Nanomachined mechanical components using nanoplates, methods of fabricating the same and methods of manufacturing nanomachines
    72.
    发明申请
    Nanomachined mechanical components using nanoplates, methods of fabricating the same and methods of manufacturing nanomachines 失效
    使用纳米板的纳米机械部件,其制造方法和制造纳米机械的方法

    公开(公告)号:US20080006888A1

    公开(公告)日:2008-01-10

    申请号:US11263476

    申请日:2005-10-31

    Abstract: Disclosed herein is a method of fabricating nano-components using nanoplates, including the steps of: printing a grid on a substrate using photolithography and Electron Beam Lithography; spraying an aqueous solution dispersed with nanoplates onto the grid portion to position the nanoplates on the substrate; depositing a protective film of a predetermined thickness on the substrate and the nanoplates positioned on the substrate; ion-etching the nanoplates deposited with the protective film by using a Focused Ion Beam (FIB) or Electron Beam Lithography; and eliminating the protective film remaining on the substrate using a protective film remover after the ion-etching of the nanoplates, and a method of manufacturing nanomachines or nanostructures by transporting such nano-components using a nano probe and assembling with other nano-components. The present invention makes it possible to fabricate the high-quality nano-components in a more simple and easier manner at a lower cost, as compared to other conventional methods. Further, the present invention provides a method of implementing nanomachines through combination of such nano-components and biomolecules, etc.

    Abstract translation: 本文公开了使用纳米板制造纳米组分的方法,包括以下步骤:使用光刻和电子束光刻在衬底上印刷栅格; 将分散有纳米板的水溶液喷射到栅格部分上以将纳米板定位在基底上; 在衬底和位于衬底上的纳米板上沉积预定厚度的保护膜; 通过使用聚焦离子束(FIB)或电子束光刻法离子蚀刻沉积有保护膜的纳米板; 并且在纳米板的离子蚀刻之后使用保护膜去除剂去除残留在基板上的保护膜,以及通过使用纳米探针传输这种纳米成分并与其他纳米成分组装来制造纳米机械或纳米结构的方法。 与其它常规方法相比,本发明可以以更简单和更容易的方式以更低的成本制造高质量的纳米组分。 此外,本发明提供了通过这些纳米组分和生物分子等的组合来实现纳米机器的方法。

    Gear and method of making the same
    73.
    发明授权
    Gear and method of making the same 失效
    齿轮和制作方法

    公开(公告)号:US06948245B2

    公开(公告)日:2005-09-27

    申请号:US10149055

    申请日:2000-12-04

    Applicant: Takashi Nishi

    Inventor: Takashi Nishi

    Abstract: In order that a worm 1 is rotated, a clearance (a region constituting a clearance portion between bearings and a worm gear) is formed (FIGS. 4(1) to (3)) in an upper surface of a base plate 3. A mold 12 for forming a lower half region of the worm therein is formed (FIG. 4(8)). A material 5 for the worm is deposited (FIG. 4(9)) to a height equal to that of a lower half region plus that of an upper half of the worm. An upper half of the worm is formed (FIGS. 4(10) to (12). Finally, the material 13 in the clearance between the base plate 3 and gear 1 is removed (FIG. 4(13)).

    Abstract translation: 为了使蜗杆1旋转,在基板3的上表面形成有间隙(构成轴承和蜗轮之间的间隙部的区域)(图4(1)〜(3))。 形成用于形成蜗杆下半部分的模具12(图4(8))。 将蠕虫的材料5(图4(9))沉积到等于下半部分加上蠕虫上半部的高度的高度。 形成蜗杆的上半部(图4(10)〜(12)),最后移除基板3与齿轮1之间的间隙中的材料13(图4(13))。

    Apparatus for manufacturing micro-structure
    74.
    发明授权
    Apparatus for manufacturing micro-structure 失效
    微结构制造装置

    公开(公告)号:US06557607B2

    公开(公告)日:2003-05-06

    申请号:US09791571

    申请日:2001-02-26

    Abstract: A substrate on which a plurality of thin films having a plurality of cross-sections corresponding to the cross-section of a micro-structure are formed is placed on a substrate holder. The substrate holder is elevated to bond a thin film formed on the substrate to the surface of a stage, and by lowering the substrate holder, the thin film is separated from the substrate and transferred to the stage side. The transfer process is repeated to laminate a plurality of thin films on the stage and to form the micro-structure. Accordingly, there are provided a micro-structure having high dimensional precision, especially high resolution in the lamination direction, which can be manufactured from a metal or an insulator such as ceramics and can be manufactured in the combined form of structural elements together, and a manufacturing method and an apparatus thereof.

