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公开(公告)号：WO2018005003A1
公开(公告)日：2018-01-04
申请号：PCT/US2017/035782
申请日：2017-06-02
Applicant: INTEL CORPORATION
Inventor： DOGIAMIS, Georgios C. , BASKARAN, Rajashree
Abstract: A wearable electronic device includes a displaceable member communicably coupled to a haptic control circuit. The haptic control circuit is communicably coupled to a configurable haptic output device. A user input, received at the displaceable member generates an input signal that includes information and/or data indicative of at least one displacement parameter associated with the displacement of the displaceable member. The input signal is communicated to the haptic control circuit. The haptic control circuit determines a haptic output parameter that corresponds to the received displacement parameter.
Abstract translation: 可穿戴电子装置包括可通信地耦合到触觉控制电路的可移位构件。 触觉控制电路可通信地耦合到可配置的触觉输出设备。 在可位移构件处接收的用户输入产生包括指示与可位移构件的位移相关联的至少一个位移参数的信息和/或数据的输入信号。 输入信号被传送到触觉控制电路。 触觉控制电路确定对应于接收的位移参数的触觉输出参数。
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72.发明申请PIEZOELECTRIC PACKAGE-INTEGRATED CHEMICAL SPECIES-SENSITIVE RESONANT DEVICES 审中-公开压电包装 - 集成化学种敏感共振器件
公开(公告)号：WO2018004818A1
公开(公告)日：2018-01-04
申请号：PCT/US2017/030656
申请日：2017-05-02
Applicant: INTEL CORPORATION
Inventor： OSTER, Sasha N. , EID, Feras , DOGIAMIS, Georgios C. , SOUNART, Thomas L. , ELSHERBINI, Adel A. , SWAN, Johanna M. , LIFF, Shawna M.
IPC: H03H9/10
CPC classification number: G01N29/022 , B81B3/0021 , B81B2201/0214 , G01N29/036 , G01N29/2437 , G01N33/0047 , G01N33/227 , G01N33/54373 , G01N2291/0255 , G01N2291/0256 , G01N2291/0423
Abstract: Embodiments of the invention include a chemical species-sensitive device that includes an input transducer to receive input signals, a base structure that is coupled to the input transducer and positioned in proximity to a cavity of an organic substrate, a chemically sensitive functionalization material attached to the base structure, and an output transducer to generate output signals. For a chemical sensing functionality, a desired chemical species attaches to the chemically sensitive functionalization material which causes a change in mass of the base structure and this change in mass causes a change in a mechanical resonant frequency of the chemical species-sensitive device.
Abstract translation: 本发明的实施例包括化学物种敏感装置，其包括用于接收输入信号的输入变换器，耦合到输入变换器并定位在有机衬底的空腔附近的基础结构 ，附着在基础结构上的化学敏感的官能化材料，以及输出转换器以产生输出信号。 对于化学感测功能，期望的化学物质附着到化学上敏感的官能化材料上，其导致基础结构的质量变化，并且这种质量变化引起化学物种敏感装置的机械共振频率的变化。 p>
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公开(公告)号：WO2018004690A1
公开(公告)日：2018-01-04
申请号：PCT/US2016/040845
申请日：2016-07-01
Applicant: INTEL CORPORATION
Inventor： SOUNART, Thomas L. , EID, Feras , OSTER, Sasha N. , DOGIAMIS, Georgios C. , ELSHERBINI, Adel A. , LIFF, Shawna M. , SWAN, Johanna M.
IPC: G01L5/16 , G01L1/16 , H01L41/18 , H01L41/083 , H01L41/047
CPC classification number: H01L41/0973 , B81B3/0021 , B81B2201/0264 , G01L9/0042 , G01L9/008 , H01L41/1132
Abstract: Embodiments of the invention include a pressure sensing device having a membrane that is positioned in proximity to a cavity of an organic substrate, a piezoelectric material positioned in proximity to the membrane, and an electrode in contact with the piezoelectric material. The membrane deflects in response to a change in ambient pressure and this deflection causes a voltage to be generated in the piezoelectric material with this voltage being proportional to the change in ambient pressure.
