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公开(公告)号：JPH10279659A
公开(公告)日：1998-10-20
申请号：JP8299797
申请日：1997-04-01
Applicant: TORAY INDUSTRIES
Inventor： NIWA KATSUHIRO , TANAKA MASAYUKI , TOKUNAGA ATSUTO
Abstract: PROBLEM TO BE SOLVED: To obtain an epoxy resin compsn. excellent in reliabilitty, such as resistances to soldering crack and peeling, and moldability by compounding an epoxy resin component contg. an epoxy resin having a structure wherein at least two arom. rings exist between epoxy groups and a C-C double bond exists between the arom. rings, a phenolic curative, and an inorg. filler. SOLUTION: For instance, the epoxy resin component contains a compd. represented by formula I (wherein an II atom bonded to a double-bond carbon atom or an arom. ring may be substd. by an org. group), pref. in an amt. of 50 wt.% or higher. A compd. represented by formula II (wherein R is a divalent arom. group having no hydroxyl group; R is a hydroxylated divalent arom. group; R is a hydroxylated monovalent arom. group; and n is an integer of 0 or higher) is pref. as the curative, a phenol/p-xylylene copolymer being esp. pref. Usually, 2-15 wt.% epoxy resin component, 2-15 wt.% curative, and 60-95 wt.% inorg. filler are compounded.
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公开(公告)号：JPH10270610A
公开(公告)日：1998-10-09
申请号：JP703398
申请日：1998-01-16
Applicant: TORAY INDUSTRIES
Inventor： TSURUMI YUMIKO , TANAKA MASAYUKI
Abstract: PROBLEM TO BE SOLVED: To provide an epoxy resin composition excellent in adhesion and reliability and a small epoxy resin sealed semiconductor device. SOLUTION: The resin sealed semiconductor device comprises a semiconductor element 1, a wiring board 2a for mounting the semiconductor element 1, a frame 2b arranged on the wiring board 2a to surround the semiconductor element 1 while being spaced apart therefrom, and a cured epoxy resin composition 3 filling a part surrounded by the wiring board 2a and the frame 2b. The epoxy resin composition 3 contains epoxy resin A, a curing agent B, an inorganic filter C, and polyolefin D having a functional group including an oxygen atom or a nitrogen atom.
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公开(公告)号：JPH10265548A
公开(公告)日：1998-10-06
申请号：JP7609797
申请日：1997-03-27
Applicant: TORAY INDUSTRIES
Inventor： NIWA KATSUHIRO , TANAKA MASAYUKI , TOKUNAGA ATSUTO
Abstract: PROBLEM TO BE SOLVED: To obtain an epoxy resin composition causing no mold fouling and excellent in fluidity, curability, cracking resistance and storage stability. SOLUTION: This epoxy resin composition comprises (A) an epoxy resin, (B) a phenolic curing agent consisting of a compound of the formula: R -(-CH2 - R -CH2 -R -)n -CH2 -R -CH2 -R (R is a hydroxyl-free divalent aromatic group; R is a huydroxyl-bearing divalent aromatic group; R is a hydroxyl-bearing monovalent aromatic group; R to R may be the same with or differ from one another; (n) is an integer of 0 or >=1), (C) a curing promoter, a combination of a tetra-substituted phosphonium/tetra-substituted borate with an organophosphine, and (D) 86-95 wt.% of an inorganic filler.
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公开(公告)号：JPH10212342A
公开(公告)日：1998-08-11
申请号：JP1573297
申请日：1997-01-29
Applicant: TORAY INDUSTRIES
Inventor： TSURUMI YUMIKO , TANAKA MASAYUKI
Abstract: PROBLEM TO BE SOLVED: To obtain an epoxy resin compsn. which is excellent in adhesiveness and reliability and can accomplish the size reduction and capability improvement of a resin-sealed semiconductor device and to provide a semiconductor device sealed therewith. SOLUTION: A resin-sealed semiconductor device is provided which comprises a semiconductor element 1, a substrate board 2 on which the element is mounted, and an epoxy resin compsn. 3 for sealing the element and in which the resin compsn. is molded on one side only of the substrate board. The resin compsn. contains an epoxy resin, a curative, and an inorg. filler. The curative essentially contains a phenol compd. which has at least two arom. groups having directly bonded hydroxyl groups and has an alicyclic group present between the arom. groups.
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公开(公告)号：JPH10212338A
公开(公告)日：1998-08-11
申请号：JP1573397
申请日：1997-01-29
Applicant: TORAY INDUSTRIES
Inventor： TSURUMI YUMIKO , TANAKA MASAYUKI
Abstract: PROBLEM TO BE SOLVED: To obtain an epoxy resin compsn. which is excellent in adhesiveness and reliability and can accomplish the size reduction and capability improvement of a resin-sealed semiconductor device and to provide a semiconductor device sealed therewith. SOLUTION: A resin-sealed semiconductor device is provided which comprises a semiconductor element 1, a substrate board 2 on which the element is mounted, and an epoxy resin compsn. 3 for sealing the element and in which the resin compsn. is molded on one side only of the substrate board. The resin compsn. contains an epoxy resin, a curative, an inorg. filler, and a polyolefin having oxygen- or nitrogen-contg. functional groups.
