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    IMPROVED MICRO-ELECTRO-MECHANICAL MICROPHONE, ELECTRONIC SYSTEM INCLUDING THE MICRO-ELECTRO-MECHANICAL MICROPHONE AND MANUFACTURING PROCESS
    6.
    发明公开
    IMPROVED MICRO-ELECTRO-MECHANICAL MICROPHONE, ELECTRONIC SYSTEM INCLUDING THE MICRO-ELECTRO-MECHANICAL MICROPHONE AND MANUFACTURING PROCESS 审中-公开
    VERBESSERTES MIKROELEKTROMECHANISCHES MIKROFON，ELEKTRONISCHES SYSTEM MIT DEM MIKROELEKTROMECHANISCHEN MIKROFON UND HERSTELLUNGSVERFAHREN

    公开(公告)号：EP3113511A1

    公开(公告)日：2017-01-04

    申请号：EP16175620.0

    申请日：2016-06-22

    Applicant: STMicroelectronics S.r.l. ,  Stmicroelectronics (Malta) Ltd

    Inventor： BRIOSCHI, Roberto ,  BARBARA, Paul Anthony

    IPC: H04R19/04

    CPC classification number: H04R1/04 ,  B81B7/0061 ,  B81B7/008 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2207/012 ,  B81B2207/07 ,  H04R1/06 ,  H04R19/005 ,  H04R19/04 ,  H04R31/00 ,  H04R31/006 ,  H04R2201/003 ,  H04R2499/11

    Abstract: A micro-electro-mechanical microphone comprising: a substrate (2); a sensor chip (5), which is coupled to the substrate (2) and integrates a micro-electro-mechanical electro-acoustic transducer (35); a control chip (6), which is joined to the substrate (2) and is operatively coupled to the sensor chip (5); a bonding ring (16), which surrounds the sensor chip (5) and the control chip (6); a cap (3), which is coupled to the substrate (2) via the bonding ring (16) and forms an acoustic chamber (4) that houses the control chip (6) and the sensor chip (5); a barrier (18), which extends between the bonding ring (16) and the sensor chip (5) at a first distance and a second distance, respectively, therefrom, for defining a first trench (19) between the bonding ring (16) and the barrier (18) and a second trench (25) between the barrier (18) and the sensor chip (5).

    Abstract translation: 一种微机电麦克风，包括：基板（2）; 传感器芯片（5），其耦合到所述基板（2）并且集成了微电机电声换能器（35）; 控制芯片（6），其连接到所述基板（2）并且可操作地耦合到所述传感器芯片（5）; 围绕传感器芯片（5）和控制芯片（6）的接合环（16）; 盖（3），其经由所述接合环（16）联接到所述基板（2），并形成容纳所述控制芯片（6）和所述传感器芯片（5）的声室（4）; 阻挡层（18），其分别在所述接合环（16）和所述传感器芯片（5）之间以其第一距离和第二距离延伸，用于限定所述接合环（16）和所述传感器芯片（5）之间的第一沟槽（19） 和阻挡层（18）和位于阻挡层（18）和传感器芯片（5）之间的第二沟槽（25）。

    MICROELECTROMECHANICAL MICROPHONE AND PROCESS FOR MANUFACTURING A MICROELECTROMECHANICAL MICROPHONE
    7.
    发明公开
    MICROELECTROMECHANICAL MICROPHONE AND PROCESS FOR MANUFACTURING A MICROELECTROMECHANICAL MICROPHONE 审中-公开
    MIKROELEKTROMECHANISCHES MIKROFON UND VERFAHREN ZUR HERSTELLUNG EINES MIKROELEKTROMECHANISCHEN MIKROFONS

    公开(公告)号：EP3113510A1

    公开(公告)日：2017-01-04

    申请号：EP16175630.9

    申请日：2016-06-22

    Applicant: STMicroelectronics S.r.l. ,  Stmicroelectronics (Malta) Ltd

    Inventor： BRIOSCHI, Roberto

    IPC: H04R19/00

    Abstract: A microelectromechanical microphone includes: a supporting substrate (2), having a first face (2a) and a second face (2b); a sensor chip (5), bonded to the first face (2a) of the supporting substrate (2) and integrating a microelectromechanical electroacoustic transducer (35); and a control chip (6) operatively coupled to the sensor chip (5), at least one portion of the control chip (6) being comprised between the first face (2a) and the second face (2b) of the supporting substrate (2). The sensor chip (5) is at least partially arranged on top of the control chip (6).

