POLYIMIDE RESIN COMPOSITION
    71.
    发明专利

    公开(公告)号:JPH01279967A

    公开(公告)日:1989-11-10

    申请号:JP10908388

    申请日:1988-05-06

    Abstract: PURPOSE:To improve the melt flow characteristics, etc., without impairing the excellent heat resistance, strength, etc., inherent in polyimide by incorporating a specified amount of an aromatic polyether-imide into a polyimide having specified repeating units. CONSTITUTION:The title composition is prepared by incorporating 0.1-50wt.% aromatic polyether-imide (e.g., of formula II or III) into 99.9-50wt.% thermoplastic polyimide having repeating units of formula I (wherein R is a tetravalent group selected from among a 2C or higher aliphatic group, an alicyclic group, a cyclic aromatic group, etc.). This resin composition is suitably used in the field of electrical and electronic equipment, etc. Said thermoplastic polyimide can be obtained by reacting an etherdiamine of formula IV with a tetracarboxylic acid dianhydride to give a polyamic acid and imidating this acid.

    POLYIMIDE RESIN COMPOSITION
    72.
    发明专利

    公开(公告)号:JPH01279965A

    公开(公告)日:1989-11-10

    申请号:JP10908188

    申请日:1988-05-06

    Abstract: PURPOSE:To improve the moldability without impairing the excellent heat resistance, mechanical strength, etc., inherent in polyimide by incorporating a specified amount of an aromatic polysulfone into a polyimide having specified repeating units. CONSTITUTION:The title composition is prepared by incorporating 0.1-50wt.% aromatic polysulfone (e.g., of formula II) into 99.9-50wt.% polyimide having repeating units of formula I (wherein R is a tetravalent group selected from among a 2C or higher aliphatic group, an alicyclic group, a monocyclic aromatic group, a condensed polycyclic aromatic group, and a noncondensed polycyclic aromatic group wherein the aromatic groups are bound to one another directly or through a crosslinking member). Said polyimide can be obtained by reacting an etherdiamine of formula III with a tetracarboxylic acid dianhydride to give a polyamic acid and imidating this acid.

    POLYIMIDE RESIN COMPOSITION
    73.
    发明专利

    公开(公告)号:JPH01242664A

    公开(公告)日:1989-09-27

    申请号:JP6966588

    申请日:1988-03-25

    Abstract: PURPOSE:To provide a polyimide resin composition excellent in heat resistance, chemical resistance, mechanical strengths, etc., and also in moldability, by mixing a specified polyimide with a specified amount of polyphenylene sulfide. CONSTITUTION:99.9-50wt.% polyimide (A) of formula I (wherein R is a tetravalent group selected from among a 2C or higher aliphatic group, a cycloaliphatic group, a monocyclic aromatic group, a fused polycyclic aromatic group, and a nonfused polycyclic aromatic group consisting of aromatic groups bonded together directly or through bridging members) is mixed with 0.1-50wt.% polyphenylene sulfide (B) of formula II to produce a polyimide resin composition. In this way, the moldability can be improved without detriment to the excellent properties inherent in component A. Component A can be obtained by reacting an ether diamine of formula III with a tetracarboxylic acid dianhydride and imidating the product.

    PRODUCTION OF POLYIMIDE OF GOOD HEAT STABILITY

    公开(公告)号:JPH01221430A

    公开(公告)日:1989-09-04

    申请号:JP4578188

    申请日:1988-03-01

    Abstract: PURPOSE:To obtain a polyimide which has good heat stability and does not suffer any decrease in moldability even when kept at a high temperature for a long time, by reacting a specified diamine with a specified tetracarboxylic acid dianhydride in the presence of a dicarboxylic acid anhydride and imidating the product. CONSTITUTION:A polyimide having repeating units of formula IV as a basic skeleton is produced by reacting a diamine with a tetracarboxylic acid dianhydride and thermally or chemically imidating the obtained polyamic acid, wherein (a) said diamine is one of formula I, (b) said tetracarboxylic acid dianhydride is one of formula II, (c) said reaction is performed in the presence of a dicarboxylic acid anhydride of formula III, and (d) the amount of said tetracarboxylic acid anhydride used is 0.9-1.0mol. per mol. of said diamine, and the amount of said dicarboxylic acid anhydride used is 0.001-1.0mol. per mol. of said diamine.

    PRODUCTION OF POLYIMIDE OF GOOD PROCESSABILITY

    公开(公告)号:JPH01131238A

    公开(公告)日:1989-05-24

    申请号:JP28755287

    申请日:1987-11-16

    Abstract: PURPOSE:To obtain the title polymer with stabilized flowability at low temperature, having excellent processability, mechanical properties and thermal characteristics, by effecting the reaction between a tetracarboxylic dianhydride and an ether diamine in the presence of a monoamine. CONSTITUTION:(A) 1.0mole of a tetracarboxylic dianhydride of formula I (R is aliphatic or aromatic) such as ethylenetetracarboxylic dianhydride is dissolved in an organic solvent such as N,N-dimethylformamide. Then, (B) 0.9-1.0 mole of an ether diamine of formula II (X is 1-10C hydrocarbon, carbonyl; Y1-Y4 are H, lower alkyl) such as bis [bis(3-aminophenoxy)-phenyl] methane and (C) 0.001-1.0 mole of a monoamine of formula III (Z is 1-10C aliphatic or alicyclic group) such as methylamine to give the subject polyimide having the recurring units of formula IV as a basal skeletal unit.