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Patent Agency Ranking
公开(公告)号：JPH1017645A
公开(公告)日：1998-01-20
申请号：JP17462596
申请日：1996-07-04
Applicant: TORAY INDUSTRIES
Inventor： TSUTSUMI YASUAKI , TANAKA MASAYUKI
Abstract: PROBLEM TO BE SOLVED: To obtain an epoxy resin compsn. having improved storability and blocking resistance and excellent fluidity in the molding step by using a curing accelerator having a specified melting point. SOLUTION: This compsn. comprises (A) an epoxy resin, (B) a curing agent, and (C) one or more curing accelerators. At least one curing accelerator has an m.p of 85 to 295 deg.C. The epoxy resin (A) is preferably one having an ICI melt viscosity at 150 deg.C of not higher than 3ps. As the curing accelerator (C), a triphenylphosphine derivative is preferably used because the excellent fluidity of the epoxy resin compsn. is obtained therewith. Among triphenylphosphine derivatives, triphenylphosphine/1,4-benzoquinone adduct (m.p. 250 deg.C) excellent in fluidity, storability and blocking resistance is particularly preferred. A curing accelerator having a melting point in this range is contained in an amount of preferably at least 40wt.% (still preferably at least 60wt.%) based on all the curing accelerators.
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公开(公告)号：JPH09328532A
公开(公告)日：1997-12-22
申请号：JP15142896
申请日：1996-06-12
Applicant: TORAY INDUSTRIES
Inventor： SHIMIZU TAKESHI , TSURUMI YUMIKO , TANAKA MASAYUKI
Abstract: PROBLEM TO BE SOLVED: To obtain an epoxy resin compsn. for semiconductor sealing which is excellent in close filling of packages and resistance to soldering heat and has a low water absorption by compounding an epoxy resin with a specific curative and a specified amt. of an inorg. filler. SOLUTION: This compsn. contains an epoxy resin component contg. an epoxy resin represented by formula I (wherein R1 to R8 is H, 1-4C alkyl, or halogen) pref. in an amt. of 50wt.% or higher, pref. 70wt.% or higher, pref. in an amt. of the component of 0.05-14wt.% based on the compsn., a curative essentially contg. a polymer obtd. by reacting a fused polycyclic arom. compd. having at least three benzene rings (e.g. a compd. represented by formula II), a phenolic compd. (e.g. phenol), and an aldehyde (e.g. HCHO) pref. in an amt. of the curative of 0.5-15wt.% based on the compsn., and an inorg. filler (e.g. amorphous silica) in an amt. of 84-95wt.% based on the compsn.
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公开(公告)号：JPH09307027A
公开(公告)日：1997-11-28
申请号：JP11775996
申请日：1996-05-13
Applicant: TORAY INDUSTRIES
Inventor： SAWAMURA TAIJI , TANAKA MASAYUKI
Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor sealant having a high adhesion, high reliability of moisture resistance, etc., and high productivity by composing the sealant from a laminate of an org. insulation film and semiconductor sealing resin compsn. layer thereon. SOLUTION: The semiconductor sealant is a laminate of an org. insulation film and semiconductor sealing resin compsn. layer thereon. The resin compsn. layer is to protect a semiconductor element from the outside environment and mechanical shocks and contains an epoxy resin, hardener and inorg. filler as necessary components. The epoxy resin content of the compsn. is usually 3-25wt.%, the hardener content is usually 2-30wt.%, the hardener to epoxy resin chemical equivalent ratio is 0.5-1.6 to 1 in view of the mechanical nature and moisture resistance reliability. Such semiconductor sealant ensures a semiconductor device having a high reliability of the moisture resistance, etc., at a high productivity.
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79.发明专利
公开(公告)号：JPH08239451A
公开(公告)日：1996-09-17
申请号：JP34217295
申请日：1995-12-28
Applicant: TORAY INDUSTRIES
Inventor： TOKUNAGA ATSUTO , KAJI YOSHIO , TANAKA MASAYUKI
Abstract: PURPOSE: To obtain an epoxy resin composition for semiconductor sealing, excellent in reliability of humidity resistance, reliability at a high temperature, soldering-heat resistance and flame retardancy and exhibiting ideal performances when used in an electronic component. CONSTITUTION: An epoxy resin composition essentially consists of an epoxy resin (A), a curing agent (B) and an inorganic filler (C), wherein the curing agent (B) is one containing at least two phenolic hydroxyl groups and/or naphtholic hydroxyl groups in the molecule, the inorganic filler (C) accounts for at least 85wt.% of the total composition, and contains diantimony tetraoxide (D) as the essential component, and the oxygen index of the cured epoxy resin composition is at least 40.
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公开(公告)号：JP2501140B2
公开(公告)日：1996-05-29
申请号：JP3051591
申请日：1991-02-26
Applicant: TORAY INDUSTRIES
Inventor： SAWAMURA TAIJI , TESHIBA TOSHIHIRO , TANAKA MASAYUKI
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