Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive variable refractive index composition for an optical material so that the refractive index of the material can be varied by an easy method, the difference in the varied refractive indices is sufficiently large, and a stable refractive index pattern and optical material can be obtained without depending on the succeeding use conditions. SOLUTION: The radiation-sensitive variable refractive index composition contains (A) a decomposable compound, (B) a non-decomposing compound having the refractive index lower than that of the decomposable compound (A), (C) a radiation-sensitive decomposing agent and (D) a stabilizer. By irradiating the composition with radiation through a pattern mask, the above component (C) and the component (A) in the irradiated part are decomposed to produce a difference in the refractive index between the irradiated part and the non- irradiated part to form a pattern having different refractive indices.
Abstract:
PROBLEM TO BE SOLVED: To suppress deterioration of an alignment film against light while suppressing manufacturing costs by forming the specified alignment film on a liquid crystal layer side surface of a substrate in a liquid crystal device having liquid crystal interposed between a pair of substrates opposedly disposed. SOLUTION: This liquid crystal device is provided with a TFT array substrate 10 constituting a sample of one transparent substrate and an counter substrate 20 disposed being opposed to the substrate 10 and constituting a sample of the other transparent substrate. And the TFT array substrate 10 is provided with a picture element electrode 9a and an alignment film 16 subjected to a prescribed alignment treatment such as the rubbing treatment is provided on an upper side of the picture element electrode. On the other hand, the counter substrate 20 is provided with a counter electrode 21 over all the surface thereof and an alignment film 22 subjected to a prescribed alignment treatment such as the rubbing treatment is provided on the lower side of the counter electrode 21. Polyimide as an alignment material is applied on the surfaces to film-form the films 16 and 22 and then they are subjected to the rubbing treatment. At this time, aromatic group concentration in the polyimide is specified to be 0-30 wt.%, more preferably 2-25 wt.%.
Abstract:
PROBLEM TO BE SOLVED: To provide a method for manufacturing electrodes by which a high- difinition pattern can be formed and the workability be improved substantially, in comparison to the conventional method by using a transfer film when forming electrodes constituting an electrode wiring or projecting electrode, in a printed circuit board, multilayer circuit board, multi-chip module, LCD, LSI, PDP, EL, FED, etc. SOLUTION: In this manufacturing method, a conductive paste layer formed on a supporting film is transferred to a substrate 11, and a resist film is formed on the conductive paste layer 21, and then the resist film is exposed to form the latent image of a resist pattern. The resist film is developed to form a resist pattern 35, and the conductive paste layer 21 is etched to form the pattern thereof corresponding to the resist pattern, and then the pattern is made to thermoset.
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin compsn. which can be developed with an alkali aq. soln., which has high resolution, high sensitivity and various characteristics such as heat resistance, chemical resistance and transparency, which can form partition walls in the production of a color filter using an ink-jet recording technique so that an ink as a coloring agent does not spread out of the objective region for coloring and that an ink can be sprayed and applied with excellent surface smoothness in a pixel. SOLUTION: This resin compsn. consists of (A) a fluorine-contg. copolymer of hexafluoropropylene, unsatd. carboxylic acid and/or unsatd. carboxylic acid anhydride and unsatd. compd. which is copolymerizable with the above compds., (B) an acid producing compd. which produces an acid by irradiation of radiation, (C) a crosslinking compd., (D) a fluorine-contg. org. compd. except the component (A), and (E) an org. solvent which dissolves the components (A), (B), (C) and (D).
