MICRO-ELECTRO-MECHANICAL OPTICAL DEVICE

    公开(公告)号:CA2322122C

    公开(公告)日:2003-12-23

    申请号:CA2322122

    申请日:2000-10-03

    Abstract: A micro-electro-mechanical (MEM] optical device having a reduced footprint f or increasing yield on a substrate. The MEM device includes an optical element having an outer edge and supported by a support structure disposed on a substrate. The support structure is mechanically connected to the substrate through first and secon d pairs of beams which move the structure to an active position for elevating the optic device above the substrate. When in an elevated position, the optical device can be selectively tilted for deflecting optic signals. The beams are connected at one end to the support structure, at the other end to the substrate and are disposed so that the first and second bea m ends are located proximate the optical device outer edge. In a preferred embodiment, a stiction force reducing element is included on the outer edge of the optical device f or reducing the contact area between the optic device edge and the substrate.

    NON-VOLATILE MEMS MICRO-RELAYS USING MAGNETIC ACTUATORS

    公开(公告)号:CA2323025C

    公开(公告)日:2003-07-29

    申请号:CA2323025

    申请日:2000-10-06

    Abstract: An actuation device employing square-loop latchable magnetic material having a magnetization direction (polarization) capable of being changed in response to exposure to an external magnetic field is disclosed. The magnetic field i s created by a conductor assembly with non-solenoid configuration. Once the magnetization direction of the material is so changed, the external magnetic field is no longer required to maintain the new magnetization direction. The latchable magnetic material is disposed on the mobile electrode of a switching device, and another magnetic material is disposed in spaced relation to the latchable magnetic material on a stationary electrode or surface. By applying an electrical current to a conductor assembly arranged proximate the latchable material, a magnetic field is created about the latchable magnetic material, to change the magnetization direction and thereby enable the attraction or repulsion of another magnetic material located on t he stationary electrode. The resulting relative displacement of the mobile and stationary electrodes effects the selective connection or disconnection of electrical contacts carried on or associated with the respective electrodes of the actuation device without requiring additional power in order to maintain the switched state of theele ctrodes.

    63.
    发明专利
    未知

    公开(公告)号:DE60000565D1

    公开(公告)日:2002-11-14

    申请号:DE60000565

    申请日:2000-08-21

    Abstract: A method for pivoting an optical device about one or more axes thereof is disclosed. Springs couple the optical device to the micro-electro-mechanical structure. A portion of the springs are fastened on the micro-electro-mechanical structure. Fastening the portion of each spring on the electro-mechanical structure prevents the springs from moving the optical device in a translational direction when such optical device pivots about the one or more axes.

    HERMATIC FIREWALL FOR MEMS PACKAGING IN FLIP-CHIP BONDED GEOMETRY

    公开(公告)号:CA2322978A1

    公开(公告)日:2001-04-15

    申请号:CA2322978

    申请日:2000-10-06

    Abstract: A package for hermetically sealing a micro-electromechanical systems (MEMS) device in a hybrid circuit comprise a firewall formed on a substrate for the MEMS device and which has a height defining a cavity of the package in which the MEMS device will be sealed. A second substrate spaced from the first substra te hermetically seals the cavity when the second substrate is flip-chip bonded to the first substrate and soldered to the first substrate with a thin film metal materia l placed on at least a top portion of the firewall. The resulting firewall MEMS device package can be further packaged using conventional CMOS packaging techniques. By hermetically sealing the cavity, the enclosed MEMS device is protected from deleterious conditions found in the environment of conventional CMOS packagi ng techniques which is often detrimental to MEMS device function.

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