公开(公告)号：US5695110A

公开(公告)日：1997-12-09

申请号：US649521

申请日：1996-05-17

Applicant: Klaus Schirmer

Inventor： Klaus Schirmer

IPC: H01R43/02 ,  H05K3/34 ,  B23K1/00

CPC classification number: H01R43/0256 ,  H01R12/58 ,  H05K3/3447 ,  H05K2201/10287 ,  H05K2201/10765 ,  Y10T29/49142

Abstract: This disclosure describes a procedure for soldering an insulated wire where the wire end features a U- or V-shaped hook with one bending point and is introduced such into the soldering hole of a printed circuit board that the bending point protrudes from the other side of the soldering hole.

Abstract translation: 本公开描述了用于焊接绝缘电线的过程，其中电线端部具有一个具有一个弯曲点的U形或V形钩，并被引入到印刷电路板的焊接孔中，弯曲点从另一侧突出 焊接孔。

公开(公告)号：US4753005A

公开(公告)日：1988-06-28

申请号：US52486

申请日：1987-05-21

Applicant: Alexander W. Hasircoglu

Inventor： Alexander W. Hasircoglu

IPC: H01R43/00 ,  H01R13/658 ,  H01R43/28 ,  H05K1/02 ,  H05K3/34 ,  H05K3/00 ,  H01R4/66

CPC classification number: H01R12/62 ,  H01R43/28 ,  H05K3/3405 ,  H01R13/6592 ,  H01R13/6595 ,  H01R23/662 ,  H05K1/0218 ,  H05K1/0219 ,  H05K2201/10356 ,  H05K2201/10765 ,  Y10T29/49124 ,  Y10T29/5145 ,  Y10T29/5193

Abstract: Cables having interspersed co-planar signal and ground wires are terminated at a planar circuit board by stapling the cable to the circuit board with a bus member, mechanically and electrically connecting the signal wires to signal wire termination sites which are downstream from the bus member, folding the ground wires back over the bus member, and mechanically and electrically connecting the ground wires to the bus member.

Abstract translation: 具有散布的共面信号和接地线的电缆通过用总线构件将电缆装订到电路板而端接在平面电路板上，将信号线机械地和电气地连接到总线构件下游的信号线终端位置， 将接地线折叠在总线构件上，并将接地线机械地和电气地连接到总线构件。

公开(公告)号：US4249582A

公开(公告)日：1981-02-10

申请号：US76645

申请日：1979-09-18

Applicant: Joseph M. Jacobs

Inventor： Joseph M. Jacobs

IPC: H05K3/30 ,  H05K3/34 ,  H05K13/00 ,  B21F1/00

CPC classification number: H05K3/308 ,  H05K13/0092 ,  H05K2201/10765 ,  H05K2201/10878 ,  H05K3/3447

Abstract: A method is disclosed for the temporary retention of insulated electrical leads by a printed circuit board preparatory to permanent electrical and mechanical attachment. Also disclosed is apparatus for forming the leads for said retention. The lead has a metallic wire therethrough with a residuum of elasticity. The printed circuit board consists of an insulative sheet with a plurality of selectively interconnected metallic electrical terminals each having a hole therethrough smaller in diameter than the outside diameter of the electrical lead, but larger in diameter than the wire by a factor of appreciably greater than 2. The method according to the invention comprises stripping the insulation from an end of the lead to provide a predetermined length of wire projecting from the abutment of the insulation formed by the stripping. The wire is then folded to form a narrow J-hook, the folded width of which is appreciably greater than the diameter of the hole. The point of the fold is selected such that the distance between the tip of the wire and the abutment of the insulation is substantially equal to the thickness of the board. The tip of the wire is offset to form a spur. When the retentive configuration is inserted into the hole, the J-hook is constricted to provide entry into the hole and thereafter, because of its residuum or elasticity, expands. The abutment of the insulation limits the distance of entry of the wire into the hole, and the spur, together with the expansion of the J-hook, inhibits withdrawal of the lead from the hole.

