中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

7 records (took 0.027 seconds)

    MICROELECTROMECHANICAL TRANSDUCER AND CORRESPONDING ASSEMBLY PROCESS
    1.
    发明申请
    MICROELECTROMECHANICAL TRANSDUCER AND CORRESPONDING ASSEMBLY PROCESS 审中-公开
    微电子变压器及相关组件工艺

    公开(公告)号：WO2011076910A1

    公开(公告)日：2011-06-30

    申请号：PCT/EP2010/070608

    申请日：2010-12-22

    Applicant: STMICROELECTRONICS S.R.L. ,  STMICROELECTRONICS (MALTA) LTD ,  FORMOSA, Kevin ,  AZZOPARDI, Mark Anthony ,  CORTESE, Mario Francesco

    Inventor： FORMOSA, Kevin ,  AZZOPARDI, Mark Anthony ,  CORTESE, Mario Francesco

    IPC: H04R19/00 ,  B81B7/00

    CPC classification number: H04R19/005 ,  B81B2201/0257 ,  B81B2207/012 ,  B81B2207/07 ,  B81B2207/093 ,  B81C1/0023 ,  B81C2203/019 ,  B81C2203/035 ,  B81C2203/0785 ,  B81C2203/0792 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/8592 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/16151 ,  H01L2924/3025 ,  Y10T29/49117 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: A MEMS transducer (1) has a micromechanical sensing structure (10) and a package (46). The package (46) is provided with a substrate (45), carrying first electrical-connection elements (47), and with a lid (25), coupled to the substrate to define an internal cavity (24), in which the micromechanical sensing structure (10) is housed. The lid (25) is formed by: a cap layer (20) having a first surface (20a) and a second surface (20b), set opposite to one another, the first surface (20a) defining an external face of the package (46) and the second surface (20b) facing the substrate (45) inside the package (46); and a wall structure (21), set between the cap layer (20) and the substrate (45), and having a coupling face (21a) coupled to the substrate (45). At least a first electrical component (10, 11) is coupled to the second surface (20b) of the cap layer (20), inside the package (46), and the coupling face (21a) of the wall structure (21) carries second electrical-connection elements (30), electrically connected to the first electrical component (10, 11) and to the first electrical-connection elements (47).

    Abstract translation: MEMS传感器（1）具有微机械感测结构（10）和封装（46）。 封装（46）设置有承载第一电连接元件（47）的衬底（45），以及耦合到衬底以限定内部空腔（24）的盖（25），其中微机械感测 结构（10）被容纳。 盖（25）由以下部分形成：盖层（20），具有彼此相对设置的第一表面（20a）和第二表面（20b），所述第一表面（20a）限定包装的外表面 46）和所述第二表面（20b）面对所述衬底（45）; 以及设置在所述盖层（20）和所述基板（45）之间并且具有联接到所述基板（45）的联接面（21a）的壁结构（21）。 至少第一电气部件（10,11）在封装（46）的内部联接到盖层（20）的第二表面（20b），并且壁结构（21）的联接面（21a）承载 电连接到第一电气部件（10,11）和第一电连接元件（47）的第二电连接元件（30）。

    A METHOD OF MANUFACTURING ELECTRONIC DEVICES AND CORRESPONDING ELECTRONIC DEVICE
    3.
    发明公开
    A METHOD OF MANUFACTURING ELECTRONIC DEVICES AND CORRESPONDING ELECTRONIC DEVICE 审中-公开

    公开(公告)号：EP3718961A1

    公开(公告)日：2020-10-07

    申请号：EP20164126.3

    申请日：2020-03-19

    Applicant: STMicroelectronics (Malta) Ltd ,  STMicroelectronics S.r.l.

    Inventor： FORMOSA, Kevin ,  DEL SARTO, Marco

    IPC: B81C1/00

    Abstract: A method of manufacturing electronic devices (10), comprises providing on a support member (20) such as a tape:
    - a first electronic component (12), such as a sensor, having opposed first (12a) and second (12b) surfaces and arranged on the support member (20) with the second surface (12b) towards the support member (20), wherein the first electronic component (12) has a thickness between the opposed first (12a) and second (12b) surfaces,
    - a second electronic component (14), such as an IC, mounted on a substrate (16) and arranged on the support member (20) with a substrate surface opposed the second electronic component (14) and facing towards the support member (20), wherein the substrate (16) and the second electronic component (14) have a joint thickness which is less than the thickness of the first electronic component (12),
    - molding onto the support member (20) having arranged thereon the first (12) and second (14) electronic components package molding material (24) to encapsulate the second electronic component (14) and leaving exposed the first surface (12a) of the first electronic component (12), and
    - separating the support member (20) to expose the second surface (12b) of the first electronic component (12) and the substrate surface of the substrate (16) opposed the at least one second electronic component (14) .

    AN ELECTRONIC DEVICE AND CORRESPONDING MANUFACTURING METHOD
    7.
    发明公开
    AN ELECTRONIC DEVICE AND CORRESPONDING MANUFACTURING METHOD 审中-公开

    公开(公告)号：EP3718959A1

    公开(公告)日：2020-10-07

    申请号：EP20164136.2

    申请日：2020-03-19

    Applicant: STMicroelectronics (Malta) Ltd

    Inventor： FORMOSA, Kevin ,  SARIBAS, Eftal

    IPC: B81B7/00 ,  H01L23/24

    Abstract: An electronic device (10) comprises:
    - one or more electronic components (such as a MEMS 12a and an ASIC 12b) arranged on a substrate (14),
    - a cap member (16) applied onto the substrate (14) and covering the electronic component(s) arranged thereon, the cap member (16) having an opening (18) at the electronic component(s),
    - a filling of encapsulant material such as a gel (24) in the cap member (16), the encapsulant material (24) sealingly encapsulating the electronic component(s) arranged on the substrate (14).
    The cap member (16) comprises an outer wall (16a) having the opening (18) therein and inner wall (16b) surrounding the electronic component(s),
    - the inner wall (16b) extends from a proximal end at the substrate (14) towards a distal end facing the opening (18) in the outer wall (16a) to provide a reception chamber for the electronic component(s) within the inner wall (16b) and a peripheral chamber between the inner wall (16b) and the outer wall (16a) of the cap member (16), wherein the peripheral chamber of the cap member (16) surrounds the reception chamber for the electronic component(s), and
    - the filling of encapsulant material (24) is provided in the reception chamber for the electronic component (s) .

Patent Agency Ranking