Abstract:
A direct (DC) voltage is applied to an electrode at a voltage value to clamp a workpiece to an electrostatic chuck in a processing chamber. The electrode is embedded into the electrostatic chuck. An electrostatic chuck current through the electrode at the DC voltage is measured. A DC self bias induced on the workpiece by a plasma is determined based on the electrostatic chuck current and the applied voltage.
Abstract:
Die Erfindung betrifft ein optisches Element mit einem Substrat (105), wenigstens einer Reflexionsschicht (120), wobei die Reflexionsschicht eine Mehrzahl von Zonen (221, 222) aus unterschiedlichem Material aufweist, und einer adhäsionsverbessernden Schicht (110), welche zwischen dem Substrat (105) und der Reflexionsschicht (120, 220) angeordnet ist wobei diese adhäsionsverbessernde Schicht (110) ausschließlich aus Elementen besteht, die im Substrat (105) und/oder in der Reflexionsschicht (120) enthalten sind.
Abstract:
A method for the preparation of a highly polarized nuclear spins containing sample of an organic or inorganic material, containing H or OH groups or adsorbed water molecules. Such highly polarized nuclear spins containing samples can be subjected to nuclear magnetic resonance (NMR) measurement and/or can be thawed and immediately administered to an individual undergoing a magnetic resonance imaging (MRI) scan. The method is based on generating unstable radicals on the surface of the sample in the presence of ionized environment followed by cooling the sample to cryogenic temperatures. A device for carrying out a particular step of said method is also discloses.
Abstract:
A method of forming one or more protrusions on an outer surface of a polished face of a solid state material,said method including the step of applying focused inert gas ion beam local irradiation towards an outer surface of a polished facet of a solid state material in a way of protruding top surface material;wherein irradiated focused inert gas ions from said focused inert gas ion bean penetrate the outer surface of said polished facet of said solid state material;and wherein irradiated focused inert gas ions cause expansive strain within the solid state crystal lattice of the solid state material below said outer surface at a pressure so as to induce expansion of solid state crystal lattice,and form a protrusion on the outer surface of the polished face of said solid state material.
Abstract:
The present invention generally relates to a low temperature plasma probe for desorbing and ionizing at least one analyte in a sample material and methods of use thereof. In one embodiment, the invention generally relates to a low temperature plasma probe including: a housing having a discharge gas inlet port, a probe tip, two electrodes, and a dielectric barrier, in which the two electrodes are separated by the dielectric barrier, in which application of voltage from a power supply generates a low temperature plasma, and in which the low temperature plasma is propelled out of the discharge region by the electric field and/or the discharge gas flow.
Abstract:
Die Erfindung betrifft eine Vorrichtung, umfassend mindestens einen Elektronenstrahlerzeuger (301) zum Generieren von beschleunigten Elektronen, mit denen Schüttgutpartikel (303) während des freien Falls beaufschlagbar sind, wobei der Elektronenstrahlerzeuger (301) ringförmig ausgebildet ist, bei dem die von einer ringförmigen Kathode emittierten und beschleunigten Elektronen aus einem Elektronenaustrittsfenster in Richtung Ringachse austreten; wobei der ringförmige Elektronenstrahlerzeuger (301) derart angeordnet ist, dass dessen Ringachse senkrecht oder mit einem Winkel von bis zu 45° abweichend von der Senkrechten ausgerichtet ist und wobei oberhalb des ringförmigen Elektronenstrahlerzeugers eine Einrichtung zum Vereinzeln von Schüttgutpartikeln angeordnet ist, deren Bodenwandung (304) mindestens eine Öffnung aufweist, aus der Schüttgutpartikel (303) heraus- und von dort durch den vom Elektronenstrahlerzeuger (301) geformten Ring hindurchfallen.
Abstract:
Etch rate distribution non-uniformities are predicted for a succession of hardware tilt angles of the RF source applicator relative to the workpiece, and the behavior is modeled as a non-uniformity function for each one of at least two plasma reactors. An offset Δα in tilt angle α between the non-uniformity functions of the two plasma reactors is detected. The two reactors are then matched by performing a hardware tilt in one of them through a tilt angle equal to the offset Δα.