    Abstract translation: 微电机麦克风包括：具有第一面（2a）和第二面（2b）的支撑衬底（2）; 传感器芯片（5），其结合到所述支撑基板（2）的第一面（2a）并且集成微机电电声换能器（35）; 以及可操作地耦合到所述传感器芯片（5）的控制芯片（6），所述控制芯片（6）的至少一部分包括在所述支撑衬底（2）的第一面（2a）和第二面（2b）之间 ）。 传感器芯片（5）至少部分地布置在控制芯片（6）的顶部上。

    ASSEMBLY OF A MICROFLUIDIC DEVICE FOR ANALYSIS OF BIOLOGICAL MATERIAL
    8.
    发明申请
    ASSEMBLY OF A MICROFLUIDIC DEVICE FOR ANALYSIS OF BIOLOGICAL MATERIAL 审中-公开
    用于分析生物材料的微流体装置的组装

    公开(公告)号：WO2007148358A1

    公开(公告)日：2007-12-27

    申请号：PCT/IT2006/000485

    申请日：2006-06-23

    Applicant: STMICROELECTRONICS S.R.L. ,  MAGNI, Pierangelo ,  BRIOSCHI, Roberto

    Inventor： MAGNI, Pierangelo ,  BRIOSCHI, Roberto

    IPC: B01L3/00

    CPC classification number: B01L3/502707 ,  B01L2200/027 ,  B01L2200/10 ,  B01L2300/043 ,  B01L2300/0609 ,  B01L2300/0867 ,  B01L2300/123 ,  B01L2300/1805 ,  B01L2400/0481 ,  B01L2400/0622 ,  B01L2400/0638 ,  B01L2400/0644 ,  Y10T436/25 ,  Y10T436/2575

    Abstract: In a microfluidic assembly (20), a microfluidic device (I1) is provided with a body (4) in which at least a first inlet (7) for loading a fluid to analyse and a buried area (8) in fluidic communication with the first inlet (7) are defined. An analysis chamber (10') is in fluidic communication with the buried area (8) and an interface cover (23) is coupled in a fluid-tight manner above the microfluidic device (I1) . The interface cover (23) is provided with a sealing portion (35) in correspondence to the analysis chamber (10')/ adapted to assume a first configuration, at rest, in which it leaves the analysis chamber (10') open, and a second configuration, as a consequence of a stress, in which it closes in a fluid-tight manner the same analysis chamber.

    Abstract translation: 在微流体组件（20）中，微流体装置（I1）设置有主体（4），其中至少第一入口（7）用于装载待分析的流体和与该流体相通的埋入区域（8） 定义第一入口（7）。 分析室（10'）与掩埋区域（8）流体连通，并且界面盖（23）以流体密封的方式联接在微流体装置（I1）上方。 接口盖（23）设置有与分析室（10'）对应的适于呈现静止状态的第一配置（其离开分析室10'）的密封部分（35），以及 作为应力的结果的第二构造，其以不流体密封的方式封闭相同的分析室。

    MINIATURIZED LOAD SENSOR DEVICE HAVING LOW SENSITIVITY TO THERMO-MECHANICAL PACKAGING STRESS, IN PARTICULAR FORCE AND PRESSURE SENSOR
    9.
    发明公开
    MINIATURIZED LOAD SENSOR DEVICE HAVING LOW SENSITIVITY TO THERMO-MECHANICAL PACKAGING STRESS, IN PARTICULAR FORCE AND PRESSURE SENSOR 审中-公开
    小型化的负载传感器装置对热机械包装应力，特别是力和压力传感器具有低灵敏度

    公开(公告)号：EP3252449A1

    公开(公告)日：2017-12-06

    申请号：EP16206884.5

    申请日：2016-12-23

    Applicant: STMicroelectronics S.r.l.

    Inventor： CALTABIANO, Daniele ,  ABBASI GAVARTI, Mohammad ,  MURARI, Bruno ,  BRIOSCHI, Roberto ,  GIUSTI, Domenico

    IPC: G01L9/00 ,  G01L1/04

    Abstract: A load-sensing device (10), arranged in a package (12) forming a chamber (24). The package (12) has a deformable substrate (21) configured, in use, to be deformed by an external force. A sensor unit (11) is in direct contact with the deformable substrate (21) and is configured to detect deformations of the deformable substrate. An elastic element (15) is arranged within of the chamber (24) and acts between the package (12) and the sensor unit (11) to generate, on the sensor unit, a force keeping the sensor unit in contact with the deformable substrate. For example, the deformable substrate is a base (21) of the package (12), and the elastic element is a metal lamina (15) arranged between the lid (22) of the package (12) and the sensor unit (11). The sensor unit (11) may be a semiconductor die integrating piezoresistors.

    Abstract translation: 负载感测装置（10），其布置在形成腔室（24）的包装（12）中。 包装（12）具有可变形的基底（21），该基底在使用中被配置为通过外力而变形。 传感器单元（11）与可变形基板（21）直接接触并且被配置为检测可变形基板的变形。 弹性元件（15）布置在腔室（24）内并且作用在封装（12）和传感器单元（11）之间，以在传感器单元上​​产生保持传感器单元与可变形基底 。 例如，可变形衬底是封装（12）的基座（21），并且弹性元件是布置在封装（12）的盖（22）和传感器单元（11）之间的金属薄片（15） 。 传感器单元（11）可以是集成压敏电阻器的半导体管芯。

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