Abstract:
PROBLEM TO BE SOLVED: To provide a conductive paste composition excellent in the dispersion stability, preservation stability and application characteristics of conductive particles, a transfer film excellent in flexibility and transferability, and a plasma display panel which can be manufactured with a small number of processes and is provided with an electrode of high dimension accuracy. SOLUTION: The transfer film for electrode formation of the plasma display panel is characterized by that a film forming material layer comprising the conductive paste composition containing conductive particles, a bonder resin and fatty acid is formed on a support film. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method for carrying a wafer in which the wafer is held tightly on organic polymer after the surface thereof is polished, especially when the polished wafer is thin, so that an element on the surface is not broken and the wafer is protected against fracture and/or deformation. SOLUTION: After a silicon wafer is polished while being held tightly on a substrate, e.g. a hard plate and/or a resilient carrier (backing material) and/or a wafer, using a wafer fixing agent containing a compound having liquid crystal properties and after or before the processed surface is cleaned, an organic polymer film is pasted to the polished surface, the substrate is heated at a temperature not lower than the melting point of the compound having liquid crystal properties, the wafer pasted with the organic polymer film is removed together with the organic polymer film and then transferred to a different place. COPYRIGHT: (C)2004,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a barrier rib for a plasma display panel, its manufacturing method, and compositions preferably used for the barrier rib. SOLUTION: The method for producing the barrier rib for the plasma display panel comprises: (i)a step of forming the film of barrier rib forming compositions having a structure laminating at least two barrier rib forming compositions having a different solubility for a developing solution; (ii)a step of forming a resist film on the film of barrier rib forming compositions; (iii)a step of selectively radiating a radiation on the resist film; (iv)a step of developing the resist film to form a resist pattern; (v)a step of selectively dissolving the film of barrier rib forming compositions through the resist pattern to form the pattern of barrier rib forming compositions; and (vi)a step of firing the pattern of barrier rib forming compositions, wherein the barrier rib forming composition containing: (a)a low melting point glass flit; (b)a binder containing an alkaline soluble resin; and (c)a solvent. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a fixing agent capable of strongly fixing one solid material to the other solid material and of separating easily the solid materials from each other after fixing, and also to provide a method for fixing and separating the solid materials using the fixing agent. SOLUTION: The fixing agent comprises a liquid crystal compound. The fixing method comprises (1) locating the fixing agent between one solid material and the other solid material and (2) melting the fixing agent by heating to fix the one solid material to the other solid material. The separation method comprises separating the two solid materials fixed by the above method under a temperature higher than the melting point of the fixing agent. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a wafer fixing composition containing a specific liquid crystal compound and an organic polymer and a semiconductor wafer processing method using the same, wherein a semiconductor wafer is brought into close contact with a base such as a hard plate, an elastic carrier (packing material), or a wafer and fixed so as to be held when the wafer is processed, the wafer as a work is easily separated, a fixing agent layer attached to the wafer is easily removed and/or cleaned, and the wafer as the work is kept free from contamination. SOLUTION: The wafer fixing composition contains a specific liquid crystal compound and an organic polymer. The wafer fixing composition can be provided in the form of liquid or a film. A thin film of the composition is formed on the wafer or the base. The wafer and the base, either of them is provided with the composition film on its surface, are brought into close contact with each other and fixed with each other. After the exposed surface of the wafer is subjected to processing, the wafer is separated from the base and cleaned, whereby the purpose can be achieved. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a wafer immobilizing agent, a composition for the wafer immobilizing agent and a method of working a wafer by using the same in which a semiconductor wafer is tightly immobilized and held on a substrate such as hard plate, elastic carrier (backing) or wafer when working the semiconductor wafer, the wafer of an object to be worked is easily released, further, a layer of the immobilizing agent stuck on the wafer is easily removed and irrigated and there is no danger of contamination with respect to the wafer of the object to be worked. SOLUTION: A liquid crystal compound is used as the immobilizing agent. Besides, the composition for immobilization contains the liquid crystal compound. By using them, a thin film of the liquid crystal compound is formed on a surface of the wafer or of the substrate and by using at least either one of the wafer or the substrate formed with the thin film on its surface, the both are tightly contacted and immobilized. Then, an exposed face of the wafer is worked and the wafer is separated from the substrate and irrigated to work the wafer. COPYRIGHT: (C)2004,JPO