公开(公告)号：US20210358872A1

公开(公告)日：2021-11-18

申请号：US17387836

申请日：2021-07-28

Applicant: Intel Corporation

Inventor： Srinivas V. PIETAMBARAM ,  Rahul N. MANEPALLI ,  Kristof Kuwawi DARMAWIKARTA ,  Robert Alan MAY ,  Aleksandar ALEKSOV ,  Telesphor KAMGAING

IPC: H01L23/66 ,  H01L21/56 ,  H01L23/00

Abstract: Semiconductor packages having a die electrically connected to an antenna by a coaxial interconnect are described. In an example, a semiconductor package includes a molded layer between a first antenna patch and a second antenna patch of the antenna. The first patch may be electrically connected to the coaxial interconnect, and the second patch may be mounted on the molded layer. The molded layer may be formed from a molding compound, and may have a stiffness to resist warpage during fabrication and use of the semiconductor package.

公开(公告)号：US20210194106A1

公开(公告)日：2021-06-24

申请号：US17194022

申请日：2021-03-05

Applicant: Intel Corporation

Inventor： Telesphor KAMGAING ,  Sasha OSTER ,  Georgios DOGIAMIS ,  Johanna SWAN

IPC: H01P5/08 ,  H01P1/207 ,  H01P3/12

Abstract: Embodiments of the invention include a mm-wave waveguide connector and methods of forming such devices. In an embodiment the mm-wave waveguide connector may include a plurality of mm-wave launcher portions, and a plurality of ridge based mm-wave filter portions each communicatively coupled to one of the mm-wave launcher portions. In an embodiment, the ridge based mm-wave filter portions each include a plurality of protrusions that define one or more resonant cavities. Additional embodiments may include a multiplexer portion communicatively coupled to the plurality of ridge based mm-wave filter portions and communicative coupled to a mm-wave waveguide bundle. In an embodiment the plurality of protrusions define resonant cavities with openings between 0.5 mm and 2.0 mm, the plurality of protrusions are spaced apart from each other by a spacing between 0.5 mm and 2.0 mm, and wherein the plurality of protrusions have a thickness between 200 μm and 1,000 μm.

公开(公告)号：US20210041647A1

公开(公告)日：2021-02-11

申请号：US17083173

申请日：2020-10-28

Applicant: Intel Corporation

Inventor： Shawna LIFF ,  Adel A. ELSHERBINI ,  Telesphor KAMGAING ,  Sasha N. OSTER ,  Gaurav CHAWLA

IPC: G02B6/42

Abstract: Microelectronic package communication is described using radio interfaces connected through wiring. One example includes a system board, an integrated circuit chip, and a package substrate mounted to the system board to carry the integrated circuit chip, the package substrate having conductive connectors to connect the integrated circuit chip to external components. A radio on the package substrate is coupled to the integrated circuit chip to modulate the data onto a carrier and to transmit the modulated data. A radio on the system board receives the transmitted modulated data and demodulates the received data, and a cable interface is coupled to the system board radio to couple the received demodulated data to a cable.

公开(公告)号：US20200314998A1

公开(公告)日：2020-10-01

申请号：US16369555

申请日：2019-03-29

Applicant: Intel Corporation

Inventor： Khang Choong YONG ,  Ying Ern HO ,  Wil Choon SONG ,  Yun Rou LIM ,  Telesphor KAMGAING

IPC: H05K1/02 ,  H05K3/02 ,  H05K3/18 ,  H05K1/09

Abstract: Embodiments herein relate to systems, apparatuses, processes or techniques directed to an impedance cushion coupled with a power plane to provide voltage for a system, where the impedance cushion is dimensioned to suppress resonance of the power plane to mitigate RFI or EMI emanating from the power plane during operation.

公开(公告)号：US20200219830A1

公开(公告)日：2020-07-09

申请号：US16714502

申请日：2019-12-13

Applicant: Intel Corporation

Inventor： Vijay K. NAIR ,  Georgios C. DOGIAMIS ,  Telesphor KAMGAING

IPC: H01L23/66 ,  H01L23/538 ,  H01L23/552 ,  H01L23/00 ,  H01L23/64 ,  H01Q1/38

Abstract: Embodiments of the invention include a microelectronic device that includes a transceiver coupled to a first substrate and a second substrate coupled to the first substrate. The second substrate includes an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher. An interposer substrate can provide a spacing between the first and second substrates.

