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公开(公告)号：AU6368996A
公开(公告)日：1997-02-10
申请号：AU6368996
申请日：1996-07-10
Applicant: TORAY INDUSTRIES
Inventor： SHIMIZU KEN , SAWAMURA YASUSHI , TANAKA MASAYUKI
Abstract: An epoxy resin composition composed of an epoxy resin (A), a hardener (B), and an inorganic filler (C), characterized in that the content of the inorganic filler (C) is 70-97 wt% and the inorganic filler (C) contains 0.1-50 wt% of alumina. When used to seal semiconductor devices, it exhibits good moldability and imparts to the sealed semiconductors good flame retardance, solder heat resistance, and reliability at high temperatures.
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公开(公告)号：DE69222670D1
公开(公告)日：1997-11-20
申请号：DE69222670
申请日：1992-02-25
Applicant: TORAY INDUSTRIES
Inventor： SAWAMURA YASUSHI , TESHIBA TOSHIHIRO , TANAKA MASAYUKI
Abstract: A semiconductor-encapsulating composition comprised of (i) an epoxy resin preferably containing a bifunctional biphenyl-skeletal epoxy resin and/or a bifunctional naphthalene-skeletal epoxy resin, (ii) a curing agent containing 4,4 min -dihydroxybiphenyl, and (iii) 70 to 95% by weight, based on the total epoxy resin composition, of a filler.
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公开(公告)号：CA2061801A1
公开(公告)日：1992-08-27
申请号：CA2061801
申请日：1992-02-25
Applicant: TORAY INDUSTRIES
Inventor： SAWAMURA YASUSHI , TESHIBA TOSHIHIRO , TANAKA MASAYUKI
Abstract: SEMICONDUCTOR-ENCAPSULATING EPOXY RESIN COMPOSITION A semiconductor-encapsulating composition comprised of (i) an epoxy resin preferably containing a bifunctional biphenyl-skeletal epoxy resin and/or a bifunctional naphthalene-skeletal epoxy resin, (ii) a curing agent containing 4,4'-dihydroxybiphenyl, and (iii) 70 to 95 by weight, based on the total epoxy resin composition, of a filler.
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公开(公告)号：DE69222670T2
公开(公告)日：1998-03-12
申请号：DE69222670
申请日：1992-02-25
Applicant: TORAY INDUSTRIES
Inventor： SAWAMURA YASUSHI , TESHIBA TOSHIHIRO , TANAKA MASAYUKI
Abstract: A semiconductor-encapsulating composition comprised of (i) an epoxy resin preferably containing a bifunctional biphenyl-skeletal epoxy resin and/or a bifunctional naphthalene-skeletal epoxy resin, (ii) a curing agent containing 4,4 min -dihydroxybiphenyl, and (iii) 70 to 95% by weight, based on the total epoxy resin composition, of a filler.
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公开(公告)号：DE69023019D1
公开(公告)日：1995-11-23
申请号：DE69023019
申请日：1990-02-20
Applicant: TORAY INDUSTRIES
Inventor： KAYABA KEIJI , SAWAMURA YASUSHI , TANAKA MASAYUKI
IPC: H01L23/29
Abstract: A semiconductor-encapsulating epoxy resin composition comprises (A) an epoxy resin, (B) a curing agent, (C) a filler and (D) a silane coupling agent having a secondary amino group. This composition has an excellent moldability and reliability, and a good solder dipping stability.
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Patent Agency Ranking
公开(公告)号：AU4356196A
公开(公告)日：1996-07-24
申请号：AU4356196
申请日：1995-12-27
Applicant: TORAY INDUSTRIES
Inventor： TOKUNAGA ATSUTO , SAWAMURA YASUSHI , TANAKA MASAYUKI
Abstract: Disclosed herein is an epoxy resin compound including an epoxy resin (A), a hardener (B), and an inorganic filler, characterized in that said inorganic filler contains silica (C) as an essential component, said hardener (B) is one which contains at least two phenolic hydroxyl groups and/or naphtholic hydroxyl groups in the molecule, and said silica (C) contains 1-99 wt% of synthetic silica and 99-1 wt% of natural fused silica. Disclosed also herein is a semiconductor device having a semiconductor element sealed therein with said epoxy resin compound. The epoxy resin compound does not cause such troubles as short shot, resin peeling, wire breakage, stage shift, and vent clogging at the time of molding. In addition, when used as a sealing material, it yields semiconductor devices which have good reliability at high temperature and high humidity and good resistance to soldering heat.
