公开(公告)号：US20170125276A1

公开(公告)日：2017-05-04

申请号：US14926084

申请日：2015-10-29

Applicant: STMicroelectronics (Malta) Ltd

Inventor： Jeremy Spiteri ,  Ivan Ellul

IPC: H01L21/683 ,  H01L21/68 ,  H01L21/66

CPC classification number: H01L21/6836 ,  H01L21/681 ,  H01L21/6835 ,  H01L22/12 ,  H01L2221/68309 ,  H01L2221/68313

Abstract: A semiconductor device carrier tape with image sensor detectable dimples is disclosed. The dimpled carrier tape is formed of a flexible strip of material. A plurality of pockets are disposed spaced apart along the length of the flexible strip of material. Each pocket is configured to hold a semiconductor device. A dimple is formed in each of the plurality of pockets where each dimple has a peripheral edge and a bottom surface. Detection of the dimple by an image sensor facilitates alignment of a semiconductor device with the pocket and precise placement of the semiconductor device in the pocket.

公开(公告)号：US20150364455A1

公开(公告)日：2015-12-17

申请号：US14723893

申请日：2015-05-28

Applicant: STMicroelectronics (Grenoble 2) SAS ,  STMicroelectronics (Malta) Ltd ,  STMicroelectronics S.r.l.

Inventor： Angelo Crobu ,  Kenneth Fonk ,  Romain Coffy

IPC: H01L25/18 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L25/18 ,  G01L19/0084 ,  G01L19/147 ,  G01L19/148 ,  H01L23/24 ,  H01L23/3157 ,  H01L24/10 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/10135 ,  H01L2224/10165 ,  H01L2224/1319 ,  H01L2224/16145 ,  H01L2224/26122 ,  H01L2224/26135 ,  H01L2224/29007 ,  H01L2224/29021 ,  H01L2224/29036 ,  H01L2224/32014 ,  H01L2224/32111 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/48106 ,  H01L2224/48145 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73207 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/146 ,  H01L2924/16151 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

Abstract: A stack of chips is formed by a first integrated-circuit chip and a second integrated-circuit chip. The chips have opposing faces which are separated from each other by an interposed spacer. The spacer is fastened by adhesion to only one of the opposing faces. The opposing faces are fastened to each other by a local adhesive which is separate from spacer.

Abstract translation: 一堆芯片由第一集成电路芯片和第二集成电路芯片形成。 芯片具有通过插入的间隔件彼此分离的相对面。 间隔件通过粘合固定到只有一个相对的面。 相对的面通过与间隔物分离的局部粘合剂彼此紧固。

公开(公告)号：US20140353775A1

公开(公告)日：2014-12-04

申请号：US14288130

申请日：2014-05-27

Applicant: STMicroelectronics S.r.l. ,  STMicroelectronics (Malta) Ltd

Inventor： Kevin Formosa ,  Luca Maggi

IPC: B81B7/00 ,  B81C1/00 ,  B81B3/00

CPC classification number: B81B7/007 ,  B81B3/0094 ,  B81B2207/012 ,  B81B2207/07 ,  B81B2207/095 ,  B81B2207/097 ,  B81C1/00238 ,  B81C1/00301 ,  B81C2203/00 ,  B81C2203/0136 ,  B81C2203/0792 ,  H01L21/561 ,  H01L23/3114 ,  H01L24/73 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/50 ,  H01L29/84 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/48145 ,  H01L2224/73265 ,  H01L2224/81005 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06506 ,  H01L2225/06513 ,  H01L2225/06524 ,  H01L2225/06548 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A wafer-level packaging, comprising: a first semiconductor body integrating a MEMS structure; a second semiconductor body, including a surface electrical-contact region and an ASIC coupled to the MEMS structure and to said electrical-contact region; a first coating layer, made of resin, which englobes and protects the first body, the second body, and the electrical-contact region; at least one first conductive through via, which extends through the first coating layer in an area corresponding, and electrically coupled, to the first electrical-contact region; an electrical-contact pad, which extends over the first coating layer, electrically coupled to the first conductive through via; a third semiconductor body, integrating an electronic circuit, glued on the first coating layer; a second coating layer, made of resin, which englobes and protects the third body; at least one second conductive through via, which extends completely through the second coating layer in an area corresponding, and electrically coupled, to the electrical-contact pad; and a further electrical-contact pad electrically coupled to the second conductive through via.

