61.
    发明专利
    未知

    公开(公告)号:DE3866800D1

    公开(公告)日:1992-01-23

    申请号:DE3866800

    申请日:1988-06-27

    Abstract: This invention relates to a novel polyimide which is high-temperature resistant and capable of being molded in a fused state. This invention also relates to a high-temperature adhesive using the polyimide. The polyimide consists essentially of recurring units of the formula: where R is a tetra-valent radical selected from the group consisting of an aliphatic radical having 2 or more carbon atoms, alicyclic radical, monoaromatic radical, condensed polyaromatic radical, and non-condensed polyaromatic radical wherein aromatic radicals are linked to one another directly or via a bridge member. The polyimide can be prepared by reacting bis[4-(4-(4-aminophenoxy)phenoxy)phenyl] sulfone with a tetracarboxylic dianhydride in an organic solvent and imidizing the resultant polyamic acid. Various tetracarboxylic dianhydrides can be used and preferred dianhydride are pyromellitic dianhydride, 3,3 min ,4,4 min -benzophenonetetracarboxylic dianhydride, bis(3,4-dicarboxyphenyl) ether dianhydride, 3,3 min ,4,4 min -biphenyltetracarboxylic dianhydride, and 4,4 min -(p-phenylenedioxy)diphthalic dianhydride.

    HIGH-TEMPERATURE ADHESIVE OF POLYIMIDE

    公开(公告)号:CA1274939A

    公开(公告)日:1990-10-02

    申请号:CA530420

    申请日:1987-02-24

    Abstract: HIGH-TEMPERATURE ADHESIVE OF POLYIMIDE This invention discloses high-temperature adhesives having a good light-transmittance and excellent high-temperature flowability which comprises polyimide having recurring units represented by the following formula (I) (I) (where R is a tetra-valent radical selected form the group consisting of aliphatic radical having not less than two carbons, cyclo aliphatic radical, monoaromatic radical, condensed polyaromatic radical, and non condensed polyaromatic radical wherein aromatic radicals are mutually connected with a bond or a crosslinking function). The polyimide is obtained by preparing polyamic acid through the reaction of 2,2-bis¢4-(3-aminophenoxy)phenyl!-1,1,1,3,3,3,-hexafluoropropane as a diamine component with tetracarboxylic dianhydride such as pyromellitic dianhydride, 3,3',4,4'biphenyltetracarboxylic dianhydride, bis(3,4-dicarboxyphenyl) ether dianhydride and 3,3'4,4'-benzophenonetetracarboxylic dianhydride, and further conducting the ring-closing reaction of resultant polyamic acid by dehydration.

    POLYIMIDE FOR HIGH-TEMPERATURE ADHESIVE

    公开(公告)号:CA1274937A

    公开(公告)日:1990-10-02

    申请号:CA528101

    申请日:1987-01-26

    Abstract: POLYIMIDE FOR HIGH-TEMPERATURE ADHESIVE This invention relates to a novel polyimide and describes method of its preparation, adhesives of the polyimide and the method for their application. The polyimide has recurring units of the formula (where the positions of two carbonyl radicals in a benzene ring are meta or para, and R is a tetra-valent radical selected from the group consisting of aliphatic radical having not less than two carbons, cyclo-aliphatic radical, monoaromatic radical, condensed polyaromatic radical, and non condensed polyaromatic radical wherein aromatic radicals are mutually connected with a bond or a crosslinking function). The polyimide can be prepared by reacting diamine with tetracarboxylic dianhydride in organic solvents and imidizing resultant polyamic acid. The diamine in use is ether diamine and includes 1,3-bis¢4-(3-aminophenoxy)benzoyl!benzene and 1,4-bis¢4-(3-amino-phenoxy)benzoyl!benzene. Various tetracarboxylic dianhydrides can be used and particularly prefered are pyromellitic dianhydride and 3,3',4,4'benzophenonetetracarboxylic dianhydride.

