公开(公告)号：KR1020050019664A

公开(公告)日：2005-03-03

申请号：KR1020030057584

申请日：2003-08-20

Applicant: 삼성전자주식회사

Inventor： 신화수 ,  전종근 ,  오선주

IPC: H01L21/60

Abstract: PURPOSE: A semiconductor package having solder balls is provided to prevent the decrease of the reliability of a solder joint by forming a second nickel layer on a copper layer. CONSTITUTION: A solder ball(30) comprises sequentially from a plastic core(31) located in the center, a first nickel layer(32), a copper layer(33), a second nickel layer(34) and a solder layer(35). The second nickel layer has the thickness of 1 to 5μm. The second nickel layer is coated on the copper layer by electroless plating, electrolytic plating or hot dipping.

Abstract translation: 目的：提供一种具有焊球的半导体封装件，以通过在铜层上形成第二镍层来防止焊点的可靠性降低。 构成：从位于中心的塑料芯（31），第一镍层（32），铜层（33），第二镍层（34）和焊料层（35）顺次包括焊球（30） ）。 第二镍层的厚度为1〜5μm。 通过无电镀，电解电镀或热浸镀，将第二镍层涂覆在铜层上。

公开(公告)号：KR1020050009357A

公开(公告)日：2005-01-25

申请号：KR1020030048598

申请日：2003-07-16

Applicant: 삼성전자주식회사

Inventor： 이정웅 ,  전종근 ,  신화수

IPC: H05K3/34

CPC classification number: H05K3/3484 ,  B41F15/44 ,  H05K3/1216 ,  H05K2203/0139

Abstract: PURPOSE: A screen printer for a printed circuit board is provided to reduce manufacturing steps by printing both sides of the printed circuit board simultaneously. CONSTITUTION: A screen printer for a printed circuit board includes a board support member(110), a pair of first and second screens(121,122), a pair of first and second screen elevators, a pair of first and second squeeze plates(141,142), and a pair of first and second squeeze plate elevators(151,152). The board support member supports at least two sides of four sides of the printed circuit board. The first and second screens includes a first side having a first circuit pattern formed thereon, a second side having a second circuit pattern formed thereon, and a first and second apertures having patterns corresponding to the circuit patterns. The first and second screen elevators move the first and second screens. The first and second squeeze plates apply first and second solder pastes to apply them on the first and second sides, respectively. The first and second squeeze plate elevators moves the second and second squeeze plates in a direction normal to each of the first and second sides.

Abstract translation: 目的：提供印刷电路板的丝网印刷机，通过同时印刷印刷电路板的两面来减少制造步骤。 构成：印刷电路板用的丝网印刷机包括板支撑部件（110），一对第一和第二筛网（121,122），一对第一和第二筛网升降机，一对第一和第二挤压板（141,142） ，以及一对第一和第二挤压板升降机（151,152）。 板支撑构件支撑印刷电路板的四边的至少两侧。 第一和第二屏幕包括其上形成有第一电路图案的第一侧，其上形成有第二电路图案的第二侧，以及具有对应于电路图案的图案的第一和第二孔。 第一和第二屏幕电梯移动第一和第二屏幕。 第一和第二挤压板分别施加第一和第二焊膏以将它们施加在第一和第二侧上。 第一和第二挤压板式升降机沿着与第一和第二侧中的每一个垂直的方向移动第二和第二挤压板。

公开(公告)号：KR1020050009036A

公开(公告)日：2005-01-24

申请号：KR1020030048284

申请日：2003-07-15

Applicant: 삼성전자주식회사

Inventor： 고준영 ,  전종근 ,  신화수 ,  전병석

IPC: H01L23/12

CPC classification number: H01L2224/73215

Abstract: PURPOSE: A stack package and a fabricating method thereof are provided to reduce the fabricating cost by using a chip scale package having same internal structure without changing an internal design structure of the chip scale package. CONSTITUTION: First ad second electrode pads(12,22) are formed around each center of first and second semiconductor chips. First and second wiring substrates(13,23) include first and second windows, an inner connection pad, an outer connection pad(15), and first and second solder bump pads(14,24). First and second bonding wires(17,27) are used for connecting the first and second electrode pads to the inner connection pad through the first and second windows. First sealing parts(51,52) are used for sealing the first and second bonding wires. First and second solder balls(16,26) are adhered to the first and second solder bump pads. First and second chip scale packages includes second sealing parts for sealing the first and second semiconductor chips. A package connection wiring layer(31) is formed on an outer circumference of the second sealing part of the first chip scale package and includes a package connection pad(33) and a package connection wiring(32).

Abstract translation: 目的：提供堆叠封装及其制造方法，通过使用具有相同内部结构的芯片级封装而不改变芯片级封装的内部设计结构来降低制造成本。 构成：围绕第一和第二半导体芯片的每个中心形成第一ad第二电极焊盘（12,22）。 第一和第二布线基板（13,23）包括第一和第二窗口，内部连接焊盘，外部连接焊盘（15）以及第一和第二焊料凸块焊盘（14,24）。 第一和第二接合线（17,27）用于通过第一和第二窗口将第一和第二电极焊盘连接到内部连接焊盘。 第一密封部件（51,52）用于密封第一和第二接合线。 第一和第二焊球（16,26）粘附到第一和第二焊料凸块焊盘。 第一和第二芯片级封装包括用于密封第一和第二半导体芯片的第二密封部件。 封装连接布线层（31）形成在第一芯片级封装的第二密封部分的外圆周上，并且包括封装连接焊盘（33）和封装连接布线（32）。

公开(公告)号：KR1020010037611A

公开(公告)日：2001-05-15

申请号：KR1019990045240

申请日：1999-10-19

Applicant: 삼성전자주식회사

Inventor： 신화수 ,  박재용

IPC: H01L21/60

CPC classification number: H01L2224/11 ,  H01L2224/16225 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00012

Abstract: PURPOSE: An iron/nickel core solder ball is provided to adhesion of a semiconductor chip to a printed circuit board, by improving intensity and adhesion to minimize deformation caused by thermal stress, so that defects such as a crack, a bump phenomenon and surface roughness are prevented. CONSTITUTION: An iron/nickel core solder ball(10) is a connection unit adhered to an electrode pad of a semiconductor chip, and has a dual structure composed of a tin/lead coating layer on an outer circumferential surface of an iron/nickel core(11).