公开(公告)号：US20200168569A1

公开(公告)日：2020-05-28

申请号：US16481385

申请日：2017-03-30

Applicant: Intel Corporation

Inventor： Sai VADLAMANI ,  Aleksandar ALEKSOV ,  Rahul JAIN ,  Kyu Oh LEE ,  Kristof Kuwawi DARMAWIKARTA ,  Robert Alan MAY ,  Sri Ranga Sai BOYAPATI ,  Telesphor KAMGAING

IPC: H01L23/66 ,  H01L23/498 ,  H01L21/48 ,  H01L23/00

Abstract: Semiconductor packages having a first layer interconnect portion that includes a coaxial interconnect between a die and a package substrate are described. In an example, the package substrate includes a substrate-side coaxial interconnect electrically connected to a signal line. The die is mounted on the package substrate and includes a die-side coaxial interconnect coupled to the substrate-side coaxial interconnect. The coaxial interconnects can be joined by a solder bond between respective central conductors and shield conductors.

公开(公告)号：US20190334227A1

公开(公告)日：2019-10-31

申请号：US16344717

申请日：2016-12-14

Applicant: Intel Corporation

Inventor： Georgios C. DOGIAMIS ,  Sasha N. OSTER ,  Telesphor KAMGAING

IPC: H01Q1/24 ,  H01Q1/38 ,  H01Q1/02 ,  H04W88/08

Abstract: Embodiments of the invention include a base station that includes a central transceiver unit (CTU) having a plurality of transceiver cores and a substrate. A printed circuit board (PCB) supports the substrate and at least one antenna unit is coupled to the PCB with at least one of a cable and a waveguide. The at least one antenna unit transmits and receives communications at a frequency of approximately 4 GHz or higher.

公开(公告)号：US20190326258A1

公开(公告)日：2019-10-24

申请号：US16399726

申请日：2019-04-30

Applicant: INTEL CORPORATION

Inventor： Fay HUA ,  Telesphor KAMGAING ,  Johanna M. SWAN

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/64 ,  H01L21/02 ,  H01L23/29 ,  H01L23/48 ,  H01L23/31 ,  H01L25/00

Abstract: Embodiments include devices and methods, including a device including a substrate comprising a semiconductor, the substrate including a front side comprising active elements and a backside opposite the front side. The device includes a dielectric layer on the backside, and a passive component on the dielectric layer on the backside. In certain embodiments, the passive device is formed on a self-assembled monolayer (SAM). Other embodiments are described and claimed.

公开(公告)号：US20190288382A1

公开(公告)日：2019-09-19

申请号：US16464678

申请日：2016-12-30

Applicant: Intel Corporation

Inventor： Telesphor KAMGAING ,  Sasha N. OSTER ,  Georgios C. DOGIAMIS

IPC: H01Q1/38 ,  H01Q21/22 ,  H01Q21/00 ,  H01Q1/24

Abstract: Embodiments of the invention include a microelectronic device that includes a first substrate having organic dielectric material, conductive layers, and a first portion of a distributed antenna unit. The first substrate supports at least one radio frequency (RF) component. A second substrate is coupled to the first substrate. The second substrate is integrated with a housing of the microelectronic device and includes a second portion of the distributed antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher.

公开(公告)号：US20190006298A1

公开(公告)日：2019-01-03

申请号：US16127820

申请日：2018-09-11

Applicant: Intel Corporation

Inventor： Georgios C. DOGIAMIS ,  Sasha N. OSTER ,  Telesphor KAMGAING ,  Adel A. ELSHERBINI ,  Brandon M. RAWLINGS ,  Feras EID

IPC: H01L23/66 ,  H01L23/367 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L23/00

CPC classification number: H01L23/66 ,  H01L23/367 ,  H01L23/3675 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5383 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L25/0655 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/73253 ,  H01L2924/014 ,  H01L2924/1421 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/15321 ,  H01L2924/16251 ,  H01L2924/163 ,  H01L2924/00014

Abstract: Embodiments of the invention may include a packaged device that includes thermally stable radio frequency integrated circuits (RFICs). In one embodiment the packaged device may include an integrated circuit chip mounted to a package substrate. According to an embodiment, the package substrate may have conductive lines that communicatively couple the integrated circuit chip to one or more external components. One of the external components may be an RFIC module. The RFIC module may comprise an RFIC and an antenna. Additional embodiments may also include a packaged device that includes a plurality of cooling spots formed into the package substrate. In an embodiment the cooling spots may be formed proximate to interconnect lines the communicatively couple the integrated circuit chip to the RFIC.