal from the transmitter to the receiver. Other embodiments may be described and/or claimed.

公开(公告)号：WO2018111268A1

公开(公告)日：2018-06-21

申请号：PCT/US2016/066717

申请日：2016-12-14

Applicant: INTEL CORPORATION

Inventor： EID, Feras ,  OSTER, Sasha N. ,  KAMGAING, Telesphor ,  DOGIAMIS, Georgios C. ,  ALEKSOV, Aleksandar

IPC: H01L23/66 ,  H01L23/522 ,  H01L25/04 ,  H01L23/538 ,  H01L23/00 ,  H01Q1/22 ,  H01Q9/04

Abstract: Embodiments of the invention include a microelectronic device that includes a first substrate having radio frequency (RF) components and a second substrate that is coupled to the first substrate. The second substrate includes a first conductive layer of an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher. A mold material is disposed on the first and second substrates. The mold material includes a first region that is positioned between the first conductive layer and a second conductive layer of the antenna unit with the mold material being a dielectric material to capacitively couple the first and second conductive layers of the antenna unit.

公开(公告)号：WO2017172075A1

公开(公告)日：2017-10-05

申请号：PCT/US2017/017703

申请日：2017-02-13

Applicant: INTEL CORPORATION

Inventor： NAIR, Vijay K. ,  EID, Feras ,  ELSHERBINI, Adel A. ,  KAMGAING, Telesphor ,  DOGIAMIS, Georgios C. ,  RAO, Valluri R. ,  SWAN, Johanna M.

IPC: H03H3/02 ,  H03H9/58 ,  H03H9/02 ,  H03H3/007

Abstract: Embodiments of the invention include a piezoelectric package integrated filtering device that includes a film stack. In one example, the film stack includes a first electrode, a piezoelectric material in contact with the first electrode, and a second electrode in contact with the piezoelectric material. The film stack is suspended with respect to a cavity of an organic substrate having organic material and the film stack generates an acoustic wave to be propagated across the film stack in response to an application of an electrical signal between the first and second electrodes.

Abstract translation: 本发明的实施例包括压电封装集成滤波装置，其包括膜叠层。 在一个示例中，膜堆叠包括第一电极，与第一电极接触的压电材料以及与压电材料接触的第二电极。 薄膜叠层相对于具有有机材料的有机衬底的空腔悬挂，并且薄膜叠层响应于在第一和第二电极之间施加电信号而产生声波以传播穿过薄膜叠层。 p>

公开(公告)号：WO2017171995A1

公开(公告)日：2017-10-05

申请号：PCT/US2017/014720

申请日：2017-01-24

Applicant: INTEL CORPORATION

Inventor： ELSHERBINI, Adel A. ,  EID, Feras ,  BICEN, Baris ,  KAMGAING, Telesphor ,  NAIR, Vijay K. ,  DOGIAMIS, Georgios C. ,  SWAN, Johanna M. ,  RAO, Valluri R.

IPC: H03H9/42 ,  G10K11/36 ,  H03H9/02

Abstract: Embodiments of the invention include a waveguide structure that includes a first piezoelectric transducer that is positioned in proximity to a first end of a cavity of an organic substrate. The first piezoelectric transducer receives an input electrical signal and generates an acoustic wave to be transmitted with a transmission medium. A second piezoelectric transducer is positioned in proximity to a second end of the cavity. The second piezoelectric transducer receives the acoustic wave from the transmission medium and generates an output electrical signal.

Abstract translation: 本发明的实施例包括波导结构，其包括第一压电换能器，该第一压电换能器位于有机衬底的空腔的第一端附近。 第一压电换能器接收输入电信号并产生要用传输介质传输的声波。 第二压电换能器位于腔的第二端附近。 第二压电传感器接收来自传输介质的声波并产生输出电信号。

公开(公告)号：WO2017171976A1

公开(公告)日：2017-10-05

申请号：PCT/US2017/013447

申请日：2017-01-13

Applicant: INTEL CORPORATION

Inventor： EID, Feras ,  DOGIAMIS, Georgios C. ,  RAO, Valluri R. ,  ELSHERBINI, Adel A. ,  SWAN, Johanna M. ,  KAMGAING, Telesphor ,  NAIR, Vijay K.

