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公开(公告)号：JP2006206698A
公开(公告)日：2006-08-10
申请号：JP2005018998
申请日：2005-01-27
Inventor： SUENAGA KENICHI , FUJII SHIGEO
IPC: C09K3/14 , B24B37/00 , H01L21/304
Abstract: PROBLEM TO BE SOLVED: To provide a grinding liquid composition for being filled in a container made from a resin, without accompanying the discoloration of the container even on preserving for a long period and excellent in preservation stability. SOLUTION: This grinding liquid composition for being filled in the container made from a resin contains alumina, an antiseptic agent and an ammonium salt. The method for preserving the grinding liquid composition is provided by filling the grinding solution containing the alumina and antiseptic agent in the container made from the resin and preserving the composition in the presence of the ammonium salt at 1-60°C. The method for transporting the grinding liquid composition is provided by filling the grinding solution containing the alumina and antiseptic agent in the container made from the resin and transporting the composition in the presence of the ammonium salt at 1-60°C. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract translation: 要解决的问题：提供一种用于填充在由树脂制成的容器中的研磨液组合物，即使长期保存并且保存稳定性优异，也不伴随容器的变色。 解决方案：用于填充在由树脂制成的容器中的该研磨液组合物包含氧化铝，防腐剂和铵盐。 通过将含有氧化铝和防腐剂的研磨溶液填充在由树脂制成的容器中并在1-60℃的铵盐存在下保存该组合物来提供保存研磨液组合物的方法。 通过在由树脂制成的容器中填充含有氧化铝和防腐剂的研磨溶液，并在铵盐的存在下在1-60℃下输送组合物，提供了运送研磨液组合物的方法。 版权所有（C）2006，JPO＆NCIPI
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公开(公告)号：JP2006150534A
公开(公告)日：2006-06-15
申请号：JP2004347212
申请日：2004-11-30
Inventor： FUJII SHIGEO , SUENAGA KENICHI
IPC: B24B37/00 , B24B37/005 , B24B57/02 , C09K3/14
CPC classification number: B24B37/042
Abstract: PROBLEM TO BE SOLVED: To provide a polishing liquid composition which is less in residues of abrasive grains and polishing chips generated during the polishing on a polished substrate after completing the polishing, high in polishing speed, and capable of keeping smoothness of the substrate, and to provide a substrate manufacturing method using the polishing liquid composition. SOLUTION: The polishing liquid composition contains organic nitrogen compound having two or more amino groups and/or imino groups in a molecule, organic polybasic acid, polishing material, and water. The substrate manufacturing method has a step of feeding the polishing liquid element to a substrate at a rate of 0.01-0.5 mL/minute per 1 cm 2 of the substrate to be polished, and polishing the substrate by using a polishing pad. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract translation: 要解决的问题：提供一种抛光液组合物，其在抛光完成后在研磨基板上抛光时产生的磨粒残留物和研磨屑少，抛光速度高，能够保持平滑度 并且提供使用该抛光液组合物的基板制造方法。 解决方案：抛光液组合物含有分子中具有两个或多个氨基和/或亚氨基的有机氮化合物，有机多元酸，抛光材料和水。 基板制造方法具有以待研磨的基板的每1cm×SP 2的0.01-0.5mL /分钟的速度将研磨液体元素供给到基板的步骤，并且通过使用 抛光垫 版权所有（C）2006，JPO＆NCIPI
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公开(公告)号：JP2004167670A
公开(公告)日：2004-06-17
申请号：JP2003345068
申请日：2003-10-02
Inventor： HAGIWARA TOSHIYA , FUJII SHIGEO
Abstract: PROBLEM TO BE SOLVED: To provide a polishing liquid composition capable of reducing a surface defect such as a pit, a projection, etc. for substrate polishing of a memory hard disc, especially for finish polishing, a reduction method of the surface defect of the substrate using this polishing liquid composition and a manufacturing method of the substrate using this polishing liquid composition.
SOLUTION: This polishing liquid composition constituted by containing an abrasive, acid and/or its salt and water, its content of copper (Cu) in 1 kg of the polishing liquid composition is less than 1 mg, the substrate is polished by supplying the polishing liquid composition constituted by containing the abrasive, acid and/or its salt and water to the substrate or to a polishing pad, and the surface defect of the substrate is reduced.
