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公开(公告)号：JP2003243459A
公开(公告)日：2003-08-29
申请号：JP2002350827
申请日：2002-12-03
Applicant: TORAY INDUSTRIES
Inventor： NOURA TAKAHIRO , SAWAMURA TAIJI , KONISHI YUKITSUNA
IPC: C09J7/02 , C09J201/00 , H01L21/60
Abstract: PROBLEM TO BE SOLVED: To provide a tape with an adhesive easily to be manufactured and a method of efficiently manufacturing the same. SOLUTION: In a tape with an adhesive for semiconductor device comprising at least an adhesive layer laminated on a flexible organic insulation film, a plurality of adhesive layers are provided on the insulation film in an MD direction such that they do not contact with each other. COPYRIGHT: (C)2003,JPO
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公开(公告)号：JPH11233567A
公开(公告)日：1999-08-27
申请号：JP2982898
申请日：1998-02-12
Applicant: TORAY INDUSTRIES
Inventor： SAWAMURA TAIJI , YOKURA MITSUYOSHI , KABASHIMA AKIHIRO
Abstract: PROBLEM TO BE SOLVED: To obtain a good solder heat resistance and moisture resistance reliability by setting vapor permeability of an organic insulating film constituted of a lamination body with an adhesive layer at least at a specified vapor permeability or more. SOLUTION: Adhesive in which thermoplastic resin is contained is desirable for an adhesive layer, and it is effective for controlling softening temperature, and has functions such as adhesion, flexibility and thermal stress relaxation and improvement of insulation property by lower water absorptivity. An organic insulating film consists of plastic such as polyimide and polyester or a composite material such as epoxy resin impregnated glass cloth, and a plurality of films selected therefrom can be laminated and used. It is important that its vapor permeability is 0.04 g/m /24 h/mm or more, preferably, 0.50 g/m /24 h/mm or more, and further preferably, 1.00 g/m /24h/mm or more, and if it is less than 0.04 g/m /24 h/mm, mounting failure-prevention effect in a soldering process of a package is not demonstrated.
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公开(公告)号：JPH10178067A
公开(公告)日：1998-06-30
申请号：JP22170697
申请日：1997-08-18
Applicant: TORAY INDUSTRIES
Inventor： SAWAMURA TAIJI , ANDO YOSHIO , KIGOSHI SHOJI
IPC: C09J7/00 , C09J11/04 , C09J109/00 , C09J163/00 , C09J201/00 , H01L21/60 , H01L23/12 , H05K3/38
Abstract: PROBLEM TO BE SOLVED: To improve reflow resistance and thermal cycle property by using an epoxy resin, a thermoplastic resin, and a thermocuring type adhesive containing silica powder as an adhesive composition for forming an adhesive layer. SOLUTION: An adhesive layer 23 is constituted of an epoxy resin, a thermoplastic resin, a thermocuring resin, and a thermocuring type adhesive composition containing silica powder. Any epoxy resin with at least two epoxy groups in one molecule may be used. A copolymer with butadiene as an essential copolymer constituent is preferable as the thermoplastic resin. The silica powder has a large reduction effect of a thermal coefficient of expansion and a melted silica that is effective for reducing stress is preferable. In this case, the melted silica indicates an amorphous silica whose true specific gravity is 2.3 or less. An adhesive sheet for semiconductor device is obtained by melting the adhesive composition in a solvent, applying it onto a polyester film with a mold release property, and further laminating a protection sheet 24 with a weak release force onto a dry adhesive layer 23.