Abstract translation: 公开了一种用于通过准备永久电气和机械附接的印刷电路板临时保持绝缘电引线的方法。 还公开了用于形成用于所述保持的引线的装置。 引线具有穿过其中的金属线，具有弹性残留。 印刷电路板由具有多个选择性互连的金属电端子的绝缘片组成，每个绝缘片具有直径小于电引线的外径的孔，但直径大于导线的直径大于2倍 根据本发明的方法包括从引线的端部剥离绝缘体，以提供从剥离形成的绝缘体的邻接部突出的预定长度的电线。 然后将线折叠以形成窄的J形钩，其折叠宽度明显大于孔的直径。 选择褶皱的点使得线的尖端和绝缘体的邻接之间的距离基本上等于电路板的厚度。 电线的尖端偏移以形成支线。 当保持构造插入孔中时，J形钩被收缩以提供入孔，此后由于其残留或弹性而膨胀。 绝缘体的邻接限制了电线进入孔的距离，并且尖齿与J形钩的膨胀一起阻止了铅从孔中的撤出。

公开(公告)号：US09698083B2

公开(公告)日：2017-07-04

申请号：US14727554

申请日：2015-06-01

Applicant: Infineon Technologies AG

Inventor： Alfred Swain Hong Yeo

IPC: H01R9/00 ,  H01L23/495 ,  H01L21/56 ,  H01L25/16 ,  H05K1/18 ,  H05K3/34 ,  H01L23/31

CPC classification number: H01L23/49531 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/495 ,  H01L23/49555 ,  H01L23/49589 ,  H01L25/16 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/181 ,  H05K1/18 ,  H05K3/3426 ,  H05K2201/10515 ,  H05K2201/10522 ,  H05K2201/1053 ,  H05K2201/10689 ,  H05K2201/10765 ,  H05K2201/10772 ,  H05K2201/10962 ,  Y02P70/613 ,  Y10T29/4913 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: An electronic device comprising a package comprising an encapsulated electronic chip, at least one at least partially exposed electrically conductive carrier lead for mounting the package on and electrically connecting the electronic chip to a carrier, and at least one at least partially exposed electrically conductive connection lead, and an electronic member stacked with the package so as to be mounted on and electrically connected to the package by the at least one connection lead.

公开(公告)号：US20140160681A1

公开(公告)日：2014-06-12

申请号：US13708876

申请日：2012-12-07

Applicant: WINTEC INDUSTRIES, INC.

Inventor： Kong-Chen Chen

IPC: H05K1/02 ,  H05K13/00

CPC classification number: H05K3/366 ,  H01R12/718 ,  H01R12/721 ,  H01R12/737 ,  H05K1/0201 ,  H05K1/117 ,  H05K3/325 ,  H05K2201/09181 ,  H05K2201/09745 ,  H05K2201/10265 ,  H05K2201/10303 ,  H05K2201/1034 ,  H05K2201/10409 ,  H05K2201/10606 ,  H05K2201/10757 ,  H05K2201/10765 ,  H05K2201/10787 ,  H05K2201/1081 ,  Y10T29/49117

Abstract: An electric apparatus for connecting to a first printed circuit includes a second printed circuit, which includes a first surface substantially parallel to a first plane and a second surface substantially parallel to a second plane perpendicular to the first plane. The first surface includes a first area and the second surface includes a smaller second area. The second printed circuit includes conductive traces in a layer of the second printed circuit. The electric apparatus further includes first and second conductive pins including first and second longitudinal axes, respectively. First and second notches in the second printed circuit include respective first and second openings through the second surface adapted to receive portions of the first and second pins and adapted to electrically connect the pins to first and second respective ones of the conductive traces. The first and second longitudinal axes are installed substantially parallel to the first plane.