Abstract translation: 本发明的实施例包括压力感测装置，该压力感测装置具有定位在有机衬底的空腔附近的膜，定位在该膜附近的压电材料以及与该电极接触的电极 压电材料。 该膜响应于环境压力的变化而偏转，并且该偏转导致在压电材料中产生电压，该电压与环境压力的变化成比例。
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74.发明申请PIEZOELECTRIC PACKAGE-INTEGRATED DELAY LINES FOR RADIO FREQUENCY IDENTIFICATION TAGS 审中-公开用于射频识别标签的压电包装集成延时线
公开(公告)号：WO2017172074A1
公开(公告)日：2017-10-05
申请号：PCT/US2017/017701
申请日：2017-02-13
Applicant: INTEL CORPORATION
Inventor： ELSHERBINI, Adel A. , KAMGAING, Telesphor , EID, Feras , NAIR, Vijay K. , DOGIAMIS, Georgios C. , SWAN, Johanna M. , RAO, Valluri R.
CPC classification number: G06K7/10297 , G06K7/10316 , G06K19/0672 , G06K19/0675 , H03H9/30
Abstract: Embodiments of the invention include delay line circuitry that is integrated with an organic substrate. Organic dielectric material and a plurality of conductive layers form the organic substrate. The delay line circuitry includes a piezoelectric transducer to receive a guided electromagnetic wave signal and to generate an acoustic wave signal to be transmitted with an acoustic transmission medium. An acoustic reflector is communicatively coupled to the acoustic transmission medium. The acoustic reflector receives a plurality of acoustic wave signals from the acoustic transmission medium and reflects acoustic wave signals to the piezoelectric transducer using the acoustic transmission medium. The transducer converts the reflected acoustic signals into electromagnetic waves which are then transmitted back through the antenna and decoded by the reader.
Abstract translation: 本发明的实施例包括与有机衬底集成的延迟线电路。 有机介电材料和多个导电层形成有机衬底。 延迟线电路包括压电换能器，以接收被导引的电磁波信号并且产生将与声音传输介质一起传输的声波信号。 声学反射器通信地耦合到声音传输介质。 声学反射器从声传输介质接收多个声波信号，并使用声传输介质将声波信号反射到压电传感器。 传感器将反射的声音信号转换成电磁波，然后通过天线传回并由读取器解码。
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75.发明申请TUNABLE RADIO FREQUENCY SYSTEMS USING PIEZOELECTRIC PACKAGE-INTEGRATED SWITCHING DEVICES 审中-公开使用压电包装集成开关设备的可调谐射频系统
公开(公告)号：WO2017172064A1
公开(公告)日：2017-10-05
申请号：PCT/US2017/017243
申请日：2017-02-09
Applicant: INTEL CORPORATION
Inventor： KAMGAING, Telesphor , EID, Feras , ELSHERBINI, Adel A. , DOGIAMIS, Georgios C. , NAIR, Vijay K. , SWAN, Johanna M. , RAO, Valluri R.
CPC classification number: H04B1/48 , H01H57/00 , H01H2057/006 , H03H7/38 , H03H2015/005
Abstract: Embodiments of the invention include a tunable radio frequency (RF) communication module that includes a transmitting component having at least one tunable component and a receiving component having at least one tunable component. The tunable RF communication module includes at least one piezoelectric switching device coupled to at least one of the transmitting and receiving components. The at least one piezoelectric switching device is formed within an organic substrate having organic material and is designed to tune at least one tunable component of the tunable RF communication module.
Abstract translation: 本发明的实施例包括可调谐射频（RF）通信模块，其包括具有至少一个可调谐组件的发送组件和具有至少一个可调谐组件的接收组件。 可调谐RF通信模块包括耦合到发射和接收组件中的至少一个的至少一个压电切换装置。 所述至少一个压电开关器件形成在具有有机材料的有机衬底内，并被设计成调谐可调谐RF通信模块的至少一个可调谐部件。
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Patent Agency Ranking
公开(公告)号：WO2017172062A1
公开(公告)日：2017-10-05
申请号：PCT/US2017/017239
申请日：2017-02-09
Applicant: INTEL CORPORATION
Inventor： ELSHERBINI, Adel A. , EID, Feras , BICEN, Baris , KAMGAING, Telesphor , NAIR, Vijay K. , SWAN, Johanna M. , DOGIAMIS, Georgios C. , RAO, Valluri R.