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公开(公告)号：CA2039669A1
公开(公告)日：1991-10-05
申请号：CA2039669
申请日：1991-04-03
Applicant: TORAY INDUSTRIES
Inventor： HONDA SHIRO , SAWAMURA YASUSHI , TANAKA MASAYUKI , KAYABA KEIJI , TESHIBA TOSHIHIRO
Abstract: SEMICONDUCTOR DEVICE-ENCAPSULATING EPOXY RESIN COMPOSITION Disclosed is a semiconductor device-encapsulating epoxy resin composition comprising (i) an epoxy resin (A)containing at least one of a bifunctional epoxy resin (a1) having a biphenyl skeleton and a bifunctional epoxy resin (a2) having a naphthalene skeleton, (ii) a curing agent (B), and (iii) a filler containing fused silica (C) having a specified kind and specified mean particle diameter. This composition has an excellent heat resistance of solder, and further reliability after thermal cycles and reliability after solder-bath dipping.
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公开(公告)号：SG63803A1
公开(公告)日：1999-03-30
申请号：SG1998000135
申请日：1998-01-19
Applicant: TORAY INDUSTRIES
Inventor： TANAKA MASAYUKI , TSURUMI YUMIKO
Abstract: An epoxy resin composition for sealing a semiconductor device comprising a semiconductor element, a base to support the semiconductor element and an epoxy resin composition covering only one surface of the device opposite to the base, comprises (A) epoxy resin, (B) hardener and (C) inorganic filler, and gives a cured product which has (a) a flexural modulus of elasticity of 10 to 30 GPa at 23 DEG C and (b) a coefficient of linear expansion of 4 x 10 /K to 10 x 10 /K in a temperature range from 23 DEG C to the glass transition point, with the product of (a) and (b) being smaller than 2 x 10 GPa/K.
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公开(公告)号：DE69113666T2
公开(公告)日：1996-05-09
申请号：DE69113666
申请日：1991-04-04
Applicant: TORAY INDUSTRIES
Inventor： HONDA SHIRO , SAWAMURA YASUSHI , TANAKA MASAYUKI , KAYABA KEIJI , TESHIBA TOSHIHIRO
Abstract: An epoxy resin composition for encapsulating a semiconductor device comprises (i) an epoxy resin (A) comprising at least one of a bifunctional epoxy resin (a1) having a biphenol skeleton and a bifunctional epoxy resin (a2) having a naphthalene skeleton, (ii) a curing agent (B), and (iii) a filler comprising fused silica (C) consisting of 97 to 50 wt% of crushed fused silica (C1) of a mean particle diameter not more than 10 mu m and 3 to 50 wt% of spherical fused silica (C2) of a mean particle diameter not more than 4 mu m, wherein the mean particle diameter of the spherical fused silica is smaller than the mean particle diameter of the crushed fused silica, and the amount of the filler is 75 to 90 wt% of the total weight of the composition.
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公开(公告)号：DE69023019T2
公开(公告)日：1996-04-18
申请号：DE69023019
申请日：1990-02-20
Applicant: TORAY INDUSTRIES
Inventor： KAYABA KEIJI , SAWAMURA YASUSHI , TANAKA MASAYUKI
IPC: H01L23/29
Abstract: A semiconductor-encapsulating epoxy resin composition comprises (A) an epoxy resin, (B) a curing agent, (C) a filler and (D) a silane coupling agent having a secondary amino group. This composition has an excellent moldability and reliability, and a good solder dipping stability.
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