Abstract translation: 用于连接到第一印刷电路的电气设备包括第二印刷电路，其包括基本上平行于第一平面的第一表面和基本上平行于垂直于第一平面的第二平面的第二表面。 第一表面包括第一区域，第二表面包括较小的第二区域。 第二印刷电路在第二印刷电路的一层中包括导电迹线。 电气设备还包括分别包括第一和第二纵向轴线的第一和第二导电销。 第二印刷电路中的第一和第二凹口包括通过第二表面的相应的第一和第二开口，其适于接收第一和第二引脚的部分，并且适于将引脚电连接到第一和第二相应的导电迹线。 第一和第二纵轴基本上平行于第一平面安装。

公开(公告)号：US20120298406A1

公开(公告)日：2012-11-29

申请号：US13113259

申请日：2011-05-23

Applicant: Wai Mon Ma

Inventor： Wai Mon Ma

IPC: H05K1/09 ,  H05K1/11 ,  B23K31/02

CPC classification number: B23K1/0016 ,  B23K2101/42 ,  H05K1/112 ,  H05K3/3426 ,  H05K2201/0969 ,  H05K2201/10765

Abstract: Micro-vias that are conventionally used for vertical connections in wire or circuit boards may be used for an entirely different purpose; the micro-vias may be used in the creation of solder joints to initiate the controlled formation of voids that increase the reliability of the solder joints.

Abstract translation: 通常用于电线或电路板中的垂直连接的微通孔可以用于完全不同的目的; 微通孔可用于形成焊点，以开始控制形成空穴，从而提高焊点的可靠性。

公开(公告)号：US20110116236A1

公开(公告)日：2011-05-19

申请号：US12820611

申请日：2010-06-22

Applicant: HIDEKI AKAHORI

Inventor： HIDEKI AKAHORI

IPC: H05K7/20 ,  H05K3/30 ,  H01R9/00

CPC classification number: H05K1/141 ,  H01L23/36 ,  H01L23/49541 ,  H01L2924/0002 ,  H05K1/056 ,  H05K3/202 ,  H05K3/3405 ,  H05K3/3421 ,  H05K3/3447 ,  H05K3/403 ,  H05K2201/09072 ,  H05K2201/09181 ,  H05K2201/09745 ,  H05K2201/10166 ,  H05K2201/1034 ,  H05K2201/10765 ,  H05K2201/10969 ,  Y10T29/4913 ,  Y10T29/49147 ,  H01L2924/00

Abstract: A heat conduction board, include a heat dissipation member; a heat conduction member which is arranged on the heat dissipation member and conducts a heat thereto; a lead frame which is formed in a wire pattern shape, and is arranged on the heat conduction member; and a printed circuit board which mounts a second electronic component for controlling a first electronic component; wherein the first electronic component and the printed circuit board are soldered to the lead frame.

Abstract translation: 导热板包括散热构件; 布置在散热构件上并传导热量的导热构件; 引线框架，其形成为线状，并布置在导热构件上; 以及安装用于控制第一电子部件的第二电子部件的印刷电路板; 其中所述第一电子部件和所述印刷电路板焊接到所述引线框架。

公开(公告)号：US07677763B2

公开(公告)日：2010-03-16

申请号：US11541314

申请日：2006-09-29

Applicant: Timothy Chan

Inventor： Timothy Chan

IPC: F21V21/00 ,  F21S4/00 ,  F21V29/00

CPC classification number: H01R33/09 ,  F21K9/00 ,  F21V19/0025 ,  F21V19/042 ,  F21Y2105/10 ,  F21Y2107/00 ,  F21Y2107/30 ,  F21Y2115/10 ,  H05K3/107 ,  H05K3/308 ,  H05K3/325 ,  H05K2201/09472 ,  H05K2201/09981 ,  H05K2201/10106 ,  H05K2201/10651 ,  H05K2201/10765 ,  Y10S362/80

Abstract: A method and system for attaching LEDs to circuitry which would protect the LEDs from heat damage and allows for individual LEDs to be removed.