Abstract: Embodiments of the invention include a piezoelectric resonator which includes an input transducer having a first piezoelectric material, a vibrating structure coupled to the input transducer, and an output transducer coupled to the vibrating structure. In one example, the vibrating structure is positioned above a cavity of an organic substrate. The output transducer includes a second piezoelectric material. In operation the input transducer causes an input electrical signal to be converted into mechanical vibrations which propagate across the vibrating structure to the output transducer.
Abstract translation: 本发明的实施例包括压电谐振器，其包括具有第一压电材料的输入变换器，耦合到输入变换器的振动结构以及耦合到振动结构的输出变换器。 在一个示例中，振动结构位于有机基底的空腔上方。 输出变换器包括第二压电材料。 在操作中，输入传感器将输入电信号转换成机械振动，该振动通过振动结构传播到输出传感器。
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公开(公告)号：WO2017171868A1
公开(公告)日：2017-10-05
申请号：PCT/US2016/025702
申请日：2016-04-01
Applicant: INTEL CORPORATION
Inventor： DOGIAMIS, Georgios C. , EID, Feras
CPC classification number: G06F3/016
Abstract: A hybrid haptic actuator includes a package-integrated piezoelectric haptic actuator and a package-integrated electromagnetic haptic actuator disposed in, on, or about a void space formed in a first surface of a dielectric substrate. The hybrid haptic actuator includes an elastomeric member that covers the hybrid haptic actuator and a magnetic member embedded in the elastomeric member that is displaced by the magnetic fields produced by the electromagnetic haptic actuator. In operation, the magnetic member may be displaced from a neutral position to a first position by applying a voltage to the piezoelectric haptic actuator. The magnetic member may be oscillated at a frequency by applying an alternating current at the frequency to the electromagnetic haptic actuator. Such a hybrid haptic actuator beneficially consumes about half the power of a single haptic actuator having an equal displacement.
Abstract translation: 混合触觉致动器包括封装集成压电触觉致动器和集成封装集成电磁触觉致动器，所述致动器设置在形成于电介质衬底的第一表面中的空隙空间中，之上或周围。 混合触觉致动器包括覆盖混合触觉致动器的弹性体构件和嵌入弹性体构件中的磁性构件，所述磁性构件通过由电磁触觉致动器产生的磁场而移位。 在操作中，通过向压电触觉致动器施加电压，磁性构件可从中性位置移位到第一位置。 通过将频率为交流的电流施加到电磁触觉致动器，磁性构件可以以一定频率振荡。 这种混合式触觉致动器有利地消耗具有相等位移的单个触觉致动器的大约一半的功率。
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公开(公告)号：WO2017160296A1
公开(公告)日：2017-09-21
申请号：PCT/US2016/022877
申请日：2016-03-17
Applicant: INTEL CORPORATION
Inventor： EID, Feras , DOGIAMIS, Georgios C.
IPC: H02N2/04
CPC classification number: H01L41/332 , G06F1/163 , G06F3/016 , H01L41/094 , H01L41/0946 , H01L41/33
Abstract: A tactor includes a first electrode and a second electrode disposed proximate a piezoelectric layer. Upon selective application of a switchable voltage bias to the electrodes, the tactor may oscillate between a neutral state and one or more deflection states. The tactor may be formed on a dielectric substrate, such as a printed circuit substrate. The first electrode may include an electrically conductive trace disposed on a dielectric substrate. The piezoelectric layer is disposed on a surface of the first electrode. The second electrode may be deposited on at least a portion of the piezoelectric layer. A portion of the dielectric substrate proximate the first electrode may be removed to provide a void space proximate the first electrode.