COPYRIGHT: (C)2004,JPO-
公开(公告)号：JP2004067897A
公开(公告)日：2004-03-04
申请号：JP2002230020
申请日：2002-08-07
Inventor： KITAYAMA HIROAKI , FUJII SHIGEO , OOSHIMA YOSHIAKI , HAGIWARA TOSHIYA
Abstract: PROBLEM TO BE SOLVED: To provide a roll-off reducing agent which can give a sufficient polishing rate, and simultaneously can reduce the roll-off of a base caused by polishing, a polishing fluid composition containing the roll-off reducing agent, a method for manufacturing the base by using the polishing fluid composition, and a method of reducing the roll-off by using the above roll-off reducing agent or the above polishing fluid composition. SOLUTION: The roll-off reducing agent is composed of a Brϕnsted acid having a viscosity reduction action of an amount of viscosity reduction to be represented by the equation: Amount of viscosity reduction=Viscosity of a reference polishing fluid composition-Viscosity of a roll-off reducing agent-containing polishing fluid composition (wherein the reference polishing fluid composition comprises 20 pts.wt. high purity alumina having an Al 2 O 3 purity of ≥98.0 wt.%, 1 pt.wt. citric acid, and 79 pts.wt. water; the roll-off reducing agent-containing polishing fluid composition comprises 20 pts.wt. the above high purity alumina, 1 pt.wt. citric acid, 78.9 pts.wt. water, and 0.1 pt.wt. roll-off reducing agent; and the viscosity is a value at a shear rate of 1,500 S -1 at 25°C) of ≥0.01 mPa×s or its salt. COPYRIGHT: (C)2004,JPO
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公开(公告)号：JP2003147338A
公开(公告)日：2003-05-21
申请号：JP2001346468
申请日：2001-11-12
Applicant: KAO CORP
Inventor： KITAYAMA HIROAKI , FUJII SHIGEO
Abstract: PROBLEM TO BE SOLVED: To provide an anticlogging agent for a polishing pad, which serves to prevent the reduction in the rate of polishing and the occurrence of surface defects, such as a pit, on continuous polishing, and can reduce the frequency of dressing and improve the workability and productivity by preventing the clogging of a polishing pad on polishing, an anticlogging agent composition containing the anticlogging agent, used for a polishing pad, and a process for producing a base plate polished with the composition for a polishing pad. SOLUTION: The anticlogging agent for a polishing pad comprises a surface active agent having two or more hydrophilic groups in the molecule, with a molecular weight of 300 or higher. The anticlogging agent composition for a polishing pad contains water and the anticlogging agent. The composition is used for the process for producing a polished base plate.
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Patent Agency Ranking
公开(公告)号：JP2001089746A
公开(公告)日：2001-04-03
申请号：JP2000219605
申请日：2000-07-19
Applicant: KAO CORP
Inventor： FUJII SHIGEO , OOSHIMA YOSHIAKI , NAITO KOICHI
Abstract: PROBLEM TO BE SOLVED: To provide a polishing liquid composition improved in polishing rate and capable of reducing the surface roughness without causing surface defects on the surface of a material to be polished and to provide a method of polishing a substrate to be polished. SOLUTION: This polishing liquid composition comprises water, an abrasive material, an intermediate alumina and a chelating compound or its salt. The content of the intermediate alumina is 1-90 pts.wt. based on 100 pts.wt. of the abrasive material. The method of polishing the substrate to be polished comprises polishing a substrate to be polished under conditions so as to provide the composition of the polishing liquid at the time of polishing with the above composition of the polishing liquid. The specific surface area of the intermediate alumina is 30-300 m2/g and the average grain diameter thereof is 0.01-5 μm. The chelating compound is aminopolycarboxylic acids and/or a >=4C polyvalent carboxylic acid without any OH group.
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公开(公告)号：JP2000323444A
公开(公告)日：2000-11-24
申请号：JP12891999
申请日：1999-05-10
Applicant: KAO CORP
Inventor： HASHIMOTO RYOICHI , FUJII SHIGEO , YONEDA YASUHIRO
IPC: B24B37/00 , C09K13/04 , C09K13/06 , H01L21/304 , H01L21/306
Abstract: PROBLEM TO BE SOLVED: To provide a polishing solution composition which is capable of enhancing a metal film in polishing rate and effectively protecting a metal wiring layer against dishing or the like, where the surface of a work to polish is possessed of an insulating layer and the metal film. SOLUTION: A polishing solution composition (first polishing solution composition) is used to polish the surface of work possessed of an insulating layer and a metal layer, contains an unsaturated dicarboxylic acid copolymer and water, and is of pH 7 or below. A polishing solution composition (second polishing solution composition) contains an organic acid and/or an oxidizing agent besides the first polishing solution composition. Furthermore, a polishing solution composition (third polishing solution composition) contains abrasive material besides the first or second polishing solution composition.
