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    Microsystème électromécanique pouvant basculer entre deux positions stables
    83.
    发明公开
    Microsystème électromécanique pouvant basculer entre deux positions stables 有权
    Mikroelektromechanisches System mit zwei stableen Kipplagen

    公开(公告)号：EP1562207A1

    公开(公告)日：2005-08-10

    申请号：EP05290164.2

    申请日：2005-01-25

    Applicant: Stmicroelectronics SA

    Inventor： Bouche, Guillaume

    IPC: H01H1/00 ,  H01H59/00 ,  H01H50/00 ,  H01H5/18 ,  B81B3/00

    CPC classification number: B81B3/0054 ,  B81B2201/016 ,  H01G5/16 ,  H01H1/0036 ,  H01H50/005 ,  H01H57/00 ,  H01H59/0009 ,  H01H2001/0042 ,  H01H2057/006 ,  H01H2061/006 ,  Y10T307/74

    Abstract: Un microsystème électromécanique comprend des éléments conducteurs disjoints, un premier élément déformable électromécaniquement pouvant basculer entre une première et une deuxième positions stables, des éléments de contact permettant la continuité électrique entre les éléments conducteurs disjoints, et des éléments de commande de basculement assurant le basculement du premier élément déformable, de manière à établir une continuité électrique entre les éléments conducteurs disjoints dans la première position stable par contact entre les éléments de contacts et à rompre cette continuité électrique par espacement des éléments de contact dans ladite deuxième position stable. Les éléments conducteurs disjoints ainsi que les éléments de contacts sont portés par le premier élément déformable.

    Abstract translation: 该系统具有梁（111）和电阻单元（121,122,132），以确保梁（110）在打开位置和关闭位置之间的切换。 通过接触臂（151,152）之间的接触，在处于闭合位置的两个不相交的导体（141,142）之间建立电连续性，并且通过使臂处于打开位置而将连续性断开。 打开和关闭位置对应于梁的屈曲位置。

    MICROBRIDGE STRUCTURES FOR ULTRA-HIGH FREQUENCY MEM RESONATOR
    84.
    发明公开
    MICROBRIDGE STRUCTURES FOR ULTRA-HIGH FREQUENCY MEM RESONATOR 审中-公开
    超高频率下工作的MEM谐振器微电子结构桥

    公开(公告)号：EP1430599A2

    公开(公告)日：2004-06-23

    申请号：EP02768929.8

    申请日：2002-09-27

    Applicant: INTEL CORPORATION

    Inventor： CHENG, Peng ,  MA, Qing

    IPC: H03H9/24

    CPC classification number: B81B3/0078 ,  B81B2201/016 ,  B81B2203/019 ,  H03H3/0077 ,  H03H9/2463

    Abstract: A micro-electromechanical (MEM) resonator is described that includes a substrate, a microbridge beam structure coupled to the substrate and at least one electrode disposed adjacent to the microbridge beam structure to induce vibration of the beam. The microbridge beam structure includes support sections and a beam formed between the support sections. The center region of the beam has a mass that is less than the mass of regions of the beam adjacent to the support sections.

    A method of manufacturing an electronic device and electronic device
    89.
    发明公开
    A method of manufacturing an electronic device and electronic device 审中-公开
    一种用于生产电子器件和电子器件的工艺

    公开(公告)号：EP2444368A2

    公开(公告)日：2012-04-25

    申请号：EP12151592.8

    申请日：2004-10-26

    Applicant: Epcos AG

    Inventor： Van Beek, Jozef T. M. ,  Ulenaers, Mathieu J. E.

    IPC: B81B3/00 ,  B81C1/00

    CPC classification number: H01G5/18 ,  B81B3/0078 ,  B81B2201/016 ,  B81B2201/038 ,  B81B2203/04 ,  B81B2203/053 ,  H01H59/0009 ,  H01H2057/006 ,  H01H2239/01

    Abstract: A method of manufacturing a micro-electromechanical systems (MEMS) device, comprising providing a base layer (10) and a mechanical layer (12) on a substrate (14), providing a sacrificial layer (16) between the base layer (10) and the mechanical layer (12), providing an etch stop layer (18) between the sacrificial layer (16) and the substrate (14), and removing the sacrificial layer (16) by means of dry chemical etching, wherein the dry chemical etching is performed using a fluorine-containing plasma, and the etch stop layer (18) comprises a substantially non-conducting, fluorine chemistry inert material, such as Hf02, ZrO2, Al203 or TiO2

    Abstract translation: 一种制造微机电系统（MEMS）设备，包括：提供在衬底的基座层（10）和一个机械层（12）（14），提供所述基底层之间的牺牲层（16）的方法（10） 与机械层（12）提供在所述牺牲层（16）和基板（14），并去除由干式化学蚀刻的方式在牺牲层（16）之间的蚀刻停止层（18），所述worin干式化学蚀刻 使用含氟等离子体被执行，并且蚀刻停止层（18）包括基本上不导电，氟化学惰性材料，颜色：如的HfO 2，氧化锆，AL203或TiO

    MICROSYSTEME COMPORTANT UN PONT DEFORMABLE
    90.
    发明授权
    MICROSYSTEME COMPORTANT UN PONT DEFORMABLE 有权
    可变形桥MICROSYSTEMS

    公开(公告)号：EP1805100B1

    公开(公告)日：2011-10-05

    申请号：EP05857762.8

    申请日：2005-10-11

    Applicant: Commissariat à l'Énergie Atomique et aux Énergies Alternatives

    Inventor： CHARVET, Pierre-Louis

    IPC: B81B3/00

    CPC classification number: B81B3/0086 ,  B81B2201/016 ,  H01H59/0009

    Abstract: The invention relates to a microsystem comprising a deformable bridge (1), the ends (2) of which are connected to a substrate (3). According to the invention, at least one actuation electrode (6), which is solidly connected to the bridge (1), is disposed between the centre (C) of the bridge and one of the ends (2) next to a counter electrode (7) which is solidly connected to the substrate (3). The electrodes (6) are intended to deform the deformable bridge (1) such that a lower face of the bridge (1) comes into contact with a contact element (4) formed on the substrate (3). The actuation electrode (6) comprises, transversely to the bridge (1), a central zone (8) which is disposed on the bridge (1) and at least one projecting, flexible lateral flange (9). The lateral flange (9) can be connected to the central zone (8) by means of a narrower linking zone (10) which is disposed on the side of the flange (9) closest to the centre (C) of the bridge. Moreover, each actuation electrode (6) can comprise a pair of lateral flanges (9) which are disposed respectively on either side of the corresponding central zone (8).

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