PRODUCTION OF COPOLYESTER
    81.
    发明专利

    公开(公告)号:JPH02305818A

    公开(公告)日:1990-12-19

    申请号:JP12768289

    申请日:1989-05-19

    Abstract: PURPOSE:To obtain a copolyester improved in heat resistance, uniformity of a molding and smoothness of an appearance by reacting p-hydroxybenzoic acid with an aromatic dihydroxy compound, an aromatic dicarboxylic acid and a polyester powder in the presence of acetic anhydride. CONSTITUTION:p-Hydroxybenzoic acid (A), an aromatic dihydroxy compound (B) selected from among 4,4'-dihydroxybiphenyl and hydroquinone, 2,6-dihydroxy naphthalene, t-butylhydroquinone, etc., an aromatic dicarboxylic acid (C) selected from among terephthalic acid, 4,4'-diphenyl-dicarboxylic acid, 2,6- naphthalenedicarboxylic acid, etc., and a polyester powder (D) of a particle diameter

    SEALANT FOR ELECTRONIC COMPONENT
    82.
    发明专利

    公开(公告)号:JPS6438432A

    公开(公告)日:1989-02-08

    申请号:JP19407387

    申请日:1987-08-03

    Abstract: PURPOSE:To obtain a sealant having low viscosity, high toughness, high heat resistance and good adhesion to electronic components, by using a liquid polyester comprising three specified kinds of structural units and being specified in their proportions and the position of the carbonyl groups as a component. CONSTITUTION:A sealant comprising a liquid crystal polyester comprising structural units (I)-(III) of formulas I-III, wherein structural units (I) amount to 30-90mol.% based on the total, structural units (I)/structural units [(II)(III)] is 50-90mol.%, the carbonyl groups of structural units (II) and (III) are para or meta to each other, and 60-80mol.% of them are in the para position. Structural units (I) represents a polyester structural unit derived from p- hydroxybenzoic acid. Structural unit (II) represents a polyester structural unit derived from 4,4'-dihydroxybiphenyl and terephthalic acid, isophthalic acid and isophthalic acid. Structural unit (III) represents a polyester structural unit derived from hydroquinone, terephthalic acid and isophthalic acid.

    ELECTRONIC COMPONENT SEALANT
    83.
    发明专利

    公开(公告)号:JPS6429424A

    公开(公告)日:1989-01-31

    申请号:JP18630387

    申请日:1987-07-24

    Abstract: PURPOSE:To obtain the title sealant which has a low melt viscosity and is excellent in tenacity, heat resistance and adhesion, by the polymn. of an arom. dioxy compd., an arom. dicarboxylic acid and a polyester through removal of acetic acid. CONSTITUTION:An arom. dioxy compd. (e.g., p-acetoxybenzoic acid), an arom. dicarboxylic acid (e.g., terephthalic acid) and a polyester obtd. from an ethylene glycol and an arom. dicarboxylic acid (e.g., polyethylene terephthalate) are submitted to polymn. through removal of acetic acid to give an electronic component sealant consisting of a copolymerized polyester consisting of structural units of formulas I-III (where R1 is at least one member of the groups selected from among those of formulas IV-IX; R2-3 are each at least one member of the groups selected from among those of formulas IV-VI and X; X is H, Cl), wherein the structural units I+II=77-95mol.%, the structural units III are 23-5mol.%, and the molar ratio of structural units I to II is 75/25-95/5, and having a melt viscosity of 10-5,000 P.

    POLYESTER RESIN COMPOSITION
    84.
    发明专利

    公开(公告)号:JPS62285947A

    公开(公告)日:1987-12-11

    申请号:JP12822586

    申请日:1986-06-04

    Abstract: PURPOSE:To provide the title compsn. having excellent adhesion, mechanical properties and particularly excellent impact resistance during a repeated heating- cooling cycle, by incorporating a copolymer having epoxy groups and a rubbery graft polymer in an arom. polyester. CONSTITUTION:100pts.wt. arom. polyester (A) having a relative viscosity of 1.15-2.0 (in a 0.5% o-chlorophenol soln. at 25 deg.C) (e.g., polybutylene terephthalate) is blended with 1-80pts.wt. copolymer (B) having epoxy groups and an MFR of 0.1-100g/10min, composed of 1-50wt% unsaturated monomer having an epoxy group, represented by the formula I, II or III (wherein R is a hydrocarbon group having an ethylenically unsaturated bond; X is CH2, O or a bivalent group of formula IV; and R' is H or CH3) and 99-50wt% unsaturated monomer (b) having no epoxy group and copolymerizable with the component (a) (e.g., an olefin) and 1-80pts.wt. rubbery graft polymer (C) having a glass transition temp. of not higher than -20 deg.C, obtd. by grafting a vinyl monomer such as an arom. vinyl compd. or a vinyl cyanide compd. to a base such as polybutadiene.