IPC: H03H9/56 ,  H03H9/10 ,  H03H9/58 ,  H03H9/25

Abstract: Embodiments of the invention include a filtering device that includes a first electrode, a piezoelectric material in contact with the first electrode, and a second electrode in contact with the piezoelectric material. The piezoelectric filtering device expands and contracts laterally in a plane of an organic substrate in response to application of an electrical signal between the first and second electrodes.

Abstract translation: 本发明的实施例包括过滤装置，其包括第一电极，与第一电极接触的压电材料以及与压电材料接触的第二电极。 响应于在第一和第二电极之间施加电信号，压电滤波装置在有机衬底的平面中横向扩张和收缩。

公开(公告)号：WO2017111975A1

公开(公告)日：2017-06-29

申请号：PCT/US2015/067539

申请日：2015-12-22

Applicant: INTEL CORPORATION

Inventor： DOGIAMIS, Georgios C. ,  KAMGAING, Telesphor ,  FALCON, Javier A. ,  TOMITA, Yoshihiro ,  NAIR, Vijay K.

IPC: H01L23/66 ,  H01L23/28 ,  H01L25/065

CPC classification number: H01L23/66 ,  H01L24/13 ,  H01L24/16 ,  H01L24/20 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/18 ,  H01L2223/6672 ,  H01L2223/6677 ,  H01L2224/12105 ,  H01L2224/13025 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2924/10253 ,  H01L2924/1032 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/19011 ,  H01L2924/19105

Abstract: Embodiments of the invention include a microelectronic device that includes a first die formed with a silicon based substrate and a second die coupled to the first die. The second die is formed with compound semiconductor materials in a different substrate (e.g., compound semiconductor substrate, group III-V substrate). An antenna unit is coupled to the second die. The antenna unit transmits and receives communications at a frequency of approximately 4 GHz or higher.

Abstract translation: 本发明的实施例包括微电子器件，其包括用硅基衬底形成的第一管芯和耦合到第一管芯的第二管芯。 第二裸片在不同衬底（例如，化合物半导体衬底，III-V族衬底）中由化合物半导体材料形成。 天线单元耦合到第二管芯。 天线单元以大约4 GHz或更高的频率发送和接收通信。

公开(公告)号：WO2017111767A1

公开(公告)日：2017-06-29

申请号：PCT/US2015/000158

申请日：2015-12-22

Applicant: INTEL CORPORATION

Inventor： KAMGAING, Telesphor ,  DOGIAMIS, Georgios, C. ,  NAIR, Vijay, K.

IPC: H01Q9/04 ,  H01Q1/38 ,  G06F1/16

CPC classification number: G06F1/1698 ,  G06F1/1613 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01Q1/2283 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q1/405 ,  H01Q3/26 ,  H01Q9/0414 ,  H01Q21/0093 ,  H01Q21/28 ,  H01Q23/00 ,  H01Q25/00

Abstract: Embodiments of the invention include a microelectronic device that includes a die having at least one transceiver unit, a redistribution package coupled to the die, and a substrate coupled to the redistribution package. The substrate includes an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher.

Abstract translation: 本发明的实施例包括微电子器件，该微电子器件包括具有至少一个收发器单元的芯片，耦合到管芯的重分布封装以及耦合到重分布封装的衬底。 基板包括用于发射和接收大约4GHz或更高频率的通信的天线单元。

公开(公告)号：WO2017052673A1

公开(公告)日：2017-03-30

申请号：PCT/US2015/062205

申请日：2015-11-23

Applicant: INTEL CORPORATION

Inventor： KAMGAING, Telesphor ,  KHANNA, Rahul

IPC: G06F13/14 ,  H04B1/38

CPC classification number: H01L23/66 ,  H01L24/16 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/16 ,  H01L2223/6677 ,  H01L2223/6683 ,  H01L2223/6688 ,  H01L2224/16235 ,  H01L2224/73253 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2225/06589 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/1421 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15153 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/15321 ,  H01L2924/19105

