EVALUATING APPARATUS FOR THERMAL BOUNDARY CONDUCTANCE USING ACOUSTIC PHONON WAVES

    公开(公告)号:US20240159658A1

    公开(公告)日:2024-05-16

    申请号:US18451672

    申请日:2023-08-17

    Abstract: The present disclosure relates to an apparatus for evaluating thermal conductance of an interface on the basis of how much the phases of acoustic phonons, which are produced in a semiconductor, change on a semiconductor interface. The apparatus for evaluating thermal conductance of a semiconductor interface according to an embodiment of the present disclosure includes: a spectrometer exciting acoustic phonons in a semiconductor by irradiating a laser beam to the semiconductor; and a processor evaluating thermal conductance of an interface of the semiconductor in accordance with a phase difference of a ascending acoustic phonon propagating toward the interface and reflecting from the interface and a descending acoustic phonon propagating in an opposite direction to the interface.

    SEMICONDUCTOR DEVICE INSPECTION APPARATUS AND METHOD OF DRIVING THE SAME

    公开(公告)号:US20180106731A1

    公开(公告)日:2018-04-19

    申请号:US15672696

    申请日:2017-08-09

    CPC classification number: G01N21/9501 G01N21/956 G01N21/95623 G01N2201/066

    Abstract: A semiconductor device inspecting apparatus includes a light source for emitting light to a semiconductor pattern. The semiconductor pattern includes a structure that reflects the light from the light source. The semiconductor device inspecting apparatus further includes an objective optical system disposed in a path of the reflected light from the semiconductor pattern, and a first noise filter disposed in a path of the reflected light having passed through the objective optical system, the first noise filter including at least one bar pattern that filters a diffraction noise of the light. The semiconductor device inspecting apparatus additionally includes a second noise filter disposed in a path of the filtered light from the first noise filter, the second noise filter including an outer frame surrounding a central portion. The semiconductor device inspecting apparatus further includes a first photodetector detecting the light having passed through the second noise filter.

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