-
公开(公告)号:EP4498709A3
公开(公告)日:2025-04-02
申请号:EP24217003.3
申请日:2020-07-11
Applicant: QUALCOMM Incorporated
Inventor: PATIL, Abhishek Pramod , CHERIAN, George , ASTERJADHI, Alfred , HO, Sai Yiu Duncan , VERMA, Lochan , SUN, Yanjun
Abstract: The disclosure relates to wireless communication by an access point, AP, multi-link device, MLD, including a first AP associated with a first communication link of the AP MLD and including one or more second APs associated with one or more respective second communication links of the AP MLD. A respective method comprises: generating a frame by the first AP of the AP MLD, the frame including: a first plurality of elements carrying information for the first AP of the AP MLD; and one or more per-link profile subelements, each of the per-link profile sub-elements including a second plurality of elements carrying information for a respective second AP of the one or more second APs of the AP MLD, wherein an absence of an element of the first plurality of elements from the second plurality of elements included in a respective per-link profile subelement indicates that the second AP corresponding to the respective per-link profile subelement inherits information from the element of the first plurality of elements corresponding to the first AP, wherein a presence of an element of the first plurality of elements in the second plurality of elements included in a respective per-link profile subelement indicates that information carried in the element present in the second plurality of elements included in the respective per-link profile subelement is different from information carried in the element of the first plurality of elements for the first AP; and transmitting the frame, by the first AP of the AP MLD, over the first communication link of the AP MLD.
-
公开(公告)号:EP4473789A1
公开(公告)日:2024-12-11
申请号:EP23708356.3
申请日:2023-01-27
Applicant: QUALCOMM INCORPORATED
-
83.
公开(公告)号:EP4454396A1
公开(公告)日:2024-10-30
申请号:EP22818971.8
申请日:2022-11-01
Applicant: QUALCOMM INCORPORATED
-
公开(公告)号:EP4437777A1
公开(公告)日:2024-10-02
申请号:EP22793288.6
申请日:2022-09-26
Applicant: QUALCOMM INCORPORATED
Inventor: AJAMI, Abdel Karim , HO, Sai Yiu Duncan , ASTERJADHI, Alfred , CHERIAN, George , PATIL, Abhishek Pramod , SUN, Yanjun , NAIK, Gaurang
CPC classification number: H04W56/002 , H04W56/0015
-
公开(公告)号:EP4406356A1
公开(公告)日:2024-07-31
申请号:EP22764527.2
申请日:2022-08-09
Applicant: QUALCOMM INCORPORATED
Inventor: AJAMI, Abdel Karim , HO, Sai Yiu Duncan , CHERIAN, George , ASTERJADHI, Alfred , PATIL, Abhishek Pramod , SUN, Yanjun , NAIK, Gaurang
IPC: H04W84/12
-
公开(公告)号:EP4189902A1
公开(公告)日:2023-06-07
申请号:EP21758539.7
申请日:2021-07-30
Applicant: QUALCOMM INCORPORATED
Inventor: VERMANI, Sameer , ASTERJADHI, Alfred , SUN, Yanjun , TIAN, Bin , YANG, Lin , CHEN, Jialing Li , CHERIAN, George , KIM, Youhan
IPC: H04L5/00
-
公开(公告)号:EP4158988A1
公开(公告)日:2023-04-05
申请号:EP21736142.7
申请日:2021-05-24
Applicant: QUALCOMM INCORPORATED
Inventor: PATIL, Abhishek Pramod , HO, Sai Yiu Duncan , CHERIAN, George , ASTERJADHI, Alfred , SUN, Yanjun
IPC: H04W76/11
-
公开(公告)号:EP4133873A1
公开(公告)日:2023-02-15
申请号:EP21723051.5
申请日:2021-04-08
Applicant: QUALCOMM INCORPORATED
Inventor: PATIL, Abhishek Pramod , HO, Sai Yiu Duncan , CHERIAN, George , ASTERJADHI, Alfred , SUN, Yanjun
IPC: H04W74/00 , H04W76/15 , H04B7/0413 , H04W84/12
-
公开(公告)号:EP4133872A1
公开(公告)日:2023-02-15
申请号:EP21722069.8
申请日:2021-04-08
Applicant: QUALCOMM INCORPORATED
Inventor: PATIL, Abhishek Pramod , CHERIAN, George , ASTERJADHI, Alfred , HO, Sai Yiu Duncan , SUN, Yanjun , HOMCHAUDHURI, Sandip , XIAO, Yongchun
IPC: H04W74/00 , H04W76/15 , H04B7/0413 , H04W84/12
-
公开(公告)号:EP4115683A1
公开(公告)日:2023-01-11
申请号:EP21714516.8
申请日:2021-03-03
Applicant: QUALCOMM INCORPORATED
Inventor: CHERIAN, George , PATIL, Abhishek Pramod , HO, Sai Yiu Duncan , SUN, Yanjun , ASTERJADHI, Alfred
-
-
-
-
-
-
-
-
-