Abstract: A blade computing system is described with a wireless communication between blades. In one embodiment, the system includes a first blade in the enclosure having a radio transceiver to communicate with a radio transceiver of a second blade in the enclosure. The second blade has a radio transceiver to communicate with the radio transceiver of the first blade. A switch in the enclosure communicates with the first blade and the second blade and establishes a connection through the respective radio transceivers between the first blade and the second blade.

Abstract translation: 利用刀片之间的无线通信来描述刀片计算系统。 在一个实施例中，该系统包括壳体中的第一刀片，其具有无线电收发器以与外壳中的第二刀片的无线电收发器通信。 第二刀片具有无线电收发器以与第一刀片的无线电收发器进行通信。 外壳中的开关与第一刀片和第二刀片通信，并且通过第一刀片和第二刀片之间的各个无线电收发器建立连接。

公开(公告)号：WO2014051977A1

公开(公告)日：2014-04-03

申请号：PCT/US2013/058796

申请日：2013-09-09

Applicant: INTEL CORPORATION

Inventor： ZILLMANN, Uwe ,  SCHAEFER, Andre ,  SARASWAT, Ruchir ,  KAMGAING, Telesphor ,  FISCHER, Paul, B. ,  DROEGE, Guido

IPC: H01L23/48

CPC classification number: G06F1/3296 ,  H01L2924/0002 ,  H05K1/0262 ,  H05K1/165 ,  Y02D10/172 ,  Y10T29/4913 ,  H01L2924/00

Abstract: Magnetically enhanced inductors integrated with microelectronic devices at chip-level. In embodiments, magnetically enhanced inductors include a through substrate vias (TSVs) with fill metal to carry an electrical current proximate to a magnetic layer disposed on a substrate through which the TSV passes. In certain magnetically enhanced inductor embodiments, a TSV fill metal is disposed within a magnetic material lining the TSV. In certain magnetically enhanced inductor embodiments, a magnetically enhanced inductor includes a plurality of interconnected TSVs disposed proximate to a magnetic material layer on a side of a substrate. In embodiments, voltage regulation circuitry disposed on a first side of a substrate is integrated with one or more magnetically enhanced inductors utilizing a TSV passing through the substrate. In further embodiments, integrated circuitry on a same substrate as the magnetically enhanced inductor, or on another substrate stacked thereon, completes the VR and/or is powered by the VR circuitry.

Abstract translation: 在芯片级与微电子器件集成的磁性增强型电感器。 在实施例中，磁增强电感器包括具有填充金属的贯穿衬底通孔（TSV），以承载靠近设置在TSV通过的衬底上的磁性层的电流。 在某些磁增强电感器实施例中，TSV填充金属设置在衬在TSV内的磁性材料内。 在某些磁增强电感器实施例中，磁增强电感器包括靠近基板一侧的磁性材料层设置的多个互连TSV。 在实施例中，设置在衬底的第一侧上的电压调节电路与利用穿过衬底的TSV的一个或多个磁增强电感器集成。 在另外的实施例中，在与磁增强电感器相同的衬底上或在其上堆叠的另一衬底上的集成电路完成VR和/或由VR电路供电。

公开(公告)号：WO2012151123A9

公开(公告)日：2012-11-08

申请号：PCT/US2012/035421

申请日：2012-04-27

Applicant: INTEL CORPORATION ,  KAMGAING, Telesphor

Inventor： KAMGAING, Telesphor

IPC: H01Q21/12

Abstract: A glass-based, high-performance 60 GHz/ mm-wave antenna includes cavities disposed in a phased-array antenna (PAA) substrate. The cavities are disposed below planar antenna elements. Emitter traces are disposed on the PAA substrate opposite the planar antenna elements and the emitter traces, the cavities, and the planar antenna elements are vertically aligned.