    METHOD FOR PREPARING POLYIMIDE AND COMPOSITE MATERIAL THEREOF

    公开(公告)号:AU599517B2

    公开(公告)日:1990-07-19

    申请号:AU2406088

    申请日:1988-10-18

    Abstract: This invention relates to a method for preparing polyimide having good heat-stability and excellent flowability in a molten state. The polymide is prepared by reacting aromatic diamines such as 4,4 min -bis(3-aminophenoxy)biphenyl, bis[4-(3-aminophenoxy)phenyl] ketone and bis [4-(3-aminophenoxy)phenyl] sulfone; tetracarboxylic dianhydrides such as pyromellitic dianhydride, 3,3 min ,4,4 min -benzophenonetetracarboxylic dianhydride and bis(3,4-dicarboxyphenyl) ether dianhydride; and dicarboxylic anhydrides such as glutaric anhydride, 1,2-hexanedicarboxylic anhydride, phthalic anhydride and 3,4-benzophenonedicarboxylic anhydride. The molar ratio of aromatic diamine : tetracarboxylic dianhydride : dicarboxylic anhydride is 1:(0.9 to 1.0):(0.001 to 1.0). Another invention relates to polyimide composite materials which are excellent in mechanical strengths and processability. The materials contain the polyimide and fibrous reinforcing materials such as yarn, roving, tow, fabrics, mats and felts of glass fiber, carbon fibers or aromatic polyamide fibers.

    POLYIMIDE RESIN COMPOSITION
    67.
    发明专利

    公开(公告)号:AU591045B2

    公开(公告)日:1989-11-23

    申请号:AU1690288

    申请日:1988-05-31

    Abstract: This invention relates to molding resin compositions, and more particularly relates to polyimide resin compositions having markedly improved molding ability in addition to excellent high temperature stability, chemical resistance and mechanical strength. The polyimide resin composition of this invention consists of 99.9 to 50% by weight of the polyimide and 0.1 to 50% by weight of high temperature engineering polymer. The polyimide consists of recurring units of the following formula: wherein X is a sulfonyl radical or a carbonyl radical and R is a tetravalent radical selected from an aliphatic radical, alicyclic radical, monoaromatic radical, condensed aromatic radical and non-condensed aromatic radical. R is, for example, The high temperature engineering polymer is, for example, polyphenylene sulfide consisting of recurring units of the formula: aromatic polysulfone consisting of recurring units of the formula: or aromatic polyetherimide consisting of recurring units of the formula: l

    POLYIMIDE RESIN COMPOSITION
    68.
    发明专利

    公开(公告)号:AU3385889A

    公开(公告)日:1989-11-09

    申请号:AU3385889

    申请日:1989-04-28

    Abstract: This invention relates to molding resin compositions, and more particularly relates to polyimide resin compositions having markedly improved molding ability in addition to excellent high temperature stability, chemical resistance and mechanical strength. The polyimide resin compositions of this invention comprises 99.9 to 50.0% by weight of the polyimide and 0.1 to 50.0% by weight of aromatic polyamideimide.The polyimide consists essentially of recurring units of the following formula: wherein X is and R is, for example, o

    POLYIMIDE RESIN COMPOSITION
    69.
    发明专利

    公开(公告)号:AU1674388A

    公开(公告)日:1988-12-15

    申请号:AU1674388

    申请日:1988-05-27

    Abstract: The invention relates to molding resin compositions, and more particularly relates to polyimide resin compositions having markedly improved molding ability in addition to excellent high temperature stability, chemical resistance and mechanical strength. The polyimide resin compositions of this invention consist of 99.9 to 50% by weight of the polyimide and 0.1 to 50% by weight of high-temperature engineering polymer. The polyimide consists of recurring units of the following formula: wherein X is direct bond, thio radical, or o- or p-phenylene dicarbonyl radical and R is a tetravalent radical selected from an aliphatic radical, alicyclic radical, monoaromatic radical, condensed aromatic radical and non-condensed aromatic radical. R is, for example, The high-temperature engineering polymer is, for example, polyphenylene sulfide consisting of recurring units of the formula: aromatic polysulfone consisting of recurring units of the formula: or aromatic polyetherimide consisting of recurring units of the formula:

    POLYIMIDE AND HIGH TEMPERATURE ADHESIVE THEREOF

    公开(公告)号:AU579272B2

    公开(公告)日:1988-11-17

    申请号:AU6717387

    申请日:1987-01-06

    Abstract: This invention relates to a novel polyimide and describes method of its preparation, adhesives of the polyimide and the method for their application.The polyimide has recurring units of the formula(where R is a tetra-valent radical selected from the group consisting of aliphatic radical having not less than two carbons, cyclo-aliphatic radical, monoaromatic radical, condensed polyaromatic radical, and non condensed polyaromatic radical wherein aromatic radicals are mutually connected with a bond or a crosslinking function).The polyimide can be prepared by reacting 2,6-bis(3--amino-phenoxy)pyridine with tetracarboxylic dianhydride in an organic solvent and imidizing resultant polyamic acid.Various tetracarboxylic dianhydrides can be used and particularly preferred are pyromellitic dianhydride and 3,3',4,4'--benzophenonetetracarboxylic dianhydride.

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