Abstract:
PURPOSE: To enlarge the energy band for the realization of a laser device capable of stabilized shortwave emission by a method wherein a lattice constant transition layer incorporating super lattice is provided on a GaAs substrate allowing the quantity to be reduced of Al to be added to an activation layer and clad layer. CONSTITUTION: On a GaAs substrate 11 of a first conductivity type, a lattice constant transition layer 12 composed of super lattice is formed, which is followed by the formation of a clad layer 13, similar to the substrate 1 in the type of conductivity, activation layer 14, and a second clad layer 15 are epitaxially formed. The activation layer 14, and the clad layers 13, 15 are constituted of (Al x Ga 1-x ) y In 1-y P, where the quantity (x) should be chosen to satisfy 0≤x1. The quantity (x) in the first and second clad layers 13, 15 should be larger than that in the activation layer 14. This allows the addition to be reduced of Al to an activation layer 3, increasing the energy band and realizing shortwave emission in the vicinity of 580nm. Furthermore, addition may be reduce of Al to the first and second clad layers 13, 15, which contributes to the enhancement of electrical and optical stability. COPYRIGHT: (C)1986,JPO&Japio
Abstract translation:目的:为了实现能够实现稳定的短波发射的激光装置的能带,通过在砷化镓衬底上提供掺入超晶格的晶格常数过渡层,使Al的量减少到 活化层和包层。 构成:在第一导电类型的GaAs衬底11上,形成由超晶格构成的晶格常数过渡层12,随后形成包覆层13,类似于导电类型的衬底1的激活 层14和第二覆层15外延形成。 激活层14和包覆层13,15由(Al x Ga 1-x)y In 1-y P构成,其中应选择量(x)以满足0 <= x1。 第一和第二包覆层13,15中的量(x)应当大于活化层14中的量(x)。这允许将Al减少到活化层3,增加能带并实现短波发射 580nm附近。 此外,添加可以减少Al到第一和第二覆盖层13,15,这有助于增强电和光学稳定性。
Abstract:
PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor light-emitting element which uses a nitride-based III-V compound semiconductor and which can achieve good crystallinity of an optical waveguide layer thereby to achieve a long service life.SOLUTION: In manufacturing of a semiconductor laser by sequentially growing an n-type AlGaN clad layer 5, an n-type GaN optical waveguide layer 6, an active layer 7, an undoped GaN optical waveguide layer 17, a p-type AlGaN cap layer 9, a p-type GaN optical waveguide layer 10, a p-type AlGaN/GaN superlattice clad layer 18 and a p-type GaN contact layer, the n-type GaN optical waveguide layer 6, the active layer 7, the undoped GaN optical waveguide layer 17, and the p-type AlGaN cap layer 9 are grown in an Natmosphere, and the p-type GaN optical waveguide layer 10, the p-type AlGaN/GaN superlattice clad layer 18 and the p-type GaN contact layer are grown in a mixed gas atmosphere of Nand H.
Abstract:
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor laser device accurately, surely and easily forming a second electrode and a ridge structure separated by a separating groove. SOLUTION: This method for manufacturing a bi-section GaN-based semiconductor laser device includes respective processes of: (A) forming a first compound semiconductor layer 30, a compound semiconductor layer 40 that constitutes a light-emitting region 41 and a saturable absorption region 42, and a second compound semiconductor layer 50; thereafter (B) forming a strip-shaped second electrode 62 on the second compound semiconductor layer 50; then (C) forming a ridge structure by etching at least a part of the second compound semiconductor layer 50 using the second electrode 62 as an etching mask; and thereafter (D) forming a separating groove 62C in the second electrode 62 by a wet etching method, and thereby separating the second electrode into a first portion 62A and a second portion 62B by the separating groove. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor laser which can perform sufficiently powerful self-pulsation operation without making the shape of a far-field image worse and stably obtain low-noise laser light, and is easy to manufacture. SOLUTION: The semiconductor laser having a ridge stripe 11 in a clad layer is provided with an insulating film 14 for current constriction on both side surfaces of the ridge stripe 11 and extendedly on bottom surfaces on both sides of the ridge stripe 11. The insulating film 14 for current constriction contains a high-refractive-index insulator, having a refractive index higher than an equivalent refractive index of a laser structure at the part of the ridge stripe 11, at a part other than parts nearby both resonator end surfaces. For example, a high-refractive-index insulating film 14a is formed on the bottom surfaces on both the sides of the ridge stripe 11. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor laser with an ultrashort pulse and an ultrahigh output by a simple construction and structure. SOLUTION: The semiconductor laser is driven by a pulse current with a value that is ten times or more as large as that of a threshold current or a pulse voltage that is twice or more as large as that of a threshold voltage, or the semiconductor laser emits a first light peak with a light intensity larger than three wats and with a half width of 20 picoseconds or less, and a second light peak, subsequent to the first light peak, that has an energy of 1 nano-joule or larger and a duration of 1 nanosecond or more. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To prevent deterioration of a nitride-based group III-V compound semiconductor layer, containing In and to improve the quality of the nitride-based group III-V compound semiconductor layer that does not contain In, when the nitride-based group III-V compound semiconductor layer that does not contain In is grown on the nitride-based group III-V compound semiconductor layer containing In, such as GaInN layer at a higher growth temperature than that of the latter layer. SOLUTION: A protective film composed of AlGaN is grown on the nitride-based group III-V compound semiconductor layer, containing In at a growth temperature almost equal to or lower than that of the semiconductor layer thereof, and the nitride-based III-V compound semiconductor layer that does not contain In is grown thereon. Here, N 2 is used as the carrier gas, when the nitride-based group III-V compound semiconductor layer containing In and the protecting film are grown, and a mixed gas of H 2 and N 2 is used for the carrier gas, when the nitride-based group III-V compound semiconductor layer that does not contain In is grown. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor laser unit arranged not to cause unnecessary external resonance by suppressing the occurrence of multiple reflection between window glass and the emission surface of a laser diode. SOLUTION: The semiconductor laser unit 1 comprises a collimate lens 2, a semiconductor laser 3, a lens supporting part 4, an LD supporting part 5, and a joint 6 wherein the semiconductor laser 3 comprises a laser diode 10, a stem 11, and an opening 12. A space surrounded by the collimate lens 2, the lens supporting part 4, the joint 6, the LD supporting part 5 and the semiconductor laser 10 is an enclosed space. An LD can 8 and the stem 11 are arranged to surround the laser diode 10, and the opening 12 is provided at a position where a laser beam emitted from the emission surface of the laser diode 10 passes. The laser beam 9 emitted from the emission surface of the laser diode 10 passes the enclosed space 7 directly to reach the collimate lens 2. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a method for growing a nitride based III-V compound semiconductor layer which can produce a nitride based III-V compound semiconductor substrate having good crystallinity and no surface roughness nor crack with high productivity. SOLUTION: A thin GaN layer 2 is grown rate of 4 μm/h or less on a c-face sapphire substrate 1 by MOCVD or MBE, and then a sufficiently thick GaN layer 3 is grown on the GaN layer 2 at a rate higher than 4 μm/h but not higher than 200 μm/h by hydride VPE. Subsequently, the c-face sapphire substrate 1 is removed by etching or lapping to obtain a GaN substrate comprising the GaN layers 2, 3. Finally, the surface of the GaN layer 2 or 3 being used as a growth surface is etched or polished to bring about a high quality surface state.
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device, such as the semiconductor light emitting device, etc., having excellent characteristics, high reliability, and a long service life. SOLUTION: In a semiconductor light emitting device using a II-VI group compound semiconductor, a p-type Znx Cd1-x Sey Te1-y (0