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公开(公告)号：JPH10178066A
公开(公告)日：1998-06-30
申请号：JP21744897
申请日：1997-08-12
Applicant: TORAY INDUSTRIES
Inventor： KIGOSHI SHOJI , ANDO YOSHIO , SAWAMURA TAIJI
IPC: C09J7/00 , C09J161/06 , C09J163/00 , C09J175/04 , C09J201/00 , H01L21/60 , H01L23/12 , H05K3/38
Abstract: PROBLEM TO BE SOLVED: To improve processabiltiy, adhesion force, insulation reliability, and durability by using a resin that contains urethane bond and/or urea bond and a thermosetting resin for a main chain as the essential constituent of an adhesive composition for forming an adhesive layer. SOLUTION: A substrate for connecting semiconductor integrated circuit has at least one layer of each of a wiring substrate layer 4 that consists of an insulator layer 3 and a conductor pattern, a layer 7 where no conductor patterns are formed, and an adhesive layer 6. The adhesive a layer 6 contains at least one type of each of a resin that contains urethane bond and/or urea bond and a thermosetting resin for a main chain. Examples of the resin that contains urethane bond and/or urea bond for the main chain are polyurethane, polyurea, a copolymer of polyurethane and polyurea. An epoxy resin and a phenol resin is suitable for the thermosetting resin due to the improved insulation property.
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公开(公告)号：JPH10178061A
公开(公告)日：1998-06-30
申请号：JP21651997
申请日：1997-08-11
Applicant: TORAY INDUSTRIES
Inventor： SAWAMURA TAIJI , ANDO YOSHIO , KIGOSHI SHOJI
IPC: C09J11/04 , C09J109/00 , C09J163/00 , C09J201/00 , H01L21/60 , H01L23/12 , H05K3/38
Abstract: PROBLEM TO BE SOLVED: To improve reflow resistance property and thermal cycle property by using an epoxy resin and a thermoplastic resin that contains a specific epoxy resin as an essential constituent and an adhesive composition which constitutes an adhesive layer. SOLUTION: An epoxy resin A that contains, as an essential constituent, an epoxy resin (a) indicated by an expression and a thermoplastic resin B are used as an adhesive composition which constituted an adhesive layer. R1-R4 in the expression indicate hydrogen atom, low-class alkyl group of C1-C4 or halogen atom. The epoxy resin (a) is contained in an epoxy resin A preferably by 60wt.% of higher and the epoxy resin A is contained in the adhesive composition preferably by 20-60wt.%. A thermoplastic resin B contained in the adhesive layer preferably has, for example, amino group, carboxyl group, epoxy group, hydroxyl group, methylol group, isocyanate group, vinyl group, and silanol group as a functional group that can react with the epoxy resin.
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Patent Agency Ranking
公开(公告)号：JPH10178060A
公开(公告)日：1998-06-30
申请号：JP21651897
申请日：1997-08-11
Applicant: TORAY INDUSTRIES
Inventor： SAWAMURA TAIJI , ANDO YOSHIO , KIGOSHI SHOJI
IPC: C09J11/04 , C09J109/00 , C09J163/00 , C09J201/00 , H01L21/60 , H01L23/12 , H05K3/38
Abstract: PROBLEM TO BE SOLVED: To improve reflow resistance property and thermal cycle property by using a thermosetting type that is made of epoxy resin and thermoplastic resin as an adhesive composition used for a board for connecting a semiconductor integrated circuit. SOLUTION: A board for connecting semiconductor integrated circuit includes at least one layer of each of a wiring substrate layer that consists of an insulator layer and a conductor pattern, a layer where no conductor pattern is formed, and an adhesive layer. Phenolnovolac-type epoxy resin or epoxy resin that is expressed by an equation is preferable as epoxy resin contained in the adhesive layer and R1-R10 in the expression indicates hydrogen atom, low-class alkyl group of C1-F4, or halogen atom. The epoxy resin is preferably blended by 20-60wt.% in the adhesive composition. A thermoplastic resin preferably has, for example, amino group, carboxyl group, epoxy group, hydroxyl group, and methylol group as a functional group that can react with the epoxy resin.