Abstract translation: 目的：提供一种铁/镍芯焊球，通过提高强度和粘附力，使半导体芯片与印刷电路板的粘附性最小化，使由热应力引起的变形最小化，使裂纹，凸起现象和表面粗糙度等缺陷 被阻止 构成：铁/镍芯焊球（10）是粘附到半导体芯片的电极焊盘的连接单元，并且具有由铁/镍芯的外周面上的锡/铅涂层组成的双重结构 （11）。

公开(公告)号：KR1020000074091A

公开(公告)日：2000-12-05

申请号：KR1019990017797

申请日：1999-05-18

Applicant: 삼성전자주식회사

Inventor： 신화수 ,  장옥형 ,  김희석

IPC: H01L23/12

Abstract: PURPOSE: A method for manufacturing a ball grid array package is provided to prevent neighboring fluxes from being shorted even if a pitch between solder ball pads becomes finer, by temporarily applying heat to melt the fluxes when a solder ball is settled in the solder ball pads after flux of a predetermined thickness is applied on the surface of the solder ball. CONSTITUTION: A semiconductor chip having bonding pads is adhered to a surface of a board having conductive patterns and solder ball patterns by intervening an adhesive. An end of the conductive patterns is bonded to the bonding pads to electrically connect the semiconductor chip with the board. The side surface of the semiconductor chip and the surface of the board are molded by using an epoxy molding compound. After the solder ball pads exposed to the other side of the board and solder balls(150) absorbed to a solder ball fix jig are aligned, the solder balls are settled on the solder ball pads. The solder ball coated with flux is heated to completely connect the solder ball pads with the solder ball by a backward process.

Abstract translation: 目的：提供制造球栅阵列封装的方法，以便即使当焊球沉积在焊球垫中时，通过临时加热来熔化焊剂，焊膏球之间的间距变得更细，以防止相邻焊剂短路 在焊球的表面上施加预定厚度的焊剂。 构成：具有接合焊盘的半导体芯片通过介入粘合剂粘附到具有导电图案和焊球图案的板的表面上。 将导电图案的一端接合到接合焊盘，以将半导体芯片与板电连接。 半导体芯片的侧表面和基板的表面通过使用环氧模塑料模制。 在露出到板的另一侧的焊球焊盘和吸附到焊球固定夹具的焊球（150）对准之后，焊球沉积在焊球垫上。 涂覆有助熔剂的焊球被加热，以通过反向工艺将焊球垫与焊球完全连接。

公开(公告)号：KR1019980027860A

公开(公告)日：1998-07-15

申请号：KR1019960046775

申请日：1996-10-18

Applicant: 삼성전자주식회사

Inventor： 신화수

IPC: H01L23/28

Abstract: 반도체 칩 패키지가 탑재되어 복수 개의 열을 이룰 수 있는 형상을 갖는 탑재대; 상기 탑재대를 기계적으로 지지할 수 있는 틀인 몸체; 상기 탑재대의 상부에 위치하며 수직으로 유동이 가능하도록 몸체와 기계적으로 결합되어 있는 고정대; 상기 탑재대에 탑재된 반도체 칩 패키지의 열의 일측을 지지할 수 있도록 상기 몸체에 기계적으로 결합된 후방 지지대; 상기 후방 지지대와 대향하는 방향의 위치에 소정의 탄성 수단에 의해 가압되어 상기 후방 지지대 방향으로 이동이 가능하도록 상기 몸체와 기계적으로 결합되어 있는 전방 지지대; 를 포함하는 것을 특징으로 하는 지그(jig)를 제공함으로써, 리드 도금시 타이바의 존재로 발생되는 도금 불량의 발생을 방지하여 패키지의 신뢰성을 향상시킴과 동시에 테스트 장치의 손상과 별도 공정의 추가를 하지않음으로 하여 반도체 칩 패키지의 제조 단가를 절감할 수 있는 효과가 있다.

公开(公告)号：KR1019950008235B1

公开(公告)日：1995-07-26

申请号：KR1019920018549

申请日：1992-10-09

Applicant: 삼성전자주식회사

Inventor： 심보근 ,  신화수 ,  박기환

IPC: H01L23/00

Abstract: The device prevents soft solder, exposed when spreading onto the external lead of semiconductor package, from spreading to a tie bar and increases reliability when placing the package on the printed circuit board. This device comprises of a container which contains an unstable soft solder, a pressure applying unit which makes the soft soler flow in one direction, a transferring unit which helps the soft solder spreading to an external lead, and a nozzle which is to form waves on the surface of the upper part of the soft solder and not to make the soft solder spread to the projected tie bar by having the body of package curved.

Abstract translation: 该装置防止在扩散到半导体封装的外部引线上时露出的软焊料扩散到连接杆，并且在将封装放置在印刷电路板上时增加可靠性。 该装置包括容纳不稳定的软焊料的容器，使软质层沿一个方向流动的压力施加单元，有助于软焊料扩散到外部引线的转移单元，以及形成波形的喷嘴 软焊料上部的表面，并且不会使软焊料通过使封装体弯曲而扩散到突出的连接杆。