Abstract translation: 一种晶片级封装，包括：集成MEMS结构的第一半导体本体; 包括表面电接触区域和耦合到所述MEMS结构和所述电接触区域的ASIC的第二半导体本体; 由树脂制成的第一涂层，其包围并保护第一主体，第二主体和电接触区域; 至少一个第一导电通孔，其在与第一电接触区域对应并电耦合的区域中延伸穿过第一涂层; 电接触焊盘，其在所述第一涂层上延伸，电耦合到所述第一导电通孔; 第三半导体本体，集成在第一涂层上的电子电路; 由树脂制成的第二涂层，其缠绕并保护第三体; 至少一个第二导电通孔，其在对应于并电耦合到所述电接触焊盘的区域中完全延伸穿过所述第二涂层; 以及电耦合到第二导电通孔的另一个电接触焊盘。

公开(公告)号：EP3718961A1

公开(公告)日：2020-10-07

申请号：EP20164126.3

申请日：2020-03-19

Applicant: STMicroelectronics (Malta) Ltd ,  STMicroelectronics S.r.l.

Inventor： FORMOSA, Kevin ,  DEL SARTO, Marco

IPC: B81C1/00

Abstract: A method of manufacturing electronic devices (10), comprises providing on a support member (20) such as a tape:
- a first electronic component (12), such as a sensor, having opposed first (12a) and second (12b) surfaces and arranged on the support member (20) with the second surface (12b) towards the support member (20), wherein the first electronic component (12) has a thickness between the opposed first (12a) and second (12b) surfaces,
- a second electronic component (14), such as an IC, mounted on a substrate (16) and arranged on the support member (20) with a substrate surface opposed the second electronic component (14) and facing towards the support member (20), wherein the substrate (16) and the second electronic component (14) have a joint thickness which is less than the thickness of the first electronic component (12),
- molding onto the support member (20) having arranged thereon the first (12) and second (14) electronic components package molding material (24) to encapsulate the second electronic component (14) and leaving exposed the first surface (12a) of the first electronic component (12), and
- separating the support member (20) to expose the second surface (12b) of the first electronic component (12) and the substrate surface of the substrate (16) opposed the at least one second electronic component (14) .

公开(公告)号：EP2517480B1

公开(公告)日：2015-08-19

申请号：EP10795018.0

申请日：2010-12-22

Applicant: STMicroelectronics S.r.l. ,  Stmicroelectronics (Malta) Ltd

Inventor： FORMOSA, Kevin ,  AZZOPARDI, Mark Anthony ,  CORTESE, Mario Francesco

IPC: H04R19/00 ,  B81B7/00

CPC classification number: H04R19/005 ,  B81B2201/0257 ,  B81B2207/012 ,  B81B2207/07 ,  B81B2207/093 ,  B81C1/0023 ,  B81C2203/019 ,  B81C2203/035 ,  B81C2203/0785 ,  B81C2203/0792 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/8592 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/16151 ,  H01L2924/3025 ,  Y10T29/49117 ,  H01L2924/00014 ,  H01L2924/00

公开(公告)号：EP3113511B1

公开(公告)日：2018-12-26

申请号：EP16175620.0

申请日：2016-06-22

Applicant: STMicroelectronics S.r.l. ,  STMicroelectronics (Malta) Ltd

Inventor： BRIOSCHI, Roberto ,  BARBARA, Paul Anthony

IPC: H04R19/04

CPC classification number: H04R1/04 ,  B81B7/0061 ,  B81B7/008 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2207/012 ,  B81B2207/07 ,  H04R1/06 ,  H04R19/005 ,  H04R19/04 ,  H04R31/00 ,  H04R31/006 ,  H04R2201/003 ,  H04R2499/11

