Abstract:
하이브리드 MOS 광 변조기. 광 변조기는 광 도파관과, 제 1 물질을 포함하고, 광 도파관 내에 형성된 캐소드와, 제 1 물질과 다른 제 2 물질을 포함하고, 광 도파관 내에 형성된 애노드를 포함하며, 이 애노드는 캐소드에 인접하여 있고, 애노드와 캐소드 사이에 커패시터가 형성된다.
Abstract:
An optical integrated circuit includes a substrate including a single crystalline semiconductor material, a passive device including a single crystalline semiconductor material and extended onto the substrate in the crystal direction of the substrate, and an active device including a single crystalline semiconductor material and extended onto the substrate in the crystal direction of the substrate. [Reference numerals] (AA,HH) First direction; (BB,GG) Second direction; (CC,FF) Third direction; (DD,EE) Fourth direction
Abstract:
PURPOSE: An electro-optic device and mach-zehnder optical modulator used the same are provided to improve the operation speed of an optical device by first to third impurity region of an NPN structure or a PNP structure. CONSTITUTION: A rib wave guide(10) comprises a mesa(14) and the slab(12) in the lower part of the mea. The rib wave guide is extended to the cross direction of first to third impurity regions(40,50,60). A first impurity region is formed in the slab in one side of the mesa. A third impurity region is formed in the slab in the other side of the mesa facing to the first impurity region. A lower clad(18) including a silicon oxide film is formed over the substrate(16).
Abstract:
본 발명은 초고속 광변조기 모듈 제작시 성능향상 및 비용절감을 위해서 임피던스 정합을 위한 저항 성분을 소자 내에 집적한 반도체 광변조기 소자의 구조 및 그 제작 방법에 관한 것이다. 본 발명에서는 광변조기 소자의 에피층 내의 도핑층을 임피던스 정합을 위한 저항 성분으로 이용하는 방법을 제안한다. 이 방법을 이용하면 임피던스 정합을 위해 소자 내외부에서 별도의 저항 성분을 사용하는 기존의 광 소자 제작 공정보다 용이하게 광 소자를 구현할 수 있는 장점이 있다. 광 소자, 반도체 광 변조기, 임피던스 정합, 저항 성분, 도핑층, 코플래너 전극
Abstract:
The present invention provides an optical modulator including a substrate and a phase modulation portion on the substrate. The phase modulation portion includes an optical waveguide comprised of a first clad layer, a semiconductor layer that is laminated on the first clad layer and has a refraction index higher than the first clad layer and a second clad layer that is laminated on the semiconductor layer and has a refraction index lower than the semiconductor layer, a first traveling wave electrode, and a second traveling wave electrode. The semiconductor layer includes a rib that is formed in the optical waveguide in an optical axis direction and is a core of the optical waveguide, a first slab that is formed in the optical axis direction in one side of the rib, a second slab that is formed in the optical axis direction in the other side of the rib, a third slab that is formed in the first slab in the optical axis direction at the opposite side to the rib, and a fourth slab that is formed in the second slab in the optical axis direction at the opposite side to the rib. The first slab is formed to be thinner than the rib and the third slab, and the second slab is formed to be thinner than the rib and the fourth slab.
Abstract:
An electro-absorption modulator (100) is provided, including: a substrate layer (110), including a silicon substrate (112) and an oxide layer (114) disposed on the silicon substrate; top-layer silicon (120), formed on the oxide layer (114), where a waveguide layer (122) is formed on the top-layer silicon (120); a doping layer, including a first doping panel (132) and a second doping panel (133), where a first-type light doping area (134) is formed on the first doping panel (132), a second-type light doping area (135) is formed on the second doping panel (133), and the first-type light doping area (134), the waveguide layer (122), and the second-type light doping area (135) form a PIN junction; and a modulation layer (140), disposed on the waveguide layer (122) and connected in parallel to the PIN junction. For an incident beam with a specific wavelength, when a modulating electrical signal is reversely applied to the PIN junction, a light absorption coefficient of the modulation layer (140) for the beam changes with the modulating electrical signal, and after the beam passes through a modulation area, optical power of the beam also correspondingly changes, so that electro-optic modulation is implemented for the beam.
Abstract:
A wavelength selective switch and a wavelength selection method are provided, where the wavelength selective switch includes: a dual-microring resonator, including a first microring (111) and a second microring (112) that are connected in series, where the first microring (111) and the second microring (112) are silicon-based microrings and respectively include one annular PN junction, and a direction of the annular PN junction of the first microring is the same as that of the annular PN junction of the second microring; an electric tuning module (120), where a first electric port of the electric tuning module (120) is connected to a P zone of the first microring (111) and an N zone of the second microring (112), a second electric port of the electric tuning module (120) is connected to an N zone of the first microring (111) and a P zone of the second microring (112), and the electric tuning module (120) is configured to apply bias voltages with reverse directions to the annular PN junction of the first microring 111 and the annular PN junction of the second microring (112); and a thermal tuning module (130), configured to adjust an operating temperature of the dual-microring resonator. The switch is suitable for a high-density integrated optical interconnection.