    POLYIMIDE RESIN COMPOSITION
    76.
    发明专利

    公开(公告)号:JPS63301257A

    公开(公告)日:1988-12-08

    申请号:JP13775787

    申请日:1987-06-02

    Abstract: PURPOSE:To obtain a polyimide resin composition excellent in melt flow, good in moldability and excellent in heat resistance, strength, etc., by mixing a polyimide having specified repeating units with a specified amount of an aromatic polysulfone. CONSTITUTION:The title resin composition is obtained by mixing 99.9-50wt.% polyimide (A) having repeating units of formula I (wherein X is carbonyl or sulfonyl, and R is a tetravalent group selected from among a 2C or higher aliphatic group, a cycloaliphatic group, a monocyclic group, a condensed polycyclic aromatic group and a noncondensed polycyclic aromatic group composed of aromatic groups bonded to each other directly or through bridging members) is mixed with 0.1-50wt.% aromatic polysulfone (B) (e.g., a compound of formula II). This resin composition can be used for electronic devices, etc. Component A can be obtained by reacting an ether-diamine of formula II with a tetracarboxylic acid dianhydride and imidating the formed polyamic acid.

    POLYIMIDE RESIN COMPOSITION
    77.
    发明专利

    公开(公告)号:JPS63301254A

    公开(公告)日:1988-12-08

    申请号:JP13483087

    申请日:1987-06-01

    Abstract: PURPOSE:To obtain a polyimide resin composition excellent in melt flow, good in moldability and excellent in heat resistance, mechanical strengths, etc., by mixing a polyimide having specified repeating units with a specified amount of an aromatic polysulfone. CONSTITUTION:99.9-50wt.% polyimide (A) having repeating units of formula I (wherein X is a direct bond, a 1-10C hydrocarbon group, a hexafluorinated isopropylidene or the like; Y1, Y2, Y3 and Y4 are each H, a lower alkyl, a lower alkoxy or the like; and R is a tetravalent group selected from among a 2C or higher aliphatic group, a cycloaliphatic group and a monocyclic aromatic group, etc.) is mixed with 0.1-50wt.% aromatic polysulfone (B) (e.g., a compound of formula II or III). The obtained resin composition can be suitably used for electronic devices, etc. Component A can be obtained by reacting an ether-diamine of formula IV with a tetracarboxylic acid dianhydride and imidating the formed polyamic acid.

    POLYIMIDE RESIN COMPOSITION
    78.
    发明专利

    公开(公告)号:JPS63301253A

    公开(公告)日:1988-12-08

    申请号:JP13482687

    申请日:1987-06-01

    Abstract: PURPOSE:To obtain a polyimide resin composition which is melt-moldable, excellent in heat resistance, dimensional stability, mechanical strengths, etc. and suitable for electronic devices, etc., by mixing a polyimide resin having specified repeating units with a specified amount of a reinforcing fiber. CONSTITUTION:The purpose polyimide resin composition is formed by mixing 100pts.wt. polyimide resin (A) having repeating units each represented by formula I (wherein R is a tetravalent group selected from among a 2C or higher aliphatic group, a cycloaliphatic group, a monocyclic aromatic group, a condensed polycyclic aromatic group and a noncondensed polycyclic aromatic group composed of aromatic groups bonded directly or through bridging members) with 5-100pts.wt. reinforcing fiber (B) (e.g. carbon fiber or glass fiber). Component A can be obtained by reacting an ether-diamine of formula II with a tetracarboxylic acid dianhydride and dehydrating the formed polyamic acid to effect ring closure.

    POLYIMIDE
    79.
    发明专利

    公开(公告)号:JPS63128025A

    公开(公告)日:1988-05-31

    申请号:JP27420686

    申请日:1986-11-19

    Abstract: PURPOSE:To obtain a polyimide, having excellent heat resistance and molding processability as well as high total light transmittance and suitable as electric and electronic equipment, aerospace materials, heat-resistant adhesives, etc., by reacting a specific tetracarboxylic acid dianhydride with an ether diamine. CONSTITUTION:A polyimide, obtained by dissolving (A) 4,4'-(p-phenylenedioxy) diphthalic acid dianhydride with (B) an ether diamine expressed by formula I (X is 1-10C chain hydrocarbon, carbonyl, etc.), e.g. bis[4-(3-aminophenoxy) phenyl]methane, etc., in an organic solvent, e.g. DMF, etc., and reacting both, e.g. at

    HEAT-RESISTANT ADHESIVE
    80.
    发明专利

    公开(公告)号:JPS6253388A

    公开(公告)日:1987-03-09

    申请号:JP19302085

    申请日:1985-09-03

    Abstract: PURPOSE:A novel heat-resistant adhesive having bond strength, keeping high bond strength especially even at high temperature, comprising a polyamic acid and/or polyimide having a specific repeating unit. CONSTITUTION:The aimed adhesive comprising a polyamic acid and/or polyimide having a repeating unit shown by the formula I[X is carbonyl or sulfonyl; Y is group shown by the formula II or formula II(R is >=2C aliphatic, cyclic alihpatic, monocyclic aromatic, condensed polycylic aromatic or noncondensed polycyclic aromatic wherein aromatic group is directly bonded or aromatic groups are bonded each other through crosslinked members)].

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