    POLY(ETHERESTER AMIDE) AND THERMOPLASTIC RESIN COMPOSITION

    公开(公告)号:JP2003268104A

    公开(公告)日:2003-09-25

    申请号:JP2002071526

    申请日:2002-03-15

    Abstract: PROBLEM TO BE SOLVED: To obtain a poly(etherester amide) excellent in productivity and an antistatic property, and to obtain a thermoplastic resin composition containing the same. SOLUTION: The poly(etherester amide) is obtained by polymerization of (a) a 6 or more-C aminocarboxylic acid or a 6 or more-C lactam or a totally 6 or more-C salt which is synthesized from a diamine and a dicarboxylic acid, (b) a diol having a specific structure and a number-average molecular weight of 1,600-3,000, (c) a poly(alkylene oxide) glycol having a number-average molecular weight of 1,000-3,000 and (d) a 4-20C dicarboxylic acid, and has a crystallization temperature of 100°C or higher; and the thermoplastic resin composition comprises this poly(etherester amide) and the thermoplastic resin. COPYRIGHT: (C)2003,JPO

    HEAT-RESISTANT COPOLYMER AND HEAT-RESISTANT THERMOPLASTIC RESIN COMPOSITION

    公开(公告)号:JP2003137937A

    公开(公告)日:2003-05-14

    申请号:JP2001341959

    申请日:2001-11-07

    Abstract: PROBLEM TO BE SOLVED: To provide a copolymer which has high degree heat resistance and does not foam, when molded, to provide a resin composition which comprises the copolymer and a rubber-reinforced polymer and has excellent mechanical strengths and moldability, to provide a resin which comprises the polymer and a transparent rubber-reinforced polymer and has excellent transparency, and to provide a molded article comprising the copolymer or one of the resin compositions. SOLUTION: This heat-resistant copolymer comprises unsaturated alkyl unsaturated carboxylate units, glutaric anhydride units represented by the general formula (1) (R and R are each identically or differently H or a 1 to 5C alkyl), and, if necessary, other monomer units, and does substantially not contain unsaturated carboxylic acid units in the copolymer.

    THERMOPLASTIC RESIN COMPOSITION AND ITS PRODUCTION METHOD

    公开(公告)号:JP2002256159A

    公开(公告)日:2002-09-11

    申请号:JP2001382521

    申请日:2001-12-17

    Abstract: PROBLEM TO BE SOLVED: To provide a thermoplastic resin composition which harmoniously excels in not only mechanical properties represented by modulus but also flowability, vibration-damping properties and the like. SOLUTION: The thermoplastic resin composition can be obtained by melt kneading (a) 100 pts.wt. thermoplastic resin excluding a polyphenylene sulfide resin with (b) 0.1-30 pts.wt. aromatic compound having a specific structure.

    THERMOPLASTIC RESIN
    88.
    发明专利

    公开(公告)号:JP2002201265A

    公开(公告)日:2002-07-19

    申请号:JP2000399546

    申请日:2000-12-27

    Abstract: PROBLEM TO BE SOLVED: To produce a thermoplastic resin that has improved storage elastic modulus by forming a hydrogen bond between the polymer chains through a heterocyclic amine derivative. SOLUTION: The thermoplastic resin having a secondary amino group in the main chain and/or a primary amino group at the end is produced by copolymerizing a heterocyclic amine derivative in the mode selected from (A)-(C) as follows: (A) the mode of copolymerizing in the main chain or at the end a heterocyclic amine derivative which contains two or more nitrogen atoms forming a heterocyclic ring; (B) the mode of copolymerizing at the end a heterocyclic amine derivative which contains one nitrogen atom forming a heterocyclic ring and has one functional group attached to the main skeleton; and (C) the mode of copolymerizing a heterocyclic amine derivative which contains one nitrogen atom forming a heterocyclic ring and has two functional groups attached to the main skeleton wherein at least one of the two functional groups is attached to an atom other than an atom next to a nitrogen atom forming a heterocyclic ring.

    POLYESTER RESIN COMPOSITION
    89.
    发明专利

    公开(公告)号:JP2002146169A

    公开(公告)日:2002-05-22

    申请号:JP2001261112

    申请日:2001-08-30

    Abstract: PROBLEM TO BE SOLVED: To obtain a polyester resin composition that has improved rate of crystallization, elastic modulus by forming the linking structure between the polymer chains through the hydrogen bonds. SOLUTION: The objective polyester resin composition characteristically comprises (A) a thermoplastic polyester resin bearing a functional group other than carbonyl group acting as a hydrogen bond acceptor and (B) a compound bearing two or more functional groups acting as a hydrogen bond donor.

    POLYESTER RESIN COMPOSITION
    90.
    发明专利

    公开(公告)号:JP2002060601A

    公开(公告)日:2002-02-26

    申请号:JP2001169603

    申请日:2001-06-05

    Abstract: PROBLEM TO BE SOLVED: To obtain a polyester resin composition improved in crystallization rate and modulus of elasticity by forming a connecting structure by a hydrogen bond between polymer chains. SOLUTION: The polyester resin composition comprises (A) a thermoplastic polyester resin bearing a functional group acting as a hydrogen bond donor and (B) a compound bearing in one molecule at least two functional groups acting as a hydrogen bond acceptor.

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