    Abstract translation: 其上形成有多个与微结构的横截面相对应的多个横截面的薄膜的基板被放置在基板支架上。 衬底保持器被升高以将形成在衬底上的薄膜粘合到台的表面上,并且通过降低衬底保持器,将薄膜与衬底分离并转移到平台侧。 重复转印过程以在台上层压多个薄膜并形成微结构。 因此,提供了可以由诸如陶瓷的金属或绝缘体制造的具有高尺寸精度,特别是层压方向上的高分辨率的微结构,并且可以以结构元件的组合形式一起制造,并且 制造方法及其装置。

    Tungsten coating for improved wear resistance and reliability of microelectromechanical devices
    75.
    发明授权
    Tungsten coating for improved wear resistance and reliability of microelectromechanical devices 有权
    钨涂层,用于改善微机电装置的耐磨性和可靠性

    公开(公告)号:US06290859B1

    公开(公告)日:2001-09-18

    申请号:US09439103

    申请日:1999-11-12

    Abstract: A process is disclosed whereby a 5-50-nanometer-thick conformal tungsten coating can be formed over exposed semiconductor surfaces (e.g. silicon, germanium or silicon carbide) within a microelectromechanical (MEM) device for improved wear resistance and reliability. The tungsten coating is formed after cleaning the semiconductor surfaces to remove any organic material and oxide film from the surface. A final in situ cleaning step is performed by heating a substrate containing the MEM device to a temperature in the range of 200-600 ° C. in the presence of gaseous nitrogen trifluoride (NF3). The tungsten coating can then be formed by a chemical reaction between the semiconductor surfaces and tungsten hexafluoride (WF6) at an elevated temperature, preferably about 450° C. The tungsten deposition process is self-limiting and covers all exposed semiconductor surfaces including surfaces in close contact. The present invention can be applied to many different types of MEM devices including microrelays, micromirrors and microengines. Additionally, the tungsten wear-resistant coating of the present invention can be used to enhance the hardness, wear resistance, electrical conductivity, optical reflectivity and chemical inertness of one or more semiconductor surfaces within a MEM device.

    Abstract translation: 公开了一种方法,其中可以在微机电(MEM)装置内的暴露的半导体表面(例如硅,锗或碳化硅)上形成5-50纳米厚的共形钨涂层,以改善耐磨性和可靠性。 在清洁半导体表面之后形成钨涂层,以从表面除去任何有机材料和氧化物膜。 通过在含有气态三氟化氮(NF 3)的存在下,将含有MEM装置的基板加热至200-600℃的温度,进行最终的原位清洗步骤。 钨涂层然后可以通过半导体表面和六氟化钨(WF6)之间的化学反应在升高的温度,优选约450℃下形成。钨沉积工艺是自限制的,并且覆盖所有暴露的半导体表面,包括紧密的表面 联系。 本发明可以应用于许多不同类型的MEM装置,包括微型雷达,微镜和微型引擎。 此外,本发明的钨耐磨涂层可用于提高MEM装置内的一个或多个半导体表面的硬度,耐磨性,导电性,光反射率和化学惰性。

    ENSEMBLE FONCTIONNEL DE MICROMECANIQUE
    78.
    发明申请
    ENSEMBLE FONCTIONNEL DE MICROMECANIQUE 审中-公开
    微电子功能组件

    公开(公告)号:WO2013011032A1

    公开(公告)日:2013-01-24

    申请号:PCT/EP2012/064017

    申请日:2012-07-17

    Abstract: L'invention concerne un ensemble fonctionnel (100) de micromécanique comprenant au moins une première pièce (10), ayant une première couche définissant une première surface de contact destinée à venir en contact de frottement avec une deuxième surface de contact définie par une deuxième couche ladite deuxième couche appartenant, soit à ladite première pièce (10) soit à au moins une deuxième pièce de micromécanique (20) constituant avec ladite première pièce (10) ledit ensemble (100) caractérisé en ce que les première et deuxième couches comportent chacune du carbone à hauteur d'au moins 50% d'atomes de carbone et en ce qu'elles présentent au niveau des première et deuxième surfaces de contact des orientations de plans cristallins en surface différentes l'une de l'autre.

    Abstract translation: 本发明涉及包括至少第一部分(10)的微机械功能组件(100),其具有限定与第二层限定的第二接触表面摩擦接触的第一接触表面的第一层,所述第二层属于 与所述第一部分(10)或至少第二微机械部件(20)组合,所述第二微机械部件(20)与所述第一部分(10),所述组件(100)构成,其特征在于,所述第一和第二层各自包含一定量的碳 至少50%的碳原子,并且其第一和第二接触表面的表面晶面的取向彼此不同。

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