Abstract translation: 一种用于将LED附接到电路的方法和系统，其将保护LED免受热损伤并且允许去除各个LED。

公开(公告)号：US20090200914A1

公开(公告)日：2009-08-13

申请号：US11802590

申请日：2007-05-23

Applicant: Gwo-Feng Hwang ,  Yu-Shing Lien

Inventor： Gwo-Feng Hwang ,  Yu-Shing Lien

IPC: H01J5/48 ,  H01J5/50

CPC classification number: H05K3/308 ,  F21K9/00 ,  F21Y2115/10 ,  H05K2201/10106 ,  H05K2201/1059 ,  H05K2201/10765

Abstract: The present invention relates to a light emitting module, which comprises: a main body; a common terminal, in which one side of the common terminal is exposed to the main body and a weldless coupling structure is disposed on the bottom of the common terminal; at least a control terminal, in which one side of the control terminal is exposed to the main body and a weldless coupling structure is disposed on the bottom of the control terminal; and at least a light emitting device. When assembling the components mentioned above, the common terminal and the control terminal are inserted into a through hole of a printed circuit board (PCB), such that the structure can be inlaid into the through hole and a better contact is obtained by its elasticity. Accordingly, the light emitting module can be fastened on the PCB.

Abstract translation: 本发明涉及发光模块，其包括：主体; 公共端子的一侧暴露于主体的公共端子和在公共端子的底部设置无焊接耦合结构; 至少控制端子，其中控制端子的一侧暴露于主体，并且无焊接耦合结构设置在控制端子的底部; 和至少一个发光器件。 当组装上述组件时，公共端子和控制端子插入到印刷电路板（PCB）的通孔中，使得结构可以嵌入通孔中，并且通过其弹性获得更好的接触。 因此，发光模块可以紧固在PCB上。

公开(公告)号：US20050133928A1

公开(公告)日：2005-06-23

申请号：US10741919

申请日：2003-12-19

Applicant: Gregory Howard ,  Howard Test ,  Tz-Cheng Chiu

Inventor： Gregory Howard ,  Howard Test ,  Tz-Cheng Chiu

IPC: H01L21/56 ,  H01L21/60 ,  H01L23/00 ,  H01L23/485 ,  H01L23/498 ,  H05K3/34 ,  H01L23/48 ,  H01L21/44

CPC classification number: H01L23/562 ,  H01L21/563 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/1134 ,  H01L2224/13016 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16238 ,  H01L2224/73204 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/3426 ,  H05K2201/10704 ,  H05K2201/10765 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/013

Abstract: A device comprising a workpiece (401) with a surface (401a) including a center (402) and an array of bond pads (420), further an array of interconnects (405) of uniform height. Each of these interconnects comprises an elongated wire loop, which has both wire ends (440, 450) attached to one of the bond pads, respectively, and its major diameter (460) approximately normal to the workpiece surface. A substantial number of the loops has an orientation approximately normal to the vector (410) from the workpiece center to the respective bond pad; this number includes more than 30% of the loops located along the workpiece perimeter and more than 10% of the total loops. Examples of workpieces are a semiconductor device, an integrated circuit (IC) chip, and a semiconductor device package.

Abstract translation: 一种包括具有包括中心（402）和接合焊盘（420）阵列的表面（401a）的工件（401）的装置，还包括均匀高度的互连阵列（405）。 这些互连件中的每一个包括细长的线环，其具有分别连接到一个接合焊盘的两个线端（440,450）以及其大致垂直于工件表面的大直径（460）。 相当多的环路具有大约垂直于从工件中心到相应接合焊盘的矢量（410）的取向; 这个数字包括沿着工件周边设置的超过30％的循环和超过总循环的10％。 工件的实例是半导体器件，集成电路（IC）芯片和半导体器件封装。