PIEZOELECTRIC PACKAGE-INTEGRATED FILM BULK ACOUSTIC RESONATOR DEVICES
    63.
    发明申请
    PIEZOELECTRIC PACKAGE-INTEGRATED FILM BULK ACOUSTIC RESONATOR DEVICES 审中-公开
    压电包装集成薄膜大容量声学谐振器装置

    公开(公告)号:WO2017172075A1

    公开(公告)日:2017-10-05

    申请号:PCT/US2017/017703

    申请日:2017-02-13

    Abstract: Embodiments of the invention include a piezoelectric package integrated filtering device that includes a film stack. In one example, the film stack includes a first electrode, a piezoelectric material in contact with the first electrode, and a second electrode in contact with the piezoelectric material. The film stack is suspended with respect to a cavity of an organic substrate having organic material and the film stack generates an acoustic wave to be propagated across the film stack in response to an application of an electrical signal between the first and second electrodes.

    Abstract translation: 本发明的实施例包括压电封装集成滤波装置,其包括膜叠层。 在一个示例中,膜堆叠包括第一电极,与第一电极接触的压电材料以及与压电材料接触的第二电极。 薄膜叠层相对于具有有机材料的有机衬底的空腔悬挂,并且薄膜叠层响应于在第一和第二电极之间施加电信号而产生声波以传播穿过薄膜叠层。 p>

    PIEZOELECTRIC PACKAGE-INTEGRATED DELAY LINES
    64.
    发明申请
    PIEZOELECTRIC PACKAGE-INTEGRATED DELAY LINES 审中-公开
    压电包装 - 集成延时线

    公开(公告)号:WO2017171995A1

    公开(公告)日:2017-10-05

    申请号:PCT/US2017/014720

    申请日:2017-01-24

    Abstract: Embodiments of the invention include a waveguide structure that includes a first piezoelectric transducer that is positioned in proximity to a first end of a cavity of an organic substrate. The first piezoelectric transducer receives an input electrical signal and generates an acoustic wave to be transmitted with a transmission medium. A second piezoelectric transducer is positioned in proximity to a second end of the cavity. The second piezoelectric transducer receives the acoustic wave from the transmission medium and generates an output electrical signal.

    Abstract translation: 本发明的实施例包括波导结构,其包括第一压电换能器,该第一压电换能器位于有机衬底的空腔的第一端附近。 第一压电换能器接收输入电信号并产生要用传输介质传输的声波。 第二压电换能器位于腔的第二端附近。 第二压电传感器接收来自传输介质的声波并产生输出电信号。

    INTEGRATED VOLTAGE REGULATORS WITH MAGNETICALLY ENHANCED INDUCTORS
    69.
    发明申请
    INTEGRATED VOLTAGE REGULATORS WITH MAGNETICALLY ENHANCED INDUCTORS 审中-公开
    集成电压调节器与磁性增强型电感器

    公开(公告)号:WO2014051977A1

    公开(公告)日:2014-04-03

    申请号:PCT/US2013/058796

    申请日:2013-09-09

    Abstract: Magnetically enhanced inductors integrated with microelectronic devices at chip-level. In embodiments, magnetically enhanced inductors include a through substrate vias (TSVs) with fill metal to carry an electrical current proximate to a magnetic layer disposed on a substrate through which the TSV passes. In certain magnetically enhanced inductor embodiments, a TSV fill metal is disposed within a magnetic material lining the TSV. In certain magnetically enhanced inductor embodiments, a magnetically enhanced inductor includes a plurality of interconnected TSVs disposed proximate to a magnetic material layer on a side of a substrate. In embodiments, voltage regulation circuitry disposed on a first side of a substrate is integrated with one or more magnetically enhanced inductors utilizing a TSV passing through the substrate. In further embodiments, integrated circuitry on a same substrate as the magnetically enhanced inductor, or on another substrate stacked thereon, completes the VR and/or is powered by the VR circuitry.

    Abstract translation: 在芯片级与微电子器件集成的磁性增强型电感器。 在实施例中,磁增强电感器包括具有填充金属的贯穿衬底通孔(TSV),以承载靠近设置在TSV通过的衬底上的磁性层的电流。 在某些磁增强电感器实施例中,TSV填充金属设置在衬在TSV内的磁性材料内。 在某些磁增强电感器实施例中,磁增强电感器包括靠近基板一侧的磁性材料层设置的多个互连TSV。 在实施例中,设置在衬底的第一侧上的电压调节电路与利用穿过衬底的TSV的一个或多个磁增强电感器集成。 在另外的实施例中,在与磁增强电感器相同的衬底上或在其上堆叠的另一衬底上的集成电路完成VR和/或由VR电路供电。

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