-
公开(公告)号：KR1020070005234A
公开(公告)日：2007-01-10
申请号：KR1020050060428
申请日：2005-07-05
Applicant: 삼성전자주식회사
IPC: G01M3/04
Abstract: A leakage sensor and a leakage detection system are provided to shorten the time for an environmental safety inspection of a semiconductor line by using a litmus paper. A leakage sensor includes a fluid detection member, at least two wires(122,123), and a cable(130). The fluid detection member determines a contact with a fluid. The wires are combined with the fluid detection member. The cable coats the two wires. The fluid detection member takes the form of a film. The fluid detection member in the form of a film includes a litmus paper. The two wires are buried in the interior of the litmus paper.
Abstract translation: 提供泄漏传感器和泄漏检测系统，以通过使用石蕊纸来缩短半导体线路的环境安全检查的时间。 泄漏传感器包括流体检测构件，至少两根电线（122,123）和电缆（130）。 流体检测构件确定与流体的接触。 电线与流体检测构件组合。 电缆涂上两根电线。 流体检测构件采取膜的形式。 薄膜形式的流体检测部件包括石蕊纸。 两条电线埋在石蕊纸的内部。
-
公开(公告)号：KR100498495B1
公开(公告)日：2005-07-01
申请号：KR1020030028874
申请日：2003-05-07
Applicant: 삼성전자주식회사
IPC: H01L21/304
CPC classification number: H01L21/67028 , H01L21/31111
Abstract: 실리콘 질화막 식각 배스를 포함하는 반도체 소자의 세정 시스템 및 이를 이용한 세정방법을 개시한다. 개시된 본 발명의 반도체 소자의 세정 시스템은, 소정의 케미컬이 수용되어 있는 다수의 식각 배스, 상기 다수의 식각 배스 사이에 각각 설치되어 탈이온수를 공급하는 세정 배스를 포함한다. 상기 다수의 식각 배스 중 어느 하나는 실리콘 질화막을 제거하기 위한 가열된 인산 용액을 수용하고 있고, 상기 가열된 인산 용액을 수용하는 식각 배스의 전단에는 웨이퍼의 온도를 상승시키기 위한 예열부가 구비되어 있다.
-
公开(公告)号：KR1020010010129A
公开(公告)日：2001-02-05
申请号：KR1019990028845
申请日：1999-07-16
Applicant: 삼성전자주식회사
IPC: H01L21/304
Abstract: PURPOSE: A cleaning apparatus of a semiconductor chip package is provided to prevent that a ball grid array package is directly contacted with a cleaning apparatus by improving a structure of the cleaning apparatus of removing a flux from the ball grid array package. CONSTITUTION: A cleaning apparatus includes two guide parts, a conveyance device(130), and a pure water supply part(160). The two guide parts are faced to each other, include a body and a guide rail, and fix both terminals of a base substrate including a semiconductor chip package. The pure water supply part includes a pure water supply pipe and a jet nozzle. The pure water supply pipe is mounted between the guide parts, and is arranged as a predetermined shape at upper and lower parts centering on the guide part. The jet nozzle jets pure water for removing a predetermined alien material smeared on the semiconductor chip package. Thereby, the cleaning apparatus of a semiconductor chip package improves a structure of the cleaning apparatus of removing a flux from the ball grid array package, and prevents that a ball grid array package is directly contacted with a cleaning apparatus.