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公开(公告)号：JPH10178055A
公开(公告)日：1998-06-30
申请号：JP21511297
申请日：1997-08-08
Applicant: TORAY INDUSTRIES
Inventor： KIGOSHI SHOJI , ANDO YOSHIO , SAWAMURA TAIJI
IPC: C09J7/00 , C09J179/08 , C09J201/02 , H01L21/60 , H01L23/12 , H05K3/38
Abstract: PROBLEM TO BE SOLVED: To improve the thermal stress relaxation effect for an adhesion force and the balance of reflow resistance property by combining a resin with amide group and/or imide group with a thermosetting resin. SOLUTION: A board for connecting semiconductor integrated circuit is obtained by forming elements on a semiconductor substrate and then connecting a cut semiconductor integrated circuit 1 and includes at least one layer of each of an insulator layer 3 and a wiring board layer 4 that is made of a conductor pattern, a layer 7 where no conductor pattern is formed, and an adhesive layer 6. An adhesive composition for forming the adhesive layer 6 is required to contain at least one type of each of a resin with amide group and/or imide group and a thermosetting resin. Polyamide, polyamidoimide, polymide, polyetheramide, and polyetherimide are preferable as resins with amide group and/or imide group due to an adhesion property, flexibility, and the relaxation effect of thermal stress.
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8.发明专利
公开(公告)号：JPH09321169A
公开(公告)日：1997-12-12
申请号：JP12964596
申请日：1996-05-24
Applicant: TORAY INDUSTRIES
Inventor： AKAMATSU TAKAYOSHI , ENOMOTO YUTAKA , SAWAMURA TAIJI
Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor package which enables high-density mounting. SOLUTION: In this semiconductor package using an interposer having a plastic film 12 as a base and in a circuit board for this semiconductor package, a thick adhesive layer 18 is provided between the plastic base and a copper foil so as to have the function to relax a stress generated between a semiconductor chip 19 and the printed circuit board by the difference in coefficient of linear expansion of materials.
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公开(公告)号：JPH09298220A
公开(公告)日：1997-11-18
申请号：JP11362296
申请日：1996-05-08
Applicant: TORAY INDUSTRIES
Inventor： SAWAMURA TAIJI , HATANO HIROSHI , KIGOSHI SHOJI
IPC: C09J7/02 , C08G59/20 , C08G59/24 , C09J161/04 , C09J161/06 , C09J163/00 , C09J177/00 , H01L21/60
Abstract: PROBLEM TO BE SOLVED: To provide an adhesive tape for TAB(tape automated bonding) having high adhesion after a resist process and a plating process and excellent moisture resistance and insulation and improve the reliability of a semiconductor device using the tape. SOLUTION: An adhesive tape for TAB is composed of a laminated body having an adhesive layer and a protection film layer on a flexible organic insulating film. The adhesive layer contains thermoplastic resin (A), epoxy resin (B) and silica powder (C) as essential components, and the average grain diameter of the silica powder (C) is 10μm or less, the maximum particle diameter, 20μm or less, and the silica powder (C) is contained by 5-70wt.% to the whole composition.
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公开(公告)号：JPH0977850A
公开(公告)日：1997-03-25
申请号：JP18330596
申请日：1996-07-12
Applicant: TORAY INDUSTRIES
Inventor： TSURUMI YUMIKO , SAWAMURA TAIJI , TANAKA MASAYUKI
Abstract: PROBLEM TO BE SOLVED: To obtain an epoxy resin composition which is excellent in fluidity, adhesion and moldability and useful in semiconductor sealing by using an epoxy resin and a phenol having a specific structure as essential components and adding a filler in a specific proportion. SOLUTION: This epoxy resin composition comprises (A) an epoxy resin, (B) a curing agent, preferably containing, as an essential component, a phenol having a structure of formulas I-III, bearing 2 or more aromatic groups directly bonding to hydroxyl groups and an alicyclic group between them, and (C) a filler, where the proportion of the component C is 80-95wt.% of the total composition. The component A contains a biphenyl type epoxy resin as an essential component, in an amount of >=50wt.%, while the phenol as the essential component in the component B is >=50wt.% based on the total component B. The component C preferably contains >=50wt.% of a composition comprising 99-50% of spherical amorphous silica with an average particle size of 5μm-30μm and 1-50% of spherical amorphous silica with an average particle size of
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