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公开(公告)号：JP2000119639A
公开(公告)日：2000-04-25
申请号：JP28975198
申请日：1998-10-12
Applicant: KAO CORP
Inventor： TAIRA KOJI , FUJII SHIGEO , OOSHIMA YOSHIAKI
IPC: B24B37/00 , C09K3/14 , H01L21/304
Abstract: PROBLEM TO BE SOLVED: To provide a composition, which comprises a polyoxoacid derivative (salt) and water and which is able to highly planarize a surface of a body to be abraded at a high speed. SOLUTION: A polyoxoacid hetero compound is preferred as the polyoxoacid derivative, and from the standpoint of the improvement in abrasion speed or the reduction in surface roughness, aluminohexamolybdic acid, manganononamolybdic acid, selododecamolybdic acid, cobalthexamolybdic acid and manganohexatungstic acid are preferred. As the salt of the polyoxoacid derivative, it is preferred to use a sodium salt, a potassium salt and an ammonium salt. It is also preferred that the content of the polyoxoacid derivative (salt) ranges 0.05 to 20 wt.%, and the content of water ranges 50 to 99.95 wt.%. If necessary, an abrasive material may be added in an amount of 0.01 to 40 pts.wt. per 100 pts.wt. of the abrasive liquid composition. The abrasive material preferably includes α- or γ-alumina particles.
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公开(公告)号：JP2000109818A
公开(公告)日：2000-04-18
申请号：JP28111598
申请日：1998-10-02
Applicant: KAO CORP
Inventor： TAIRA KOJI , FUJII SHIGEO , OOSHIMA YOSHIAKI
Abstract: PROBLEM TO BE SOLVED: To reduce surface roughness and to improve an abrasive rate without generating a surface defect on a polished material by containing an alkylsulfonic acid or its salt having specific number of carbons, an abrasive and water. SOLUTION: An alkylsulfonic acid contained in a composition of an abrasion solution has a carbon number of a 1-4C and specifically methanesulfonic acid is preferable. The salt of this alkylsulfonic is preferably an Al salt, Ni salt or Fe slat. Total content of the alkylsulfonic acid and its salt in the composition is preferably 0.01-20 wt.%. The abrasive is knoop hardness of 1500-3000 and α-alumina or γ-alumina particles having purity not less than 98% are preferably used. A content of the abrasive in the composition is preferably 0.01-40 wt.%. A content of water in the composition is preferably 60-99.8 wt.%. This composition is suitably used for polishing a base for precision parts.
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公开(公告)号：JP2000053948A
公开(公告)日：2000-02-22
申请号：JP22410798
申请日：1998-08-07
Applicant: KAO CORP
Inventor： TAIRA KOJI , FUJII SHIGEO , OOSHIMA YOSHIAKI
Abstract: PROBLEM TO BE SOLVED: To obtain an abrasive solution composition capable of improving a polishing rate, reducing surface roughness and not causing defects such as scratch, or the like, on the surface of a material to be polished by mixing a chelate compound with an oxidizing metal ion and water. SOLUTION: This abrasive solution composition comprises (A) a chelate compound (preferably tartaric acid and malic acid), (B) an oxidizing metal ion (Fe3+ and/or Co3+) and (C) water. The contents of the components A and B (the content of the component B is the total of the component B and an oxidizing metal calculated from a compound which is contained in the composition and is capable of forming an oxidizing metal ion) are preferably 0.1-10 wt.%. The weight ratio of the component A/B is preferably 0.5-3. The content of the component C is preferably 90-99 wt.%. When an abrasive material is added to the composition, the obtained composition is suitably useful for polishing, especially polishing a hard disc substrate, or the like. In polishing a substrate for a magnetic recording medium hard disk, or the like, α-alumina particles and γ-alumina particles are preferable as the abrasive material.
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