公开(公告)号：EP3113510B1

公开(公告)日：2020-04-22

申请号：EP16175630.9

申请日：2016-06-22

Applicant: STMICROELECTRONICS S.r.l. ,  STMICROELECTRONICS (MALTA) LTD

Inventor： BRIOSCHI, Roberto

IPC: H04R19/00

公开(公告)号：EP3065416A1

公开(公告)日：2016-09-07

申请号：EP15200515.3

申请日：2015-12-16

Applicant: STMicroelectronics S.r.l. ,  Stmicroelectronics (Malta) Ltd

Inventor： BRIOSCHI, Roberto ,  ADORNO, Silvia ,  FONK, Kenneth

IPC: H04R1/08 ,  H04R31/00 ,  H04R19/04 ,  H04R19/00

CPC classification number: H04R1/086 ,  B81B7/0058 ,  B81B7/0061 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2207/012 ,  B81B2207/07 ,  B81C1/00309 ,  B81C2203/0785 ,  H01L2224/48137 ,  H01L2224/48227 ,  H04R19/005 ,  H04R19/04 ,  H04R31/00 ,  H04R31/006

Abstract: A semiconductor integrated device (51, 81; 91), comprising: a package (50) defining an internal space (8) and having an acoustic-access opening (28; 98b) in acoustic communication with an environment external to the package (50); a MEMS acoustic transducer (21), housed in the internal space (8) and provided with an acoustic chamber (6) facing the acoustic-access opening (28; 98b); and a filtering module (52; 82; 96), which is designed to inhibit passage of contaminating particles having dimensions larger than a filtering dimension (d 1 ; d MAX ) and is set between the MEMS acoustic transducer (21) and the acoustic-access opening (28; 98b). The filtering module defines at least one direct acoustic path between the acoustic-access opening (28; 98b) and the acoustic chamber (6).

Abstract translation: 一种半导体集成电路器件（51，81; 91），包括：内部空间（8）的包装（50）定义和具有声进入开口（28; 98B），其与在环境所述封装外部的声通信（50 ）; 在内部空间（8）容纳并在声室设置有MEMS声学换能器（21）（6）的面向所述声 - 进入开口（28; 98B）; 和过滤模块（52; 82; 96），其被设计为抑制污染尺寸大于过滤尺寸大的颗粒通过（D 1; D MAX），并且被设置在MEMS声学换能器（21）和所述的声学之间 进入开口（28; 98B）。 该滤波模块定义声进入开口之间的至少一个直接声波路径（28; 98B）和所述声室（6）。

公开(公告)号：EP4135022A3

公开(公告)日：2023-02-22

申请号：EP22188832.4

申请日：2022-08-04

Applicant: STMicroelectronics (Malta) Ltd

Inventor： DUCA, Roseanne

IPC: H01L23/13

Abstract: A support substrate includes an insulating core layer, an electrically conductive layer over the insulating core layer and a solder mask layer over the electrically conductive layer. A back side of an integrated circuit chip is mounted to an upper surface of the support substrate at a die attach location. The upper surface of the support substrate includes a cavity located within the die attach location, where the cavity extends under the back side of the integrated circuit chip. The cavity is defined by an area where the solder mask layer and at least a portion of the electrically conductive layer have been removed. Bonding wires connect connection pads on a front side of the integrated circuit chip to connection pad on the upper surface of the support substrate.

公开(公告)号：EP4135022A2

公开(公告)日：2023-02-15

申请号：EP22188832.4

申请日：2022-08-04

Applicant: STMicroelectronics (Malta) Ltd

Inventor： DUCA, Roseanne

IPC: H01L23/13

Abstract: A support substrate includes an insulating core layer, an electrically conductive layer over the insulating core layer and a solder mask layer over the electrically conductive layer. A back side of an integrated circuit chip is mounted to an upper surface of the support substrate at a die attach location. The upper surface of the support substrate includes a cavity located within the die attach location, where the cavity extends under the back side of the integrated circuit chip. The cavity is defined by an area where the solder mask layer and at least a portion of the electrically conductive layer have been removed. Bonding wires connect connection pads on a front side of the integrated circuit chip to connection pad on the upper surface of the support substrate.

公开(公告)号：EP3113509A1

公开(公告)日：2017-01-04

申请号：EP16175518.6

申请日：2016-06-21

Applicant: STMicroelectronics S.r.l. ,  Stmicroelectronics (Malta) Ltd

Inventor： BRIOSCHI, Roberto ,  GRITTI, Alex ,  FORMOSA, Kevin

IPC: H04R19/00 ,  B81B7/00 ,  H04R19/04

CPC classification number: H04R1/04 ,  B81B7/0061 ,  B81B7/008 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2207/012 ,  B81B2207/07 ,  H04R1/06 ,  H04R19/005 ,  H04R19/04 ,  H04R31/00 ,  H04R31/006 ,  H04R2201/003 ,  H04R2499/11

Abstract: A microelectromechanical microphone includes: a substrate (2); a sensor chip (5), integrating a microelectromechanical electroacoustic transducer (35); and a control chip (6) operatively coupled to the sensor chip (5). The sensor chip (5) and the control chip (6) are bonded to the substrate (2), and the sensor chip (5) in part overlies the control chip (6). The sensor chip (5) the has a first portion fixed to a face (6a) of the control chip (6) and comprises a transduction member (37) acoustically communicating with a sound port (11).

Abstract translation: 微电机麦克风包括：基板（2）; 传感器芯片（5），集成微机电电声换能器（35）; 以及可操作地耦合到所述传感器芯片（5）的控制芯片（6）。 传感器芯片（5）和控制芯片（6）结合到基板（2）上，并且传感器芯片（5）部分地覆盖在控制芯片（6）上。 传感器芯片（5）具有固定到控制芯片（6）的面（6a）的第一部分，并且包括与声音端口（11）声学连通的转导构件（37）。

公开(公告)号：EP2517480A1

公开(公告)日：2012-10-31

申请号：EP10795018.0

申请日：2010-12-22

Applicant: STMicroelectronics S.r.l. ,  Stmicroelectronics (Malta) Ltd

Inventor： FORMOSA, Kevin ,  AZZOPARDI, Mark Anthony ,  CORTESE, Mario Francesco

IPC: H04R19/00 ,  B81B7/00

CPC classification number: H04R19/005 ,  B81B2201/0257 ,  B81B2207/012 ,  B81B2207/07 ,  B81B2207/093 ,  B81C1/0023 ,  B81C2203/019 ,  B81C2203/035 ,  B81C2203/0785 ,  B81C2203/0792 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/8592 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/16151 ,  H01L2924/3025 ,  Y10T29/49117 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A MEMS transducer (1) has a micromechanical sensing structure (10) and a package (46). The package (46) is provided with a substrate (45), carrying first electrical-connection elements (47), and with a lid (25), coupled to the substrate to define an internal cavity (24), in which the micromechanical sensing structure (10) is housed. The lid (25) is formed by: a cap layer (20) having a first surface (20a) and a second surface (20b), set opposite to one another, the first surface (20a) defining an external face of the package (46) and the second surface (20b) facing the substrate (45) inside the package (46); and a wall structure (21), set between the cap layer (20) and the substrate (45), and having a coupling face (21a) coupled to the substrate (45). At least a first electrical component (10, 11) is coupled to the second surface (20b) of the cap layer (20), inside the package (46), and the coupling face (21a) of the wall structure (21) carries second electrical-connection elements (30), electrically connected to the first electrical component (10, 11) and to the first electrical-connection elements (47).