Abstract: A micro-electro-mechanical microphone comprising: a substrate (2); a sensor chip (5), which is coupled to the substrate (2) and integrates a micro-electro-mechanical electro-acoustic transducer (35); a control chip (6), which is joined to the substrate (2) and is operatively coupled to the sensor chip (5); a bonding ring (16), which surrounds the sensor chip (5) and the control chip (6); a cap (3), which is coupled to the substrate (2) via the bonding ring (16) and forms an acoustic chamber (4) that houses the control chip (6) and the sensor chip (5); a barrier (18), which extends between the bonding ring (16) and the sensor chip (5) at a first distance and a second distance, respectively, therefrom, for defining a first trench (19) between the bonding ring (16) and the barrier (18) and a second trench (25) between the barrier (18) and the sensor chip (5).

公开(公告)号：EP3113509B1

公开(公告)日：2018-08-01

申请号：EP16175518.6

申请日：2016-06-21

Applicant: STMicroelectronics S.r.l. ,  Stmicroelectronics (Malta) Ltd

Inventor： BRIOSCHI, Roberto ,  GRITTI, Alex ,  FORMOSA, Kevin

IPC: H04R19/00 ,  B81B7/00 ,  H04R1/06 ,  H04R31/00 ,  H04R1/04 ,  H04R19/04

CPC classification number: H04R1/04 ,  B81B7/0061 ,  B81B7/008 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2207/012 ,  B81B2207/07 ,  H04R1/06 ,  H04R19/005 ,  H04R19/04 ,  H04R31/00 ,  H04R31/006 ,  H04R2201/003 ,  H04R2499/11

Abstract: A micro-electro-mechanical microphone comprising: a substrate (2); a sensor chip (5), which is coupled to the substrate (2) and integrates a micro-electro-mechanical electro-acoustic transducer (35); a control chip (6), which is joined to the substrate (2) and is operatively coupled to the sensor chip (5); a bonding ring (16), which surrounds the sensor chip (5) and the control chip (6); a cap (3), which is coupled to the substrate (2) via the bonding ring (16) and forms an acoustic chamber (4) that houses the control chip (6) and the sensor chip (5); a barrier (18), which extends between the bonding ring (16) and the sensor chip (5) at a first distance and a second distance, respectively, therefrom, for defining a first trench (19) between the bonding ring (16) and the barrier (18) and a second trench (25) between the barrier (18) and the sensor chip (5).

公开(公告)号：EP3113511A1

公开(公告)日：2017-01-04

申请号：EP16175620.0

申请日：2016-06-22

Applicant: STMicroelectronics S.r.l. ,  Stmicroelectronics (Malta) Ltd

Inventor： BRIOSCHI, Roberto ,  BARBARA, Paul Anthony

IPC: H04R19/04

CPC classification number: H04R1/04 ,  B81B7/0061 ,  B81B7/008 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2207/012 ,  B81B2207/07 ,  H04R1/06 ,  H04R19/005 ,  H04R19/04 ,  H04R31/00 ,  H04R31/006 ,  H04R2201/003 ,  H04R2499/11

Abstract: A micro-electro-mechanical microphone comprising: a substrate (2); a sensor chip (5), which is coupled to the substrate (2) and integrates a micro-electro-mechanical electro-acoustic transducer (35); a control chip (6), which is joined to the substrate (2) and is operatively coupled to the sensor chip (5); a bonding ring (16), which surrounds the sensor chip (5) and the control chip (6); a cap (3), which is coupled to the substrate (2) via the bonding ring (16) and forms an acoustic chamber (4) that houses the control chip (6) and the sensor chip (5); a barrier (18), which extends between the bonding ring (16) and the sensor chip (5) at a first distance and a second distance, respectively, therefrom, for defining a first trench (19) between the bonding ring (16) and the barrier (18) and a second trench (25) between the barrier (18) and the sensor chip (5).