Abstract translation: 目的：提供半导体芯片封装的清洁装置，以通过改进从球栅阵列封装中去除焊剂的清洁装置的结构来防止球栅阵列封装与清洁装置直接接触。 构成：清洁装置包括两个引导部件，输送装置（130）和纯净水供应部件（160）。 两个引导部分彼此面对，包括主体和导轨，并且固定包括半导体芯片封装的基底基板的两个端子。 纯水供给部包括纯水供给管和喷嘴。 纯水供给管安装在引导部之间，以导向部为中心的上下部配置为规定形状。 喷射喷嘴喷射净水以去除涂在半导体芯片封装上的预定外来材料。 因此，半导体芯片封装的清洁装置改善了从球栅阵列封装中去除焊剂的清洁装置的结构，并且防止了球栅阵列封装与清洁装置直接接触。
-
公开(公告)号：KR1020000072895A
公开(公告)日：2000-12-05
申请号：KR1019990015837
申请日：1999-05-03
Applicant: 삼성전자주식회사
IPC: H01L21/304
Abstract: PURPOSE: An exhaust apparatus of a wet processing equipment for manufacturing a semiconductor device is provided to prevent a crack or deterioration of a sink so that cleaning liquid is not leaked and the equipment is not deteriorated, by establishing an auxiliary sink having a coolant supplying line. CONSTITUTION: In an exhaust apparatus of a wet processing equipment for manufacturing a semiconductor device, an auxiliary sink(21) having a coolant supplying line(22) is established in a position wherein cleaning liquid is overflowed or exhausted from a quick drain bath(11). The sink(12) is established in a lower part of the quick drain bath.
Abstract translation: 目的：提供一种用于制造半导体器件的湿式加工设备的排气装置，以通过建立具有冷却剂供应管线的辅助水槽来防止水槽的裂缝或劣化，使得清洗液不会泄漏并且设备不劣化 。 构成：在用于制造半导体器件的湿式加工设备的排气装置中，建立具有冷却剂供应管线（22）的辅助水槽（21），其中清洗液体从快速排水槽（11）溢出或排出 ）。 水槽（12）建立在快速排水槽的下部。
-
公开(公告)号：KR1019990034757A
公开(公告)日：1999-05-15
申请号：KR1019970056453
申请日：1997-10-30
Applicant: 삼성전자주식회사
Inventor： 박기환
IPC: H01L21/304
Abstract: 기포(bubble) 발생 수단을 가지는 반도체 장치 세정용 장치를 개시한다. 본 발명은, 용액을 담는 세정조(cleaning bath) 및 기포를 발생시키는 기포 발생 수단을 포함한다. 기포 발생 수단은, 세정조 내에 도입되며, 가스(gas)가 통과하는 긴 주관과, 주관의 길이 방향과 일정한 각도로 주관의 측부에 연결되며 가스의 통로로 이용되는 제1보조관 및 제1보조관과 다른 길이로 주관의 길이 방향과 일정한 각도를 가지며 주관의 측부에 연결되며 가스의 통로로 이용되는 제2보조관을 포함한다. 이때, 제1보조관 및 제2보조관은 순차적인 순서로 주관의 측부에 연결된다. 또한, 제1보조관은 주관에 대칭하여 쌍으로 주관에 연결되고, 제2보조관 또한 주관에 대칭하여 쌍으로 주관에 연결된다. 더하여, 제1보조관 및 제2보조관은 제1보조관 및 제2보조관의 말단에 가스를 세정조 내로 배출하는 개구를 가지고, 길이 방향에 대해서 일정한 곡률로 휘어진 말단을 가진다.
-
Patent Agency Ranking
-
公开(公告)号：KR1020030005954A
公开(公告)日：2003-01-23
申请号：KR1020010041471
申请日：2001-07-11
Applicant: 삼성전자주식회사
CPC classification number: G01K15/00
Abstract: PURPOSE: An apparatus and method for sensing defect of temperature sensor is provided to prevent defect of wafer by accurately controlling temperature of the chemical solution or chamber during semiconductor fabrication process. CONSTITUTION: An apparatus for sensing defect of temperature sensor, comprises a temperature sensor(12) for sensing temperature of the chemical solution stored in a chemical bath(10); and a temperature control unit(18) for outputting a control signal for displaying the temperature detected by the temperature sensor, storing a preset reference temperature corresponding to the specific resistant value of the temperature sensor, and outputting a defective state display control signal and an alarm control signal by comparing the temperature detected by the temperature sensor with the preset reference temperature and determining defect of the temperature sensor for a predetermined unit time for a preset time period when the chemical solution is exchanged or the process is paused.