Abstract translation: 一种接线盒包括设置在压电层附近的第一电极和第二电极。 在选择性地向电极施加可切换的电压偏压时，调节器可以在中性状态和一个或多个偏转状态之间振荡。 变压器可以形成在诸如印刷电路基板的电介质基板上。 第一电极可以包括设置在电介质基板上的导电迹线。 压电层设置在第一电极的表面上。 第二电极可以沉积在压电层的至少一部分上。 靠近第一电极的电介质衬底的一部分可被去除以提供靠近第一电极的空隙空间。
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公开(公告)号：WO2017052740A1
公开(公告)日：2017-03-30
申请号：PCT/US2016/043583
申请日：2016-07-22
Applicant: INTEL CORPORATION
Inventor： DOGIAMIS, Georgios C. , OSTER, Sasha N. , KAMGAING, Telesphor , ELSHERBINI, Adel A. , RAWLINGS, Brandon M. , EID, Feras
CPC classification number: H01L23/66 , H01L23/367 , H01L23/3675 , H01L23/49827 , H01L23/49838 , H01L23/5383 , H01L24/13 , H01L24/16 , H01L24/73 , H01L25/0655 , H01L2223/6627 , H01L2223/6677 , H01L2224/12105 , H01L2224/131 , H01L2224/16227 , H01L2224/73253 , H01L2924/1421 , H01L2924/1432 , H01L2924/1434 , H01L2924/15192 , H01L2924/15311 , H01L2924/15313 , H01L2924/15321 , H01L2924/16251 , H01L2924/163 , H01L2924/014 , H01L2924/00014
Abstract: Embodiments of the invention may include a packaged device that includes thermally stable radio frequency integrated circuits (RFICs). In one embodiment the packaged device may include an integrated circuit chip mounted to a package substrate. According to an embodiment, the package substrate may have conductive lines that communicatively couple the integrated circuit chip to one or more external components. One of the external components may be an RFIC module. The RFIC module may comprise an RFIC and an antenna. Additional embodiments may also include a packaged device that includes a plurality of cooling spots formed into the package substrate. In an embodiment the cooling spots may be formed proximate to interconnect lines the communicatively couple the integrated circuit chip to the RFIC.
Abstract translation: 本发明的实施例可以包括包括热稳定射频集成电路（RFIC）的封装装置。 在一个实施例中，封装的器件可以包括安装到封装衬底的集成电路芯片。 根据实施例，封装基板可以具有将集成电路芯片通信地耦合到一个或多个外部部件的导线。 外部组件中的一个可以是RFIC模块。 RFIC模块可以包括RFIC和天线。 另外的实施例还可以包括包括形成在封装衬底中的多个冷却点的封装器件。 在一个实施例中，冷却点可以靠近互连线形成，将集成电路芯片通信地耦合到RFIC。
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80.发明申请MICROELECTRONIC PACKAGE COMMUNICATION USING RADIO INTERFACES CONNECTED THROUGH WAVEGUIDES 审中-公开使用通过波形连接的无线接口的微电子封装通信
公开(公告)号：WO2017052656A1
公开(公告)日：2017-03-30
申请号：PCT/US2015/052485
申请日：2015-09-25
Applicant: INTEL CORPORATION
Inventor： OSTER, Sasha N. , KAMGAING, Telesphor , ELSHERBINI, Adel A. , DOGIAMIS, Georgios C. , RAWLINGS, Brandon M.
Abstract: Microelectronic package communications are described that use radio interfaces that are connected through waveguides. One example includes an integrated circuit chip, a package substrate to carry the integrated circuit chip, the package substrate having conductive connectors to connect the integrated circuit chip to external components, and a radio on the package substrate coupled to the radio chip to modulate the data over a carrier and to transmit the modulated data. A waveguide connector is coupled to a dielectric waveguide to receive the transmitted modulated data from the radio and to couple it into the waveguide, the waveguide carries the modulated data to an external component.
Abstract translation: 描述了使用通过波导连接的无线电接口的微电子封装通信。 一个示例包括集成电路芯片，用于承载集成电路芯片的封装衬底，具有用于将集成电路芯片连接到外部组件的导电连接器的封装衬底以及耦合到无线电芯片的封装衬底上的无线电装置以调制数据 并且传送调制数据。 波导连接器耦合到介质波导以从无线电接收传输的调制数据并将其耦合到波导中，波导将调制的数据传送到外部组件。
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