Abstract translation: 一种微机电麦克风，包括：基板（2）; 传感器芯片（5），其耦合到所述基板（2）并且集成了微电机电声换能器（35）; 控制芯片（6），其连接到所述基板（2）并且可操作地耦合到所述传感器芯片（5）; 围绕传感器芯片（5）和控制芯片（6）的接合环（16）; 盖（3），其经由所述接合环（16）联接到所述基板（2），并形成容纳所述控制芯片（6）和所述传感器芯片（5）的声室（4）; 阻挡层（18），其分别在所述接合环（16）和所述传感器芯片（5）之间以其第一距离和第二距离延伸，用于限定所述接合环（16）和所述传感器芯片（5）之间的第一沟槽（19） 和阻挡层（18）和位于阻挡层（18）和传感器芯片（5）之间的第二沟槽（25）。

公开(公告)号：EP3113510A1

公开(公告)日：2017-01-04

申请号：EP16175630.9

申请日：2016-06-22

Applicant: STMicroelectronics S.r.l. ,  Stmicroelectronics (Malta) Ltd

Inventor： BRIOSCHI, Roberto

IPC: H04R19/00

Abstract: A microelectromechanical microphone includes: a supporting substrate (2), having a first face (2a) and a second face (2b); a sensor chip (5), bonded to the first face (2a) of the supporting substrate (2) and integrating a microelectromechanical electroacoustic transducer (35); and a control chip (6) operatively coupled to the sensor chip (5), at least one portion of the control chip (6) being comprised between the first face (2a) and the second face (2b) of the supporting substrate (2). The sensor chip (5) is at least partially arranged on top of the control chip (6).

Abstract translation: 微电机麦克风包括：具有第一面（2a）和第二面（2b）的支撑衬底（2）; 传感器芯片（5），其结合到所述支撑基板（2）的第一面（2a）并且集成微机电电声换能器（35）; 以及可操作地耦合到所述传感器芯片（5）的控制芯片（6），所述控制芯片（6）的至少一部分包括在所述支撑衬底（2）的第一面（2a）和第二面（2b）之间 ）。 传感器芯片（5）至少部分地布置在控制芯片（6）的顶部上。

公开(公告)号：EP3718959A1

公开(公告)日：2020-10-07

申请号：EP20164136.2

申请日：2020-03-19

Applicant: STMicroelectronics (Malta) Ltd

Inventor： FORMOSA, Kevin ,  SARIBAS, Eftal

IPC: B81B7/00 ,  H01L23/24

Abstract: An electronic device (10) comprises:
- one or more electronic components (such as a MEMS 12a and an ASIC 12b) arranged on a substrate (14),
- a cap member (16) applied onto the substrate (14) and covering the electronic component(s) arranged thereon, the cap member (16) having an opening (18) at the electronic component(s),
- a filling of encapsulant material such as a gel (24) in the cap member (16), the encapsulant material (24) sealingly encapsulating the electronic component(s) arranged on the substrate (14).
The cap member (16) comprises an outer wall (16a) having the opening (18) therein and inner wall (16b) surrounding the electronic component(s),
- the inner wall (16b) extends from a proximal end at the substrate (14) towards a distal end facing the opening (18) in the outer wall (16a) to provide a reception chamber for the electronic component(s) within the inner wall (16b) and a peripheral chamber between the inner wall (16b) and the outer wall (16a) of the cap member (16), wherein the peripheral chamber of the cap member (16) surrounds the reception chamber for the electronic component(s), and
- the filling of encapsulant material (24) is provided in the reception chamber for the electronic component (s) .