Abstract translation: 目的：提供一种用于感测温度传感器缺陷的设备和方法，以通过在半导体制造过程中精确控制化学溶液或室的温度来防止晶片缺陷。 构成：用于感测温度传感器的缺陷的装置，包括用于感测储存在化学浴液（10）中的化学溶液的温度的温度传感器（12）。 以及温度控制单元（18），用于输出用于显示由温度传感器检测到的温度的控制信号，存储与温度传感器的特定阻抗值对应的预设参考温度，并输出缺陷状态显示控制信号和报警 通过将温度传感器检测到的温度与预设的参考温度进行比较，并且在化学溶液被更换或处理暂停时的预定时间段内将预定单位时间的温度确定为温度传感器的缺陷，来控制信号。
-
公开(公告)号：KR1020010027010A
公开(公告)日：2001-04-06
申请号：KR1019990038566
申请日：1999-09-10
Applicant: 삼성전자주식회사
IPC: H01L23/12
Abstract: PURPOSE: A flexible circuit substrate for semiconductor package is provided to substitute an SR(Soldering Resister) layer to a flexible shield plate, to protect circuit pattern from outer impact stably without defect like a bleed appearance, and to improve the quality of flexible circuit substrate largely. CONSTITUTION: A flexible circuit substrate for semiconductor package is composed of a base plate(10) and a protection plate(20), attaching on the base plate(10). Multiple contact slots(13) are formed on the surface of the base plate(10) through a punching process. Using a laminate process, a metal foil layer is built on the base plate(10). Multiple of circuit patterns(12) are made on the metal foil layer. A non-conductive adhesive layer(11) is doped on the base plate(10) to attach the protection plate(20) stably. The protection plate contains multiple shield patterns(21), and the shield patterns are one to one correspondences with via holes(22). After bonding the base plate(10) and the protection plate(10), each shield patterns(21) covers the circuit pattern(12), and each via holes(22) is connected to the contact slots(13), respectively.
Abstract translation: 目的：提供一种用于半导体封装的柔性电路基板，用于将SR（焊接电阻）层代替到柔性屏蔽板上，以稳定的方式保护电路图案免受外部冲击的影响，而不会像渗出外观那样出现缺陷，并提高柔性电路基板的质量 大部分。 构成：用于半导体封装的柔性电路基板由安装在基板（10）上的基板（10）和保护板（20）组成。 通过冲压工艺在基板（10）的表面上形成多个接触槽（13）。 使用层压工艺，在基板（10）上形成金属箔层。 在金属箔层上形成多个电路图案（12）。 在基板（10）上掺杂非导电粘合剂层（11），以稳定地固定保护板（20）。 保护板包含多个屏蔽图案（21），并且屏蔽图案一一对应于通孔（22）。 在接合基板（10）和保护板（10）之后，每个屏蔽图案（21）覆盖电路图案（12），并且每个通孔（22）分别连接到接触槽（13）。
-
公开(公告)号：KR1020000043522A
公开(公告)日：2000-07-15
申请号：KR1019980059919
申请日：1998-12-29
Applicant: 삼성전자주식회사
IPC: H01L21/68
Abstract: PURPOSE: A wafer cassette transfer device with a wafer counter is provided to reduce a wafer counting time performed before or after a semiconductor process by installing a wafer counter within a wafer transfer device for transferring a wafer cassette. CONSTITUTION: A wafer cassette transfer device with a wafer counter comprises a transfer portion and a wafer sensor unit(122). The transfer portion transfers a wafer cassette to a designated location by driving a wafer cassette loading plate(108) for loading the wafer cassette receiving a plurality of wafer. The wafer sensor unit is installed at the wafer loading plate. The wafer sensor is inserted between the wafers through an opened lower portion of the wafer cassette.
Abstract translation: 目的：提供具有晶片计数器的晶片盒传送装置，以通过将用于传送晶片盒的晶片传送装置中的晶片计数器安装来减少在半导体处理之前或之后执行的晶片计时时间。 构成：具有晶片计数器的晶片盒传送装置包括传送部分和晶片传感器单元（122）。 转印部分通过驱动用于装载接收多个晶片的晶片盒的晶片盒装载板（108）将晶片盒传送到指定位置。 晶片传感器单元安装在晶片装载板上。 晶片传感器通过晶片盒的打开的下部插入在晶片之间。
-
-
-
-
-
-
-
-
-
Search Results
39
records
(took 0.02 seconds)
